All Publications


  • Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits Srimani, T., Radway, R. M., Kim, J., Prabhu, K., Rich, D., Gilardi, C., Raina, P., Shulaker, M., Lim, S., Mitra, S., IEEE IEEE. 2023
  • Testbench on a Chip: A Yield Test Vehicle for Resistive Memory Devices Upton, L. R., Lallement, G., Scott, M. D., Taylor, J., Radway, R. M., Rich, D., Nelson, M., Mitra, S., Murmann, B., IEEE IEEE. 2023: 576-582