School of Engineering

Showing 1-2 of 2 Results

  • Tiwei Wei

    Tiwei Wei

    Postdoctoral Research Fellow, Mechanical Engineering

    Current Research and Scholarly InterestsRESEARCH EXPERTISE
    ♦ Package/Chip Level Thermal Management
    Perform thermal and flow dynamics analysis for electronics cooling solutions;
    BEOL/Thin film thermal modeling and analysis;
    ♦ MEMS-based Microfluidic Cooling Device Demonstration
    Strong background in Microfluidic cooler design and fabrication using CAD design tools, CFD
    modeling, and semiconductor processing or additive manufacturing.
    ♦ 3D Electronic Packaging Development
    Thorough understanding of the Chip/Package Level and Wafer Level Processes development with 5
    years of cleanroom experience: 3D system integration, embedded packaging.
    ♦ Topology optimization for advanced manifold flow delivery system
    Perform code development for jet cooling manifold fluidic system