School of Engineering
Showing 201-210 of 310 Results
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Jordan Moore
Postdoctoral Scholar, Materials Science and Engineering
BioJordan Moore is currently a postdoctoral fellow at Stanford University, appointed in both the Departments of Materials Science & Engineering and Neurology. He earned his Ph.D. from The Ohio State University within the Department of Biomedical Engineering, where he was mentored by Dr. Daniel Gallego Perez. During his doctoral studies, Jordan's research primarily centered around the application of electroporation for gene delivery in vivo, with a specific focus on cell-reprogramming.
His work in his Ph.D. program aimed to address the restoration of blood flow to damaged peripheral nerves, contributing to the promotion of nerve regeneration and functional recovery. As a postdoctoral researcher, Jordan is currently co-mentored by Professor Sarah Heilshorn and Dr. Marion Buckwalter. In this role, he is dedicated to the development of innovative biomaterial-based platforms for gene and drug delivery. His research focuses on the treatment of stroke-related injuries and the prevention of cognitive decline. -
Kunal Mukherjee
Assistant Professor of Materials Science and Engineering
BioKunal Mukherjee is an assistant professor in Materials Science and Engineering at Stanford. He has been an assistant professor in the Materials department at UC Santa Barbara (2016-2020), held postdoctoral appointments at IBM TJ Watson Research Center (2016) and MIT (2015), and worked as a transceiver engineer at Finisar (2009-2010).
The Mukherjee group specializes in semiconductors that emit and detect light in the infrared. Our research enables better materials for data transmission, sensing, manufacturing, and environmental monitoring. We make high-quality thin films with IV-VI (PbSnSe) and III-V (GaAs-InAs/GaSb) material systems and spend much of our time understanding how imperfections in the crystalline structure such as dislocations and point defects impact their electronic and optical properties. This holds the key to directly integrating these semiconductors with silicon and germanium substrates for new hybrid circuits that combine infrared photonics and conventional electronics. -
William Nix
Lee Otterson Professor in the School of Engineering, Emeritus
BioI have been engaged in the study of mechanical properties of materials for nearly 50 years. My early work was on high temperature creep and fracture of metals, focusing on techniques for measuring internal back stresses in deforming metals and featuring the modeling of diffusional deformation and cavity growth processes. My students and I also studied high temperature dispersion strengthening mechanisms and described the effects of threshold stresses on these creep processes. Since the mid-1980's we have focused most of our attention on the mechanical properties of thin film materials used in microprocessors and related devices. We have developed many of the techniques that are now used to study of thin film mechanical properties, including nanoindentation, substrate curvature methods, bulge testing methods and the mechanical testing of micromachined (MEMS) structures. We are also known for our work on the mechanisms of strain relaxation in heteroepitaxial thin films and plastic deformation of thin metal films on substrates. In addition we have engaged in research on the growth, characterization and modeling of thin film microstructures, especially as they relate to the development of intrinsic stresses. Some of our recent work dealt with the mechanical properties of nanostructures and with strain gradients and size effects on the mechanical properties of crystalline materials. Our most recent work deals with the mechanical properties of lithiated nanostructures that are being considered for lithium-ion battery applications.
