Roger Howe
William E. Ayer Professor of Electrical Engineering, Emeritus
Bio
Design and fabrication of sensors and actuators using micro and nanotechnologies, with applications to information processing and energy conversion.
Academic Appointments
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Emeritus (Active) Professor, Electrical Engineering
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Member, Bio-X
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Member, Wu Tsai Neurosciences Institute
Administrative Appointments
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Acting Faculty Director, Stanford Nanofabrication Facility (2020 - 2021)
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Faculty Director, Stanford Nanofabrication Facility (2009 - 2017)
Boards, Advisory Committees, Professional Organizations
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Member, National Academy of Engineering (2005 - Present)
Professional Education
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PhD, UC Berkeley (1984)
2024-25 Courses
- An Intro to Making: What is EE
OSPBER 40M (Aut) - Introduction to Micro and Nano Electromechanical Systems
ENGR 240 (Win) -
Prior Year Courses
2023-24 Courses
- An Intro to Making: What is EE
OSPBER 40M (Aut, Win, Spr) - Introduction to Micro and Nano Electromechanical Systems
ENGR 240 (Win)
2022-23 Courses
- An Intro to Making: What is EE
OSPBER 40M (Aut, Win, Spr) - Integrated Circuit Fabrication Laboratory
EE 312 (Win) - Introduction to Micro and Nano Electromechanical Systems
ENGR 240 (Win)
2021-22 Courses
- Advanced Micro and Nano Fabrication Laboratory
ENGR 241 (Spr) - An Intro to Making: What is EE
OSPBER 40M (Spr) - Engineering the Micro and Nano Worlds: From Chips to Genes
EE 17N (Spr) - Introduction to Micro and Nano Electromechanical Systems
ENGR 240 (Win)
- An Intro to Making: What is EE
Stanford Advisees
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Doctoral Dissertation Reader (AC)
Jillian Anderson, Kai Chang, Seth Cordts, Jasmine Cox, Jennifer Jiang, Anand Lalwani, Wei Ren, Skyler Selvin, Mo Wu -
Master's Program Advisor
Stephanie Chang -
Doctoral (Program)
Michelle Hedlund, Zahra Heussen, Hannah Lee, Favour Nerrise, Allan Raventos Knohr, Luke Upton
All Publications
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"Deep approaches to learning" in a project-based nanofabrication graduate course
JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY
2022
View details for DOI 10.1002/jsid.1182
View details for Web of Science ID 000871256700001
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Optimized Deep Reactive-Ion Etching of Nanostructured Black Silicon for High-Contrast Optical Alignment Marks
ACS APPLIED NANO MATERIALS
2021; 4 (7): 7047-7061
View details for DOI 10.1021/acsanm.1c01070
View details for Web of Science ID 000677582900055
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Encapsulated Cell Dynamics in Droplet Microfluidic Devices with Sheath Flow.
Micromachines
2021; 12 (7)
Abstract
In this paper we study the dynamics of single cells encapsulated in water-in-oil emulsions in a microchannel. The flow field of a microfluidic channel is coupled to the internal flow field of a droplet through viscous traction at the interface, resulting in a rotational flow field inside the droplet. An encapsulated single cell being subjected to this flow field responds by undergoing multiple orbits, spins, and deformations that depend on its physical properties. Monitoring the cell dynamics, using a high-speed camera, can lead to the development of new label-free methods for the detection of rare cells, based on their biomechanical properties. A sheath flow microchannel was proposed to strengthen the rotational flow field inside droplets flowing in Poiseuille flow conditions. A numerical model was developed to investigate the effect of various parameters on the rotational flow field inside a droplet. The multi-phase flow model required the tracking of the fluid-fluid interface, which deforms over time due to the applied shear stresses. Experiments confirmed the significant effect of the sheath flow rate on the cell dynamics, where the speed of cell orbiting was doubled. Doubling the cell speed can double the amount of extracted biomechanical information from the encapsulated cell, while it remains within the field of view of the camera used.
View details for DOI 10.3390/mi12070839
View details for PubMedID 34357249
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Interpretable Classification of Bacterial Raman Spectra with Knockoff Wavelets.
IEEE journal of biomedical and health informatics
2021; PP
Abstract
Deep neural networks and other machine learning models are widely applied to biomedical signal data because they can detect complex patterns and compute accurate predictions. However, the difficulty of interpreting such models is a limitation, especially for applications involving high-stakes decision, including the identification of bacterial infections. This paper considers fast Raman spectroscopy data and demonstrates that a logistic regression model with carefully selected features achieves accuracy comparable to that of neural networks, while being much simpler and more transparent. Our analysis leverages wavelet features with intuitive chemical interpretations, and performs controlled variable selection with knockoffs to ensure the predictors are relevant and non-redundant. Although we focus on a particular data set, the proposed approach is broadly applicable to other types of signal data for which interpretability may be important.
View details for DOI 10.1109/JBHI.2021.3094873
View details for PubMedID 34232897
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Encapsulated Cell Dynamics in Droplet Microfluidic Devices with Sheath Flow
MICROMACHINES
2021; 12 (7)
View details for DOI 10.3390/mi12070839
View details for Web of Science ID 000676672700001
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Modeling of Droplet Generation in a Microfluidic Flow-Focusing Junction for Droplet Size Control.
Micromachines
2021; 12 (6)
Abstract
In this paper, we study the parameters that affect the generation of droplets in a microfluidic flow-focusing junction. Droplets are evaluated based on the size and frequency of generation. Droplet size control is essential for microfluidic lab-on-a-chip applications in biology, chemistry, and medicine. We developed a three-dimensional numerical model that can emulate the performance of the physical system. A numerical model can help design droplet-generation chips with new junction geometries, different dispersed and continuous phase types, and different flow rates. Our model uses a conservative level-set method (LSM) to track the interface between two immiscible fluids using a fixed mesh. Water was used for the dispersed phase and mineral oil for the continuous phase. The effects of the continuous-to-dispersed flow rate ratio (Qo/Qw) and the surfactant concentration on the droplet generation were studied both using the numerical model and experimentally. The numerical model was found to render results that are in good agreement with the experimental ones, which validates the LSM model. The validated numerical model was used to study the time effect of changing Qo/Qw on the generated droplet size. Properly timing when the flow rates are changed enables control over the size of the next generated droplet, which is useful for single-droplet size modulation applications.
View details for DOI 10.3390/mi12060590
View details for PubMedID 34063839
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Electropermanent magnet-driven droplet size modulation for two-phase ferromicrofluidics
MICROFLUIDICS AND NANOFLUIDICS
2020; 24 (12)
View details for DOI 10.1007/s10404-020-02398-4
View details for Web of Science ID 000585128100001
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A vibrating beam MEMS accelerometer for gravity and seismic measurements.
Scientific reports
2020; 10 (1): 10415
Abstract
This paper introduces a differential vibrating beam MEMS accelerometer demonstrating excellent long-term stability for applications in gravimetry and seismology. The MEMS gravimeter module demonstrates an output Allan deviation of 9 muGal for a 1000s integration time, a noise floor of 100 muGal/Hz, and measurement over the full ±1g dynamic range (1g=9.81ms-2). The sensitivity of the device is demonstrated through the tracking of Earth tides and recording of ground motion corresponding to a number of teleseismic events over several months. These results demonstrate that vibrating beam MEMS accelerometers can be employed for measurements requiring high levels of stability and resolution with wider implications for precision measurement employing other resonant-output MEMS devices such as gyroscopes and magnetometers.
View details for DOI 10.1038/s41598-020-67046-x
View details for PubMedID 32591608
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Neural network-based model of photoresist reflow
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2019; 37 (6)
View details for DOI 10.1116/1.5116857
View details for Web of Science ID 000522021700022
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Surface Photovoltage-Induced Ultralow Work Function Material for Thermionic Energy Converters
ACS ENERGY LETTERS
2019; 4 (10): 2436–43
Abstract
Low work function materials are essential for efficient thermionic energy converters (TECs), electronics, and electron emission devices. Much effort has been put into finding thermally stable material combinations that exhibit low work functions. Submonolayer coatings of alkali metals have proven to significantly reduce the work function; however, a work function less than 1 eV has not been reached. We report a record-low work function of 0.70 eV by inducing a surface photovoltage (SPV) in an n-type semiconductor with an alkali metal coating. Ultraviolet photoelectron spectroscopy indicates a work function of 1.06 eV for cesium/oxygen-activated GaAs consistent with density functional theory model predictions. By illuminating with a 532 nm laser we induce an additional shift down to 0.70 eV due to the SPV. Further, we apply the SPV to the collector of an experimental TEC and demonstrate an I-V curve shift consistent with the collector work function reduction. This method opens an avenue toward efficient TECs and next-generation electron emission devices.
View details for DOI 10.1021/acsenergylett.9b01214
View details for Web of Science ID 000490365500011
View details for PubMedID 31633034
View details for PubMedCentralID PMC6792473
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Anomalous hysteresis and current fluctuations in cyclic voltammograms at microelectrodes due to Ag leaching from Ag/AgCl reference electrodes
ELECTROCHEMISTRY COMMUNICATIONS
2019; 105
View details for DOI 10.1016/j.elecom.2019.106499
View details for Web of Science ID 000484833800013
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ALD HfO2 Films for Defining Microelectrodes for Electrochemical Sensing and Other Applications
ACS APPLIED MATERIALS & INTERFACES
2019; 11 (29): 26082–92
Abstract
Microelectrodes are used in a wide range of applications from analytical electrochemistry and biomolecular sensing to in vivo implants. While a variety of insulating materials have been used to define the microelectrode active area, most are not suitable for nanoscale electrodes (<1 μm2) due to the limited robustness of these films when the film thickness is on the order of the nanoelectrode dimension. In this study, we investigate atomic layer deposited hafnium dioxide (ALD HfO2) as an insulating film to coat planar platinum microelectrodes, with the active areas being defined where the HfO2 is etched. Thermally grown films with thicknesses between 10 and 60 nm were deposited by 100 to 550 ALD cycles and were initially characterized by measuring their standard electrical properties and imaging incipient texture development. Electrochemical measurements on the structures were made, including linear sweep voltammetry and electrochemical impedance spectroscopy, which identified the presence of pinholes in films deposited over the range of 100 to 350 cycles, resulting in leakage. These measurements also suggest a lower limit to the size of microelectrodes below which the electrochemical current detected is no longer dominated by that through the exposed active area. A bilayer insulator comprising ALD HfO2 coated with parylene-C was investigated to minimize the pinhole leakage. Steady-state currents were measured for different electrode areas, qualitatively agreeing with the theory for areas down to ∼1 μm2. For sub-square micrometer electrode areas, bilayer-insulated devices with parylene-C apertures that exposed the smallest microelectrode area showed measured currents that were consistent with extrapolations, indicating that it reduces leakage through HfO2.
View details for DOI 10.1021/acsami.9b06891
View details for Web of Science ID 000477787200048
View details for PubMedID 31305057
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Micron-gap spacers with ultrahigh thermal resistance and mechanical robustness for direct energy conversion.
Microsystems & nanoengineering
2019; 5: 31
Abstract
In thermionic energy converters, the absolute efficiency can be increased up to 40% if space-charge losses are eliminated by using a sub-10-µm gap between the electrodes. One practical way to achieve such small gaps over large device areas is to use a stiff and thermally insulating spacer between the two electrodes. We report on the design, fabrication and characterization of thin-film alumina-based spacers that provided robust 3-8 μm gaps between planar substrates and had effective thermal conductivities less than those of aerogels. The spacers were fabricated on silicon molds and, after release, could be manually transferred onto any substrate. In large-scale compression testing, they sustained compressive stresses of 0.4-4 MPa without fracture. Experimentally, the thermal conductance was 10-30 mWcm-2K-1 and, surprisingly, independent of film thickness (100-800 nm) and spacer height. To explain this independence, we developed a model that includes the pressure-dependent conductance of locally distributed asperities and sparse contact points throughout the spacer structure, indicating that only 0.1-0.5% of the spacer-electrode interface was conducting heat. Our spacers show remarkable functionality over multiple length scales, providing insulating micrometer gaps over centimeter areas using nanoscale films. These innovations can be applied to other technologies requiring high thermal resistance in small spaces, such as thermophotovoltaic converters, insulation for spacecraft and cryogenic devices.
View details for DOI 10.1038/s41378-019-0071-4
View details for PubMedID 31636923
View details for PubMedCentralID PMC6799816
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Micron-gap spacers with ultrahigh thermal resistance and mechanical robustness for direct energy conversion
MICROSYSTEMS & NANOENGINEERING
2019; 5
View details for DOI 10.1038/s41378-019-0071-4
View details for Web of Science ID 000477598700001
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Quantum Tunneling Currents in a Nanoengineered Electrochemical System
JOURNAL OF PHYSICAL CHEMISTRY C
2017; 121 (28): 15085–105
View details for DOI 10.1021/acs.jpcc.7b04350
View details for Web of Science ID 000406355700012
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Three-dimensional integration of nanotechnologies for computing and data storage on a single chip
NATURE
2017; 547 (7661): 74-+
Abstract
The computing demands of future data-intensive applications will greatly exceed the capabilities of current electronics, and are unlikely to be met by isolated improvements in transistors, data storage technologies or integrated circuit architectures alone. Instead, transformative nanosystems, which use new nanotechnologies to simultaneously realize improved devices and new integrated circuit architectures, are required. Here we present a prototype of such a transformative nanosystem. It consists of more than one million resistive random-access memory cells and more than two million carbon-nanotube field-effect transistors-promising new nanotechnologies for use in energy-efficient digital logic circuits and for dense data storage-fabricated on vertically stacked layers in a single chip. Unlike conventional integrated circuit architectures, the layered fabrication realizes a three-dimensional integrated circuit architecture with fine-grained and dense vertical connectivity between layers of computing, data storage, and input and output (in this instance, sensing). As a result, our nanosystem can capture massive amounts of data every second, store it directly on-chip, perform in situ processing of the captured data, and produce 'highly processed' information. As a working prototype, our nanosystem senses and classifies ambient gases. Furthermore, because the layers are fabricated on top of silicon logic circuitry, our nanosystem is compatible with existing infrastructure for silicon-based technologies. Such complex nano-electronic systems will be essential for future high-performance and highly energy-efficient electronic systems.
View details for PubMedID 28682331
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Back-end-of-line compatible Poly-SiGe lateral nanoelectromechanical relays with multi-level interconnect
SPRINGER. 2017: 2125–30
View details for DOI 10.1007/s00542-016-2932-1
View details for Web of Science ID 000401630800052
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Back-gated graphene anode for more efficient thermionic energy converters
NANO ENERGY
2017; 32: 67-72
View details for DOI 10.1016/j.nanoen.2016.12.027
View details for Web of Science ID 000397003700009
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Active control of probability amplitudes in a mesoscale system via feedback-induced suppression of dissipation and noise
JOURNAL OF APPLIED PHYSICS
2016; 120 (22)
View details for DOI 10.1063/1.4971867
View details for Web of Science ID 000391535900013
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A Super Stretchable Organic Thin-Film Diodes Network That Can Be Embedded Into Carbon Fiber Composite Materials for Sensor Network Applications
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2016; 25 (3): 524-532
View details for DOI 10.1109/JMEMS.2016.2538788
View details for Web of Science ID 000377372900013
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Electropermanent magnet actuation for droplet ferromicrofluidics.
Technology
2016; 4 (2): 110-119
Abstract
Droplet actuation is an essential mechanism for droplet-based microfluidic systems. On-demand electromagnetic actuation is used in a ferrofluid-based microfluidic system for water droplet displacement. Electropermanent magnets (EPMs) are used to induce 50 mT magnetic fields in a ferrofluid filled microchannel with gradients up to 6.4 × 10(4) kA/m(2). Short 50 µs current pulses activate the electropermanent magnets and generate negative magnetophoretic forces that range from 10 to 70 nN on 40 to 80 µm water-in-ferrofluid droplets. Maximum droplet displacement velocities of up to 300 µm/s are obtained under flow and no-flow conditions. Electropermanent magnet-activated droplet sorting under continuous flow is demonstrated using a split-junction microfluidic design.
View details for PubMedID 27583301
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Design and fabrication of silicon-tessellated structures for monocentric imagers.
Microsystems & nanoengineering
2016; 2: 16019
Abstract
Compared with conventional planar optical image sensors, a curved focal plane array can simplify the lens design and improve the field of view. In this paper, we introduce the design and implementation of a segmented, hemispherical, CMOS-compatible silicon image plane for a 10-mm diameter spherical monocentric lens. To conform to the hemispherical focal plane of the lens, we use flexible gores that consist of arrays of spring-connected silicon hexagons. Mechanical functionality is demonstrated by assembling the 20-μm-thick silicon gores into a hemispherical test fixture. We have also fabricated and tested a photodiode array on a silicon-on-insulator substrate for use with the curved imager. Optical testing shows that the fabricated photodiodes achieve good performance; the hemispherical imager enables a compact 160 ° field of view camera with >80% fill factor using a single spherical lens.
View details for DOI 10.1038/micronano.2016.19
View details for PubMedID 31057822
View details for PubMedCentralID PMC6444745
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Design and fabrication of silicon-tessellated structures for monocentric imagers
MICROSYSTEMS & NANOENGINEERING
2016; 2
View details for DOI 10.1038/micronano.2016.19
View details for Web of Science ID 000394942200001
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Stable Encapsulated Charge-Biased Resonators
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2016; 25 (1): 30-37
View details for DOI 10.1109/JMEMS.2015.2483365
View details for Web of Science ID 000370763900003
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Engineering Ultra-Low Work Function of Graphene
NANO LETTERS
2015; 15 (10): 6475-6480
Abstract
Low work function materials are critical for energy conversion and electron emission applications. Here, we demonstrate for the first time that an ultralow work function graphene is achieved by combining electrostatic gating with a Cs/O surface coating. A simple device is built from large-area monolayer graphene grown by chemical vapor deposition, transferred onto 20 nm HfO2 on Si, enabling high electric fields capacitive charge accumulation in the graphene. We first observed over 0.7 eV work function change due to electrostatic gating as measured by scanning Kelvin probe force microscopy and confirmed by conductivity measurements. The deposition of Cs/O further reduced the work function, as measured by photoemission in an ultrahigh vacuum environment, which reaches nearly 1 eV, the lowest reported to date for a conductive, nondiamond material.
View details for DOI 10.1021/acs.nanolett.5b01916
View details for PubMedID 26401728
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Thermionic and photon-enhanced emission energy conversion
AMER CHEMICAL SOC. 2015
View details for Web of Science ID 000432475703009
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Partitioning Electrostatic and Mechanical Domains in Nanoelectromechanical Relays
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2015; 24 (3): 592-598
View details for DOI 10.1109/JMEMS.2014.2335157
View details for Web of Science ID 000356520200015
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Tunable control of antibody immobilization using electric field.
Proceedings of the National Academy of Sciences of the United States of America
2015; 112 (7): 1995-1999
Abstract
The controlled immobilization of proteins on solid-state surfaces can play an important role in enhancing the sensitivity of both affinity-based biosensors and probe-free sensing platforms. Typical methods of controlling the orientation of probe proteins on a sensor surface involve surface chemistry-based techniques. Here, we present a method of tunably controlling the immobilization of proteins on a solid-state surface using electric field. We study the ability to orient molecules by immobilizing IgG molecules in microchannels while applying lateral fields. We use atomic force microscopy to both qualitatively and quantitatively study the orientation of antibodies on glass surfaces. We apply this ability for controlled orientation to enhance the performance of affinity-based assays. As a proof of concept, we use fluorescence detection to indirectly verify the modulation of the orientation of proteins bound to the surface. We studied the interaction of fluorescently tagged anti-IgG with surface immobilized IgG controlled by electric field. Our study demonstrates that the use of electric field can result in more than 100% enhancement in signal-to-noise ratio compared with normal physical adsorption.
View details for DOI 10.1073/pnas.1424592112
View details for PubMedID 25650429
View details for PubMedCentralID PMC4343132
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Integrated atomistic chemical imaging and reactive force field molecular dynamic simulations on silicon oxidation
APPLIED PHYSICS LETTERS
2015; 106 (1)
View details for DOI 10.1063/1.4905442
View details for Web of Science ID 000347976900008
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Polyether Ether Ketone (PEEK) Fluidic Cell to Study Electrochemistry of Microelectrodes on Silicon Substrate
ECS SOLID STATE LETTERS
2015; 4 (10): P67-P71
View details for DOI 10.1149/2.0021510ssI
View details for Web of Science ID 000361272100001
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Microfabricated Thermally Isolated Low Work-Function Emitter
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2014; 23 (5): 1182-1187
View details for DOI 10.1109/JMEMS.2014.2307882
View details for Web of Science ID 000343318500019
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Inherent Enhancement of Electronic Emission from Hexaboride Heterostructure
PHYSICAL REVIEW APPLIED
2014; 2 (2)
View details for DOI 10.1103/PhysRevApplied.2.024004
View details for Web of Science ID 000344331500001
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Improved Performance of Bottom-Contact Organic Thin-Film Transistor Using Al Doped HfO2 Gate Dielectric
IEEE TRANSACTIONS ON ELECTRON DEVICES
2014; 61 (7): 2398-2403
View details for DOI 10.1109/TED.2014.2325042
View details for Web of Science ID 000338027200024
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Optical MEMS: From Micromirrors to Complex Systems
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2014; 23 (3): 517-538
View details for DOI 10.1109/JMEMS.2014.2319266
View details for Web of Science ID 000337128200007
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DFT Study of Atomically-Modified Alkali-Earth Metal Oxide Films on Tungsten
JOURNAL OF PHYSICAL CHEMISTRY C
2014; 118 (21): 11303-11309
View details for DOI 10.1021/jp4120578
View details for Web of Science ID 000336771700017
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Double-Layer Silicon Photonic Crystal Fiber-Tip Temperature Sensors
IEEE PHOTONICS TECHNOLOGY LETTERS
2014; 26 (9): 900-903
View details for DOI 10.1109/LPT.2014.2309345
View details for Web of Science ID 000335819300003
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Depletion of cells and abundant proteins from biological samples by enhanced dielectrophoresis
17th International Conference on Solid-State Sensors, Actuators and Microsystems
ELSEVIER SCIENCE SA. 2014: 918–24
Abstract
Platforms that are sensitive and specific enough to assay low-abundance protein biomarkers, in a high throughput multiplex format, within a complex biological fluid specimen, are necessary to enable protein biomarker based diagnostics for diseases such as cancer. The signal from an assay for a low-abundance protein biomarker in a biological fluid sample like blood is typically buried in a background that arises from the presence of blood cells and from high-abundance proteins that make up 90% of the assayed protein mass. We present an automated on-chip platform for the depletion of cells and highly abundant serum proteins in blood. Our platform consists of two components, the first of which is a microfluidic mixer that mixes beads containing antibodies against the highly abundant proteins in the whole blood. This complex mixture (consisting of beads, cells, and serum proteins) is then injected into the second component of our microfluidic platform, which comprises a filter trench to capture all the cells and the beads. The size-based trapping of the cells and beads into the filter trench is significantly enhanced by leveraging additional negative dielectrophoretic forces to push the micron sized particles (cells and beads which have captured the highly abundant proteins) down into the trench, allowing the serum proteins of lower abundance to flow through. In general, dielectrophoresis using bare electrodes is incapable of producing forces beyond the low piconewton range that tend to be insufficient for separation applications. However, by using electrodes passivated with atomic layer deposition, we demonstrate the application of enhanced negative DEP electrodes together with size-based flltration induced by the filter trench, to deplete 100% of the micron sized particles in the mixture.
View details for DOI 10.1016/j.snb.2013.11.100
View details for Web of Science ID 000330113600128
View details for PubMedCentralID PMC4765371
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STABLE CHARGE-BIASED CAPACITIVE RESONATORS WITH ENCAPSULATED SWITCHES
IEEE. 2014: 1277–80
View details for Web of Science ID 000352217500325
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Analysis of Asperity Dominated Contacts in Nanoelectromechanical Relays Using Thin Films
IEEE. 2014: 1256–60
View details for Web of Science ID 000366567000168
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Vacuum encapsulated resonators for humidity measurement
SENSORS AND ACTUATORS B-CHEMICAL
2013; 185: 575-581
View details for DOI 10.1016/j.snb.2013.05.016
View details for Web of Science ID 000321509600077
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Laterally Actuated Platinum-Coated Polysilicon NEM Relays
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2013; 22 (3): 768-778
View details for DOI 10.1109/JMEMS.2013.2244779
View details for Web of Science ID 000319827700029
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Thermionic current densities from first principles.
journal of chemical physics
2013; 138 (20): 204701-?
Abstract
We present a density functional theory-based method for calculating thermionic emission currents from a cathode into vacuum using a non-equilibrium Green's function approach. It does not require semi-classical approximations or crude simplifications of the electronic structure used in previous methods and thus provides quantitative predictions of thermionic emission for adsorbate-coated surfaces. The obtained results match well with experimental measurements of temperature-dependent current densities. Our approach can thus enable computational design of composite electrode materials.
View details for DOI 10.1063/1.4805002
View details for PubMedID 23742494
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Thermionic current densities from first principles.
journal of chemical physics
2013; 138 (20): 204701-?
View details for DOI 10.1063/1.4805002
View details for PubMedID 23742494
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Combinational Logic Design Using Six-Terminal NEM Relays
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
2013; 32 (5): 653-666
View details for DOI 10.1109/TCAD.2012.2232707
View details for Web of Science ID 000318163800001
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Photon-enhanced thermionic emission from heterostructures with low interface recombination.
Nature communications
2013; 4: 1576-?
Abstract
Photon-enhanced thermionic emission is a method of solar-energy conversion that promises to combine photon and thermal processes into a single mechanism, overcoming fundamental limits on the efficiency of photovoltaic cells. Photon-enhanced thermionic emission relies on vacuum emission of photoexcited electrons that are in thermal equilibrium with a semiconductor lattice, avoiding challenging non-equilibrium requirements and exotic material properties. However, although previous work demonstrated the photon-enhanced thermionic emission effect, efficiency has until now remained very low. Here we describe electron-emission measurements on a GaAs/AlGaAs heterostructure that introduces an internal interface, decoupling the basic physics of photon-enhanced thermionic emission from the vacuum emission process. Quantum efficiencies are dramatically higher than in previous experiments because of low interface recombination and are projected to increase another order of magnitude with more stable, low work-function coatings. The results highlight the effectiveness of the photon-enhanced thermionic emission process and demonstrate that efficient photon-enhanced thermionic emission is achievable, a key step towards realistic photon-enhanced thermionic emission based energy conversion.
View details for DOI 10.1038/ncomms2577
View details for PubMedID 23481384
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SUB-10 NANOMETER UNCOOLED PLATINUM BOLOMETERS VIA PLASMA ENHANCED ATOMIC LAYER DEPOSITION
IEEE. 2013: 185–88
View details for Web of Science ID 000320549200048
- Dual-beam six-terminal nanoelectromechanical relays 2013
- Engineering an electrochemical sensor for the characterization of bond vibration frequencies of a chemical analyte. 2013
- Serpentine geometry for enhanced performance of nanometer-thin platinum bolometers 2013
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Photon-enhanced thermionic emission from heterostructures with low interface recombination.
Nature communications
2013; 4: 1576-?
Abstract
Photon-enhanced thermionic emission is a method of solar-energy conversion that promises to combine photon and thermal processes into a single mechanism, overcoming fundamental limits on the efficiency of photovoltaic cells. Photon-enhanced thermionic emission relies on vacuum emission of photoexcited electrons that are in thermal equilibrium with a semiconductor lattice, avoiding challenging non-equilibrium requirements and exotic material properties. However, although previous work demonstrated the photon-enhanced thermionic emission effect, efficiency has until now remained very low. Here we describe electron-emission measurements on a GaAs/AlGaAs heterostructure that introduces an internal interface, decoupling the basic physics of photon-enhanced thermionic emission from the vacuum emission process. Quantum efficiencies are dramatically higher than in previous experiments because of low interface recombination and are projected to increase another order of magnitude with more stable, low work-function coatings. The results highlight the effectiveness of the photon-enhanced thermionic emission process and demonstrate that efficient photon-enhanced thermionic emission is achievable, a key step towards realistic photon-enhanced thermionic emission based energy conversion.
View details for DOI 10.1038/ncomms2577
View details for PubMedID 23481384
- Ultra-thin atomic layer deposition films for corrosion resistance 2013
- Immobilization of antibodies on solid-state surfaces with controlled orientation using electric field 2013
- Three stage sample preparation for purificaiton of proteins from complex biological samples IEEE Sensors 2013, Baltimore, Maryland 2013: 1-4
- Applications of nanonewton dielectrophoresis forces using atomic layer deposted oxides for microfluidic sample preparation and proteomics 2013
- Ultra dielectrophoresis: electrothermal analysis and its applications in microfluidic sample preparation and proteomics 2013
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Capacitive Accelerometer Laboratory Using Polymer-Film Rapid Prototyping Technology
3rd Interdisciplinary Engineering Design Education Conference (IEDEC)
IEEE. 2013: 79–82
View details for Web of Science ID 000325586800016
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Microbead-separated thermionic energy converter with enhanced emission current
PHYSICAL CHEMISTRY CHEMICAL PHYSICS
2013; 15 (34): 14442-14446
Abstract
The efficiency of thermionic energy converters is a strong function of the inter-electrode separation due to space-charge limitations. Here we demonstrate vacuum thermionic energy converters constructed using barium dispenser cathodes and thin film tungsten anodes, separated by size specific alumina microbeads for simple device fabrication and inter-electrode gap control. The current and device efficiency at the maximum power point are strongly dependent on the inter-electrode gap, with a maximum device efficiency of 0.61% observed for a gap on the order of 5 μm. Paths to further reductions in space charge and improved anode work function are outlined with potential for over an order of magnitude improvement in output power and efficiency.
View details for DOI 10.1039/c3cp52895b
View details for Web of Science ID 000322725000036
View details for PubMedID 23881241
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LATERALLY ACTUATED NANOELECTROMECHANICAL RELAYS WITH COMPLIANT, LOW RESISTANCE CONTACT
26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2013: 520–523
View details for Web of Science ID 000320549200133
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An orbital-overlap model for minimal work functions of cesiated metal surfaces
JOURNAL OF PHYSICS-CONDENSED MATTER
2012; 24 (44)
Abstract
We introduce a model for the effect of cesium adsorbates on the work function of transition metal surfaces. The model builds on the classical point-dipole equation by adding exponential terms that characterize the degree of orbital overlap between the 6s states of neighboring cesium adsorbates and its effect on the strength and orientation of electric dipoles along the adsorbate-substrate interface. The new model improves upon earlier models in terms of agreement with the work function-coverage curves obtained via first-principles calculations based on density functional theory. All the cesiated metal surfaces have optimal coverages between 0.6 and 0.8 monolayers, in accordance with experimental data. Of all the cesiated metal surfaces that we have considered, tungsten has the lowest minimum work function, also in accordance with experiments.
View details for DOI 10.1088/0953-8984/24/44/445007
View details for Web of Science ID 000310571100009
View details for PubMedID 23018485
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A model for emission yield from planar photocathodes based on photon-enhanced thermionic emission or negative-electron-affinity photoemission
JOURNAL OF APPLIED PHYSICS
2012; 112 (9)
View details for DOI 10.1063/1.4764106
View details for Web of Science ID 000311968400139
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Control of DNA Capture by Nanofluidic Transistors
ACS NANO
2012; 6 (8): 6767-6775
Abstract
We report the use of an array of electrically gated ~200 nm solid-state pores as nanofluidic transistors to manipulate the capture and passage of DNA. The devices are capable of reversibly altering the rate of DNA capture by over 3 orders of magnitude using sub-1 V biasing of a gate electrode. This efficient gating originates from the counter-balance of electrophoresis and electroosmosis, as revealed by quantitative numerical simulations. Such a reversible electronically tunable biomolecular switch may be used to manipulate nucleic acid delivery in a fluidic circuit, and its development is an important first step toward active control of DNA motion through solid-state nanopores for sensing applications.
View details for DOI 10.1021/nn3014917
View details for Web of Science ID 000307988900029
View details for PubMedID 22762282
View details for PubMedCentralID PMC3429714
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Microencapsulation of silicon cavities using a pulsed excimer laser
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2012; 22 (7)
View details for DOI 10.1088/0960-1317/22/7/075012
View details for Web of Science ID 000305890600026
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Smart-cut layer transfer of single-crystal SiC using spin-on-glass
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2012; 30 (4)
View details for DOI 10.1116/1.4734006
View details for Web of Science ID 000306750700046
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Single crystal silicon nanopillars, nanoneedles and nanoblades with precise positioning for massively parallel nanoscale device integration
NANOTECHNOLOGY
2012; 23 (22)
Abstract
Arrays of precisely positioned single crystal silicon nanopillars, nanoneedles, and nanoblades with minimum feature sizes as small as 30 nm are fabricated using entirely scalable top-down fabrication techniques. Using the same scalable technologies, devices consisting of electrically connected silicon nanopillars with multiple addressable electrodes for each nanostructure are realized. The arrays of nanopillars, nanoneedles, and nanoblades are shown to exhibit Raman signal enhancement on 1,2-benzenedithiol monolayers, opening a path to nanodevices that manipulate, position, detect and analyze molecules.
View details for DOI 10.1088/0957-4484/23/22/225303
View details for Web of Science ID 000305160300005
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A dry wafer-reconstitution process with zero insertion force by embedded alignment guide tabs
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2012; 22 (6)
View details for DOI 10.1088/0960-1317/22/6/065007
View details for Web of Science ID 000304609600007
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A micromachining-based technology for enhancing germanium light emission via tensile strain
NATURE PHOTONICS
2012; 6 (6): 398-405
View details for DOI 10.1038/NPHOTON.2012.111
View details for Web of Science ID 000304598200018
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Optimal emitter-collector gap for thermionic energy converters
APPLIED PHYSICS LETTERS
2012; 100 (17)
View details for DOI 10.1063/1.4707379
View details for Web of Science ID 000303340300106
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Application of principal component analysis to a full profile correlative analysis of FTIR spectra
SURFACE AND INTERFACE ANALYSIS
2012; 44 (3): 365-371
View details for DOI 10.1002/sia.3813
View details for Web of Science ID 000303250500014
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Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness
NANO LETTERS
2012; 12 (2): 683-686
Abstract
While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.
View details for DOI 10.1021/nl203548w
View details for PubMedID 22224582
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Integration of Nanoelectromechanical Relays With Silicon nMOS
IEEE TRANSACTIONS ON ELECTRON DEVICES
2012; 59 (1): 255-258
View details for DOI 10.1109/TED.2011.2172946
View details for Web of Science ID 000298756100038
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Nano-Electro-Mechanical Relays for FPGA Routing: Experimental Demonstration and a Design Technique
IEEE. 2012: 1361–66
View details for Web of Science ID 000415126300278
- CVD hafnium diboride as a contact material for nano-electromechanical switches 2012
- Nano-electro-mechanical relays for FPGA routing: experimental demonstration and a design technique 2012
- Encapsulated thermionic energy converter with stiffened suspension 2012
- Sidewall silicon carbide emitters for terahertz vacuum electronics 2012
- Electrochemical quantum tunneling for electronic detection and characterization of biological toxins 2012
- Multiband charge-coupled device 2012
- Smart-cut layer transfer of single-crystal SiC using spin-on-glass J. Vacuum Sci. Tech. B: Microelectronics and Nanometer Structures 2012; 30: 42001
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Multiband Charge-Coupled Device
IEEE Nuclear Science Symposium / Medical Imaging Conference Record (NSS/MIC) / 19th Room-Temperature Semiconductor X-ray and Gamma-ray Detector Workshop
IEEE. 2012: 743–746
View details for Web of Science ID 000326814200155
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Electrochemical quantum tunneling for electronic detection and characterization of biological toxins
Conference on Micro- and Nanotechnology Sensors, Systems, and Applications IV
SPIE-INT SOC OPTICAL ENGINEERING. 2012
View details for DOI 10.1117/12.920692
View details for Web of Science ID 000306560400002
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Nano-Electro-Mechanical (NEM) Relays and their Application to FPGA Routing
17th Asia and South Pacific Design Automation Conference (ASP-DAC)
IEEE. 2012: 639–639
View details for Web of Science ID 000309240000115
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MICROFABRICATED SILICON CARBIDE THERMIONIC ENERGY CONVERTER FOR SOLAR ELECTRICITY GENERATION
25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2012
View details for Web of Science ID 000312912800317
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Electrical Properties of CuPc-based OTFTs with Atomic Layer Deposited HfAlO Gate Dielectric
8th IEEE International Conference on Electron Devices and Solid State Circuit (EDSSC)
IEEE. 2012
View details for Web of Science ID 000318549000101
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Double-Layer Silicon Photonic Crystal Fiber Tip Temperature Sensor
25th IEEE Photonics Conference (IPC)
IEEE. 2012: 550–551
View details for Web of Science ID 000312865000274
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Photonic Crystal Fiber Tip Sensor for High-Temperature Measurement
IEEE SENSORS JOURNAL
2011; 11 (11): 2643-2648
View details for DOI 10.1109/JSEN.2011.2153844
View details for Web of Science ID 000304162300004
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Tensile-strained germanium-on-insulator substrate fabrication for silicon-compatible optoelectronics
OPTICAL MATERIALS EXPRESS
2011; 1 (6): 1121-1126
View details for Web of Science ID 000299048700007
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Multilayered Monolithic Silicon Photonic Crystals
IEEE PHOTONICS TECHNOLOGY LETTERS
2011; 23 (11): 730-732
View details for DOI 10.1109/LPT.2011.2132698
View details for Web of Science ID 000290629800008
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Highly Sensitive Monolithic Silicon Photonic Crystal Fiber Tip Sensor for Simultaneous Measurement of Refractive Index and Temperature
JOURNAL OF LIGHTWAVE TECHNOLOGY
2011; 29 (9): 1367-1374
View details for DOI 10.1109/JLT.2011.2126018
View details for Web of Science ID 000289802300007
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AC Polarization for Charge-Drift Elimination in Resonant Electrostatic MEMS and Oscillators
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2011; 20 (2): 355-364
View details for DOI 10.1109/JMEMS.2010.2100027
View details for Web of Science ID 000289205400002
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Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators with Integrated Actuation Electrodes
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2011; 1 (3): 310-317
View details for DOI 10.1109/TCPMT.2010.2100711
View details for Web of Science ID 000292780700004
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Electromechanical Sensing of Charge Retention on Floating Electrodes
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2011; 20 (1): 150-156
View details for DOI 10.1109/JMEMS.2010.2090499
View details for Web of Science ID 000286934900020
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Magnetic, Mechanical, and Optical Characterization of a Magnetic Nanoparticle-Embedded Polymer for Microactuation
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2011; 20 (1): 65-72
View details for DOI 10.1109/JMEMS.2010.2093560
View details for Web of Science ID 000286934900012
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Experimental Demonstration and Analysis of DNA Passage in Nanopore-based Nanofluidic Transistors
IEEE International Electron Devices Meeting (IEDM)
IEEE. 2011
View details for Web of Science ID 000300015300178
- A reel-to-reel printed accelerometer 2011
- Low thermal-budget silicon sealed-cavity microencapsulation process 2011
- Spacer technique for low-voltage, high-aspect-ratio lateral electrostatic actuators 2011
- Vacuum microsystems for energy conversion and other applications 2011
- Atomic layer deposition of Al2O3 to protect carbon nanotubes for integration with top-down fabrication 2011
- Effect of illumination on thermionic emission of microfabricated silicon carbide structures 2011
- Dual sidewall lateral nanoelectromechanical relays with beam isolation 2011
- Suppression of wear in cyclically loaded polycrystalline silicon via a thin silicon carbide coating 2011
- Temperature dependence of vacuum encapsulated resonators for humidity measurement 2011
- Double-layered monolithic silicon photonic crystal fiber tip sensor 2011
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ALD-METAL UNCOOLED BOLOMETER
24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2011: 676–679
View details for Web of Science ID 000295841200168
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Integration of Nanoelectromechanical (NEM) Relays with Silicon CMOS with Functional CMOS-NEM Circuit
IEEE International Electron Devices Meeting (IEDM)
IEEE. 2011
View details for Web of Science ID 000300015300177
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NANOELECTROMECHANICAL RELAYS WITH DECOUPLED ELECTRODE AND SUSPENSION
24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2011: 1361–1364
View details for Web of Science ID 000295841200340
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Double-Layer Silicon Photonic Crystal Fiber Tip Sensor
16th International Conference on Optical MEMS and Nanophotonics (OMN)
IEEE. 2011: 97–98
View details for Web of Science ID 000297850100040
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Differential internal dielectric transduction of a Lame-mode resonator
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2010; 20 (11)
View details for DOI 10.1088/0960-1317/20/11/115036
View details for Web of Science ID 000283691600037
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Photon-enhanced thermionic emission for solar concentrator systems
NATURE MATERIALS
2010; 9 (9): 762-767
Abstract
Solar-energy conversion usually takes one of two forms: the 'quantum' approach, which uses the large per-photon energy of solar radiation to excite electrons, as in photovoltaic cells, or the 'thermal' approach, which uses concentrated sunlight as a thermal-energy source to indirectly produce electricity using a heat engine. Here we present a new concept for solar electricity generation, photon-enhanced thermionic emission, which combines quantum and thermal mechanisms into a single physical process. The device is based on thermionic emission of photoexcited electrons from a semiconductor cathode at high temperature. Temperature-dependent photoemission-yield measurements from GaN show strong evidence for photon-enhanced thermionic emission, and calculated efficiencies for idealized devices can exceed the theoretical limits of single-junction photovoltaic cells. The proposed solar converter would operate at temperatures exceeding 200 degrees C, enabling its waste heat to be used to power a secondary thermal engine, boosting theoretical combined conversion efficiencies above 50%.
View details for DOI 10.1038/NMAT2814
View details for Web of Science ID 000281178400029
View details for PubMedID 20676086
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Characterization of Encapsulated Micromechanical Resonators Sealed and Coated With Polycrystalline SiC
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2010; 19 (2): 357-366
View details for DOI 10.1109/JMEMS.2010.2040460
View details for Web of Science ID 000276257700014
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Model and Observations of Dielectric Charge in Thermally Oxidized Silicon Resonators
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2010; 19 (1): 162-174
View details for DOI 10.1109/JMEMS.2009.2036274
View details for Web of Science ID 000274213700016
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A Method for Wafer-Scale Encapsulation of Large Lateral Deflection MEMS Devices
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2010; 19 (1): 28-37
View details for DOI 10.1109/JMEMS.2009.2035717
View details for Web of Science ID 000274213700003
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CHARGE-DRIFT ELIMINATION IN RESONANT ELECTROSTATIC MEMS
23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
IEEE. 2010: 108–111
View details for Web of Science ID 000278416400025
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Electromechanical Sensing of Charge Retention on Floating Electrodes
2010 IEEE Sensors Conference
IEEE. 2010: 1395–1398
View details for Web of Science ID 000287982100307
- Time evolution of released hole arrays into membranes via vacuum silicon migration 2010
- Packaging of large lateral deflection MEMS using a combination of fusion bonding and epitaxial reactor sealing 2010
- Four-mask process based on spacer technology for scaled-down electrostatic actuators 2010
- Vacuum encapsulated resonators for humidity measurement 2010
- Heterodyned electrostatic transduction oscillators evade low frequency noise aliasing 2010
- Single-step, wafer-scale, hermetic sealing using silicon migration, to be presented at the 2010
- Composite polysilicon-platinum lateral nanoelectromechanical relays 2010
- 2D analytical model for the study of NEM relay device scaling 2010
- Non-adiabatic electronic relaxation events at monolayer-modified electrode-electrolyte interfaces: physics and applications 2010
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Higher-order Dielectrically Transduced Bulk-mode Ring Resonator with Low Motional Resistance
2010 IEEE International Frequency Control Symposium
IEEE. 2010: 19–24
View details for Web of Science ID 000287378700005
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pH Sensor Demonstrating a Layout Programmable Squeeze Pumped Microfluidic Platform
2010 IEEE Sensors Conference
IEEE. 2010: 936–939
View details for Web of Science ID 000287982100208
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EFFICIENT INTERNAL ELECTROSTATIC TRANSDUCTION OF THE 41(ST) RADIAL MODE OF A RING RESONATOR
23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
IEEE. 2010: 711–714
View details for Web of Science ID 000278416400176
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Efficient FPGAs using Nanoelectromechanical Relays
18th ACM International Symposium on Field-Programmable Gate Arrays
ASSOC COMPUTING MACHINERY. 2010: 273–282
View details for Web of Science ID 000285022000035
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TITANIUM NITRIDE SIDEWALL STRINGER PROCESS FOR LATERAL NANOELECTROMECHANICAL RELAYS
23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
IEEE. 2010: 456–459
View details for Web of Science ID 000278416400112
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High Temperature Photonic Crystal Fiber Tip Sensor
2010 IEEE Sensors Conference
IEEE. 2010: 970–974
View details for Web of Science ID 000287982100215
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Monolithic Silicon Photonic Crystal Fiber Tip Sensor for Refractive Index and Temperature Sensing
Conference on Lasers and Electro-Optics (CLEO)/Quantum Electronics and Laser Science Conference (QELS)
IEEE. 2010
View details for Web of Science ID 000290513600412
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Laser print patterning of planar spiral inductors and interdigitated capacitors
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2009; 27 (6): 2745-2749
View details for DOI 10.1116/1.3264673
View details for Web of Science ID 000272803400084
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Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS Devices
IEEE TRANSACTIONS ON ADVANCED PACKAGING
2009; 32 (2): 402-409
View details for DOI 10.1109/TADVP.2008.2005114
View details for Web of Science ID 000266778000018
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Photonic Crystal Fiber Tip Sensor for Precision Temperature Sensing
22nd Annual Meeting of the IEEE-Photonics-Society
IEEE. 2009: 761–762
View details for Web of Science ID 000279577600388
- Magnetic nanoparticle-driven pumping in microchannels 2009
- Thermionic emission from microfabricated silicon carbide filaments 2009
- Structural transformation of silicon due to hydrogen ambient during germanium epitaxy on silicon nano-pillars 2009
- Nanoelectromechanical (NEM) relays integrated with SRAM for improved stability and low leakage 2009
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WAFER SCALE ENCAPSULATION OF LARGE LATERAL DEFLECTION MEMS STRUCTURES
22nd International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2009: 745–748
View details for Web of Science ID 000341431500186
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FULLY DIFFERENTIAL INTERNAL ELECTROSTATIC TRANSDUCTION OF A LAME-MODE RESONATOR
22nd International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2009: 931–934
View details for Web of Science ID 000341431500233
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EPITAXIAL SILICON MICROSHELL VACUUM-ENCAPSULATED CMOS-COMPATIBLE 200 MHz BULK-MODE RESONATOR
22nd International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2009: 23–26
View details for Web of Science ID 000341431500006
- Laser print patterning of planar spiral inductors 2009
- Suspended microstructures made using silicon microstructures 2009
- Simultaneous wafer-scale vacuum encapsulation and microstructure cladding with LPCVD polycrystalline 3C-SiC 2009
- Encapsulated out-of-plane differential square-plate resonators with integrated actuation electrodes 2009
- Wafer reconstitution with precision dry front-to-front registration 2009
- Microfluidic device with integrated nanopores for protein detection 2009
- Laser-printed magnetic-polymer microstructures 2009
- Epitaxial growth of graphene on high topology SiC structures patterned by focused ion beam 2009
- Higher-order mode internal electrostatic transduction of a bulk-mode ring resonator on a quartz substrate 2009
- Monolithic Silicon Photonic Crystal Slab Fiber Tip Sensor 2009
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Room-Temperature Wet Etching of Polycrystalline and Nanocrystalline Silicon Carbide Thin Films with HF and HNO3
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2009; 156 (3): D104-D107
View details for DOI 10.1149/1.3061944
View details for Web of Science ID 000265837900044
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Experimental Investigation of Silicon Surface Migration in Low Pressure Nonreducing Gas Environments
ELECTROCHEMICAL AND SOLID STATE LETTERS
2009; 12 (12): H437-H440
View details for DOI 10.1149/1.3236781
View details for Web of Science ID 000270915300022
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Electrical and Mechanical Characterization of Doped and Annealed Polycrystalline 3C-SiC Thin Films
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2009; 156 (1): D5-D10
View details for DOI 10.1149/1.3000002
View details for Web of Science ID 000261209800048
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Characterization of polycrystalline 3C-SiC films deposited from the precursors 1,3-disilabutane and dichlorosilane
JOURNAL OF APPLIED PHYSICS
2008; 103 (8)
View details for DOI 10.1063/1.2907871
View details for Web of Science ID 000255456200180
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Technologies for cofabricating MEMS and electronics
PROCEEDINGS OF THE IEEE
2008; 96 (2): 306-322
View details for DOI 10.1109/JPROC.2007.911064
View details for Web of Science ID 000252583700009
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Effects of annealing on residual stress and strain gradient of doped polycrystalline SiC thin films
ELECTROCHEMICAL AND SOLID STATE LETTERS
2008; 11 (4): D35-D37
View details for DOI 10.1149/1.2831906
View details for Web of Science ID 000253238000009
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Silicon nanowire coupled micro-resonators
21st IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2008)
IEEE. 2008: 721–724
View details for Web of Science ID 000253356900181
- Obserations of fixed and mobile charge in composite MEMS resonators 2008
- Energy-reversible complementary NEM logic gates 2008
- Characterization of magnetic nanoparticle-embedded SU8 for microactuation 2008
- Measuring charge and charge-decay in floating electrode electrostatic MEMS actuators 2008
- Nanowire coupled micro-resonators 2008
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Characterization of boron-doped micro- and nanocrystalline diamond films deposited by wafer-scale hot filament chemical vapor deposition for MEMS applications
DIAMOND AND RELATED MATERIALS
2008; 17 (1): 23-28
View details for DOI 10.1016/j.diamond.2007.09.010
View details for Web of Science ID 000252545600004
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The Dependence of Poly-crystalline SiC Mid-Infrared Optical Properties on Deposition Conditions
IEEE/LEOS International Conference on Optical MEMS and Nanophotonics
IEEE. 2008: 182–183
View details for Web of Science ID 000264556700092
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Interface Quality Control of Monolithic Photonic Crystals by Hydrogen Annealing
Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference (CLEO/QELS 2008)
IEEE. 2008: 316–317
View details for Web of Science ID 000260498400159
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Analytical modeling of the suspended-gate FET and design insights for low-power logic
IEEE TRANSACTIONS ON ELECTRON DEVICES
2008; 55 (1): 48-59
View details for DOI 10.1109/TED.2007.911070
View details for Web of Science ID 000252059000005
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Electrical, mechanical and metal contact properties of polycrystalline 3C-SiC films for MEMS in harsh environments
16th European Conference on Chemical Vapor Deposition
ELSEVIER SCIENCE SA. 2007: 8893–98
View details for DOI 10.1016/j.sufcoat.2007.05.007
View details for Web of Science ID 000249340400019
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Nickel and platinum ohmic contacts to polycrystalline 3C-silicon carbide
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
2007; 139 (2-3): 235-239
View details for DOI 10.1016/j.mseb.2007.03.006
View details for Web of Science ID 000247182000021
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Mode shape imaging of out-of-plane and in-plane vibrating RF micromechanical resonators by atomic force microscopy
32nd International Conference on Micro- and Nano-Engineering
ELSEVIER SCIENCE BV. 2007: 1354–57
View details for DOI 10.1016/j.mee.2007.01.223
View details for Web of Science ID 000247182500155
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Suspended mechanical structures based on elastic silicon nanowire arrays
NANO LETTERS
2007; 7 (4): 1100-1104
Abstract
We demonstrate a bottom-up/top-down combined method for the fabrication of horizontally suspended, well-oriented and size-controlled Si nanowire arrays. Mechanical beamlike structures composed of multiple ordered arrays consecutively linked by transversal microspacers are obtained by this method. Such structures are used to investigate the mechanical elasticity of the nanowire arrays by atomic force microscopy. Our results point out important differences in the morphology and mechanical behavior of the fabricated nanowire-based structures with respect to equivalent bulk material structures.
View details for DOI 10.1021/nl062877n
View details for Web of Science ID 000245600500047
View details for PubMedID 17375964
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Characterization of polycrystalline silicon-germanium film deposition for modularly integrated MEMS applications
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2007; 16 (1): 68-77
View details for DOI 10.1109/JMEMS.2006.886030
View details for Web of Science ID 000244434300010
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Design considerations for complementary nanoelectromechanical logic gates
IEEE International Electron Devices Meeting
IEEE. 2007: 299–302
View details for Web of Science ID 000259347800066
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WetFET - A novel fluidic gate-dielectric transistor for sensor applications
International Symposium on VLSI Technology, Systems and Applications
IEEE. 2007: 124–125
View details for Web of Science ID 000247059300055
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Aqueous transduction of poly-sige disk resonators
14th International Conference on Solid-State Sensors, Actuators and Microsystems/21st European Conference on Solid-State Transducers
IEEE. 2007
View details for Web of Science ID 000249603700074
- Suspended mechanical structures based on elastic silicon nanowire arrays Nano Letters 2007; 7: 1100-1104
- Aqueous transduction of poly-SiGe disk resonators 2007
- Characterization of polycrystalline silicon-germanium film deposition for modularly integrated MEMS applications IEEE/ASME J. Microelectromechanical Systems 2007; 16: 68-77
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Effect of a vertical stack of aligned subwavelength metal hole arrays on extraordinary transmission spectra
IEEE/LEOS International Conference on Optical MEMS and Nanophotonics
IEEE. 2007: 117–118
View details for Web of Science ID 000251224200059
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Phonon polariton reflectance spectra in a silicon carbide membrane hole array
20th Annual Meeting of the IEEE-Lasers-and-Electro-Optics-Society
IEEE. 2007: 466–467
View details for Web of Science ID 000259345200232
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Extraordinary transmission through a poly-SiC membrane with subwavelength hole arrays
IEEE/LEOS International Conference on Optical MEMS and Nanophotonics
IEEE. 2007: 157–158
View details for Web of Science ID 000251224200077
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Stress control of polycrystalline 3C-SiC films in a large-scale LPCVD reactor using 1,3-disilabutane and dichlorosilane as precursors
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2006; 16 (12): 2736-2739
View details for DOI 10.1088/0960-1317/16/12/029
View details for Web of Science ID 000242475200029
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Control of strain gradient in doped polycrystalline silicon carbide films through tailored doping
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2006; 16 (10): L1-L5
View details for DOI 10.1088/0960-1317/16/10/L01
View details for Web of Science ID 000242169400001
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Modal coupling in micromechanical vibratory rate gyroscopes
IEEE SENSORS JOURNAL
2006; 6 (5): 1144-1152
View details for DOI 10.1109/JSEN.2006.881432
View details for Web of Science ID 000240698200015
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Polycrystalline silicon carbide as a substrate material for reducing adhesion in MEMS
TRIBOLOGY LETTERS
2006; 21 (3): 226-232
View details for DOI 10.1007/s11249-006-9024-9
View details for Web of Science ID 000238140800006
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Single-source chemical vapor deposition of SiC films in a large-scale low-pressure CVD growth, chemical, and mechanical characterization reactor
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2006; 153 (8): C562-C566
View details for DOI 10.1149/1.2208911
View details for Web of Science ID 000238470100043
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Back-end-of-line poly-SiGe disk resonators
19th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2006)
IEEE. 2006: 234–237
View details for Web of Science ID 000236994500059
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Reconstituted wafer technology for heterogeneous integration
19th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2006)
IEEE. 2006: 302–305
View details for Web of Science ID 000236994500076
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Electrical characterization of n-type polycrystalline 3C-silicon carbide thin films deposited by 1,3-disilabutane
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2006; 153 (6): G548-G551
View details for DOI 10.1149/1.2188327
View details for Web of Science ID 000237229300078
- Back-end-of-line poly-SiGe disk resonators 2006
- Electrical characterization of n-type polycrystalline 3C-silicon carbide thin films deposited by 1,3-disilabutane J. Electrochem. Soc. 2006; 153: G548-G551
- Reconstituted wafer technology for heterogeneous integration 2006
- Microfluidic generation of tunable monodisperse double emulsions for templated silica particles 2006
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Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices
IEEE TRANSACTIONS ON ELECTRON DEVICES
2005; 52 (9): 2081-2086
View details for DOI 10.1109/TED.2005.854287
View details for Web of Science ID 000231542100022
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Mechanical elasticity of single and double clamped silicon nanobeams fabricated by the vapor-liquid-solid method
APPLIED PHYSICS LETTERS
2005; 87 (5)
View details for DOI 10.1063/1.2008364
View details for Web of Science ID 000230886100057
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Selective growth of Si nanowire arrays via galvanic displacement processes in water-in-oil microemulsions
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY
2005; 127 (13): 4574-4575
Abstract
Galvanic displacement processes are employed in water-in-oil microemulsions to deposit gold nanoclusters selectively on Si surfaces and sidewalls. The gold clusters then serve as catalysts to achieve selective growth of vertically and laterally aligned Si nanowire arrays by chemical vapor deposition via the vapor-liquid-solid growth mechanism. The size of the gold clusters is shown to have a good correlation with the microemulsion parameters, which in turn controls the size of the synthesized nanowires.
View details for DOI 10.1021/ja043645y
View details for Web of Science ID 000228089300016
View details for PubMedID 15796513
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A new nano-electro-mechanical field effect transistor (NEMFET) design for low-power electronics
IEEE International Electron Devices Meeting
IEEE. 2005: 477–480
View details for Web of Science ID 000236225100108
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Anchor loss simulation in resonators
18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2005: 133–136
View details for Web of Science ID 000228430000033
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Silicon nitride-on-silicon bar resonator using internal electrostatic transduction
13th International Conference on Solid-State Sensors, Actuators and Microsystems
IEEE. 2005: 2139–2142
View details for Web of Science ID 000232189100529
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Fully-differential poly-SiC Lame-mode resonator and checkerboard filter
18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
IEEE. 2005: 223–226
View details for Web of Science ID 000228430000055
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Simulation tools for damping in high frequency resonators
4th IEEE Conference on Sensors
IEEE. 2005: 349–352
View details for Web of Science ID 000237003500087
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Redundant MEMS resonators for precise reference oscillators
IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
IEEE. 2005: 113–116
View details for Web of Science ID 000230541500025
- Microfluidic generation of tunable emulsions for templated monodisperse silica 2005
- Anchor loss simulation in resonators 2005
- Silicon nitride-on-silicon bar resonator using internal electrostatic transduction 2005
- Selective growth of Si nanowire arrays via galvanic displacement processes in water-in-oil microemulsions Journal of the Americal Chemical Society 2005; 127: 4574-4575
- Mechanical elasticity of single and double clamped silicon nanobeams fabricated by the vapor-liquid-solid method Applied Physics Letters 2005; 87: 53111-13
- Fully differential poly-SiC Lamé-mode resonator and checkerboard filter 2005
- Redundant MEMS resonators for precise reference oscillators 2005
- Simulation tools for damping in high frequency resonators 2005
- Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices IEEE Trans. Electron Devices 2005; 52: 2081-2086
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Fracture of polycrystalline 3C-SiC films in microelectromechanical systems
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2004; 13 (6): 972-976
View details for DOI 10.1109/JMEMS.2004.838372
View details for Web of Science ID 000225515100011
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Effect of excimer laser annealing on the structural properties of silicon germanium films
JOURNAL OF MATERIALS RESEARCH
2004; 19 (12): 3503-3511
View details for DOI 10.1557/JMR.2004.0450
View details for Web of Science ID 000225559900008
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Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology
IEEE SENSORS JOURNAL
2004; 4 (4): 441-448
View details for DOI 10.1109/JSEN.2004.828859
View details for Web of Science ID 000222724900007
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Pulsed-laser annealing, a low-thermal-budget technique for eliminating stress gradient in poly-SiGe MEMS structures
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2004; 13 (4): 669-675
View details for DOI 10.1109/JMEMS.2004.832189
View details for Web of Science ID 000223180200015
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Ge-blade damascene process for post-CMOS integration of nano-mechanical resonators
IEEE ELECTRON DEVICE LETTERS
2004; 25 (8): 529-531
View details for DOI 10.1109/LED.2004.831898
View details for Web of Science ID 000222905100005
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Single-source chemical vapor deposition of 3C-SiC films in a LPCVD reactor - I. Growth, structure, and chemical characterization
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2004; 151 (3): C210-C214
View details for DOI 10.1149/1.1646141
View details for Web of Science ID 000188943800043
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Transformer coupled plasma etching of 3C-SiC films using fluorinated chemistry for microelectromechanical systems applications
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2004; 22 (2): 513-518
View details for DOI 10.1116/1.1648067
View details for Web of Science ID 000221092300009
- Pulsed Laser Annealing, a Low Thermal Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures IEEE/ASME J. of Microelectromechanical Systems 2004; 13: 669-675
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Optimization of poly-SiGe deposition processes for modular MEMS integration
Symposium on Micro- and Nanosystems held at the 2003 MRS Fall Meeting
MATERIALS RESEARCH SOCIETY. 2004: 43–48
View details for Web of Science ID 000222177500006
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Integrated poly-SiGe nanomechanical resonators for wireless sensor nodes
Conference on Nanosensing
SPIE-INT SOC OPTICAL ENGINEERING. 2004: 368–377
View details for DOI 10.1117/12.573034
View details for Web of Science ID 000226789700038
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Ashing technique for nano-gap fabrication of electrostatic transducers
Symposium on Nontraditional Approaches to Patterning held at the 2003 MRS Fall Meeting
MATERIALS RESEARCH SOCIETY. 2004: 145–147
View details for Web of Science ID 000221437000031
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Coupling of resonant modes in micromechanical vibratory rate gyroscopes
Nanotechnology Conference and Trade Show (Nanotech 2004)
NANO SCIENCE & TECHNOLOGY INST. 2004: 335–338
View details for Web of Science ID 000223076800081
- Stress Stability of Poly-SiGe and Various Oxide Films in Humid Environments 2004
- Fatigue of Polycrystalline Silicon for Microelectromechanical Systems: Crack Growth and Stability under Resonant Loading Conditions Mechanics of Materials 2004; 36: 13-33
- Transformer coupled plasma etching of 3C-SiC films using fluorinated chemistry for MEMS applications J. Vac. Sci. Tech. B 2004; 22: 513-518
- Fracture of polycrystalline 3C-SiC films in microelectromechanical systems IEEE/ASME J. of Microelectromechanical Systems 2004; 13: 972-976
- Effects of boron concentration on Si1-xGex properties for integrated MEMS technology 2004
- Internal electrostatic transduction for bulk-mode MEMS resonators 2004
- Effect of eximer laser annealing on the structural propoerties of silicon germanium films J. Materials Research 2004; 19: 3503-3511
- Single-source chemical vapor deposition of 3C-SiC films in a LPCVD reactor, part I: Growth, Structure, and Chemical Characterization Journal of the Electrochemical Society 2004; 151: 210-214
- High performance inductors using capillary based fluidic self-assembly IEEE/ASME J. of Microelectromechanical Systems 2004; 13: 300-309
- Poly-SiGe high frequency resonators based on lithographic definition of nano-gap lateral transducers 2004
- Hydrogen peroxide etching and stability of p-type poly-SiGe films 2004
- In-situ doped poly-SiGe LPCVD process using BCl3 for post-CMOS integration of MEMS devices 2004
- Ge-blade damascene process for post-CMOS integration of nano-mechanical resonators IEEE Electron Device Lett. 2004; 25: 529-531
- Coupling of resonant modes in micromechanical vibratory rate gyroscopes 2004
- Silicon carbide for enhanced MEMS reliability 2004
- Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology IEEE Sensors Journal 2004; 4: 441-448
- Microbioreactor arrays with parametric control for high-throughput experimentation Biotechnology and Bioengineering 2004; 85: 376-381
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Nitrogen doping of polycrystalline 3C-SiC films grown using 1,3-disilabutane in a conventional LPCVD reactor
JOURNAL OF CRYSTAL GROWTH
2003; 259 (1-2): 18-25
View details for DOI 10.1016/S0022-0248(03)01573-2
View details for Web of Science ID 000186123700004
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Electrostatic charge and field sensors based on micromechanical resonators
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2003; 12 (5): 577-589
View details for DOI 10.1109/JMEMS.2003.818066
View details for Web of Science ID 000186149600006
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High-selectivity etching of polycrystalline 3C-SiC films using HBr-based transformer coupled plasma
APPLIED PHYSICS LETTERS
2003; 82 (11): 1742-1744
View details for DOI 10.1063/1.1560561
View details for Web of Science ID 000181442300032
- Electrostatic charge and field sensors based on micromechanical resonators IEEE/ASME J. of Microelectromechanical Systems 2003; 12: 577-589
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Model for micropart planarization in capillary-based microassembly
BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2
2003: 1319-1322
View details for Web of Science ID 000184567300331
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Pulsed laser annealing of silicon-germanium films
Symposium on Nano- and Microelectromechanical Systems (NEMS and MEMS) and Molecular Machines held at the 2002 MRS Fall Meeting
MATERIALS RESEARCH SOCIETY. 2003: 61–66
View details for Web of Science ID 000183489300009
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Temporal variation of angular momentum in the convection zone
Meeting on Local and Global Helioseismology
ESA PUBLICATIONS DIVISION C/O ESTEC. 2003: 97–102
View details for Web of Science ID 000183306100013
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High modulus polycrystalline 3C-SiC technology for RF MEMS
12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 03)
IEEE. 2003: 1160–1163
View details for Web of Science ID 000184567300292
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The radial bulk annular resonator: Towards a 50 Omega RF MEMS filter
12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 03)
IEEE. 2003: 875–878
View details for Web of Science ID 000184567300220
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An integrated, vertical-drive, in-plane-sense microgyroscope
12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 03)
IEEE. 2003: 171–174
View details for Web of Science ID 000184567300043
- A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS 2003
- High modulus polycrystalline 3C-SiC technology for RF MEMS 2003
- Properties of phosphorus-doped poly-SiGe films for MEMS applications Journal of the Electrochemical Society 2003; 150: H1-H6
- Model for micropart planarization in capillary-based microassembly 2003
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Performance comparison of integrated z-axis frame microgyroscopes
16th IEEE Annual International Conference on Micro Electro Mechanical Systems
IEEE. 2003: 482–485
View details for Web of Science ID 000182405500120
- Integrated Z-axis frame microgyroscope with ISOD design 2003
- The radial bulk annular resonator: towards a 50W RF MEMS filter 2003
- Optimization of poly-SiGe deposition processes for modular MEMS integration 2003
- Polycrystalline silicon germanium films for integrated microsystems IEEE/ASME Journal of Micro-electromechanical Systems 2003; 12: 160-171
- Characterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS applications J. Microlith. 2003; 2: 259-264
- Nitrogen doping of polycrystalline 3C-SiC films using 1,3-disilabutane in a conventional LPCVD reactor J. Crystal Growth 2003; 259: 18-25
- An integrated, vertical drive, in-plane-sense microgyroscope 2003
- A microfabricated electrochemical oxygen generator for high-density cell culture arrays IEEE/ASME J. of Microelectromechanical Systems 2003; 12: 590-599
- High-selectivity etching of polycrystalline 3C-SiC films using HBr-based transformer coupled plasma Applied Physics Letters 2003; 82: 1742-1744
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A vacuum packaged surface micromachined resonant accelerometer
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2002; 11 (6): 784-793
View details for DOI 10.1109/JMEMS.2002.805207
View details for Web of Science ID 000179740900019
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Nitrogen doping of polycrystalline 3C-SiC films grown by single-source chemical vapor deposition
THIN SOLID FILMS
2002; 419 (1-2): 69-75
View details for Web of Science ID 000179280400012
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A low-temperature CVD process for silicon carbide MEMS
Transducers 2001 Conference/Eurosensor XVth Conference
ELSEVIER SCIENCE SA. 2002: 410–415
View details for Web of Science ID 000176297000056
- Microsystems Research in Japan WTEC, Baltimore, Maryland 2002
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Fluidic self-assembly of micromirrors onto microactuators using capillary forces
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
2002; 8 (1): 4-11
View details for Web of Science ID 000174519300002
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Low-temperature LPCVD MEMS technologies
Symposium on MEMS and BioMEMS held at the 2002 MRS Spring Meeting
MATERIALS RESEARCH SOCIETY. 2002: 205–213
View details for Web of Science ID 000178928100030
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Recent progress in modularly integrated MEMS technologies
IEEE International Electron Devices Meeting
IEEE. 2002: 199–202
View details for Web of Science ID 000185143400045
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An integrated microelectromechanical resonant output gyroscope
15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2002)
IEEE. 2002: 722–726
View details for Web of Science ID 000174908700176
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Integrated surface-micromachined z-axis frame microgyroscope
IEEE International Electron Devices Meeting
IEEE. 2002: 203–206
View details for Web of Science ID 000185143400046
- Fluidic self-assembly of micromirrors onto microactuators using capillary forces (invited) IEEE Journal on Selected Topics in Quantum Electronics 2002; 8: 4-11
- Capacitive Interface for a Vertically Driven X&Y-Axis Rate Gyroscope 2002
- Interconnect issues for integrated MEMS technologies 2002
- A low-temperature CVD process for silicon carbide MEMS Sensors and Actuators A 2002; 97-98: 410-415
- A vacuum packaged surface micromachined resonant accelerometer IEEE/ASME Journal of Microelectromechanical Systems 2002; 11: 784-793
- Nitrogen doping of 3C-SiC films grown by single-source chemical vapor deposition Thin Solid Films 2002; 419: 69-75
- High-resolution electrometer with micromechanical variable capacitor 2002
- Recent progress in modularly integrated MEMS technologies 2002
- Low-temperature LPCVD MEMS technologies 2002
- Pulsed laser annealing of silicon germanium films 2002
- A microfabricated electrochemical oxygen generator for high-density cell culture arrays 2002
- Poly-SiGe: a high-Q structural material for integrated RF MEMS 2002
- Integrated surface-micromachined Z-axis frame microgyroscope 2002
- MEMS: Some Self-Assembly Required Optics & Photonics News 2002: 26-30
- Micromechanical Pierce oscillator for resonator sensor applications 2002
- An integrated microelectromechanical resonant-output gyroscope 2002
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Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS
Solid-State Sensors and Actuators Workshop
ELSEVIER SCIENCE SA. 2001: 239–48
View details for Web of Science ID 000169970700001
- Integrated MEMS technologies (invited) MRS Bulletin 2001
- High-aspect-ratio, molded microstructures with electrical isolation and embedded interconnects Microsystem Technologies 2001; 7: 47-54
- Modeling of capillary forces and binding sites for fluidic self-assembly 2001
- Full three-dimensional motion characterization of a gimballed electrostatic microactuator 2001
- Microstructure to substrate self-assembly using capillary forces IEEE/ASME J. of Microelectromechanical Systems 2001; 10: 17-24
- Microgimbal torsion beam design using open, thin-walled cross sections IEEE/ASME J. of Microelectromechanical Systems 2001; 10: 550-560
- Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS Sensors and Actuators A 2001; 91: 239-248
- Micromirrors for adaptive optics 2001
- Single-step assembly of complex 3-D microstructures 2000
- Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS 2000
- Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures 2000
- Silicon microbial bioreactor arrays 2000
- Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers 2000
- Stroboscropic interferometer with variable magnification to measure dynamics in an adaptive-optics micromirror 2000
- Fluidic self-assembly of micromirrors onto surface micromachined actuators 2000
- High aspect ratio poly-silicon-germanium microstructures 1999
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Post-CMOS integration of germanium microstructures
12th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 99)
IEEE. 1999: 630–637
View details for Web of Science ID 000078743100110
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Batch micropackaging by compression-bonded wafer-wafer transfer
MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST
1999: 482-489
View details for Web of Science ID 000078743100085
- Batch transfer assembly of micro-components onto surface and SOI MEMS 1999
- Integrated resonant accelerometer based on rigidity change 1999
- An integrated CMOS micromechanical resonator high-Q oscillator IEEE J. Solid-State Circuits 1999; 34: 440-455
- Batch micropackaging by compression-bonded wafer-wafer transfer 1999
- Vacuum encapsulation of resonant devices using permeable polysilicon 1999
- Modeling and simulation of micromachined gyroscopes in the presence of imperfections 1999
- Fluidic microassembly using patterned self-assembled monolayers and shape matching 1999
- Optimization of poly-silicon-germanium as a microstructural material 1999
- Third harmonic double-ended tuning fork resonator 1999
- Materials characterization for MEMS - a comparison of uniaxial and bending tests 1999
- Performance evaluation of batch-transferred surface micromachined resonators 1999
- Statistical characterization of fracture of brittle MEMS materials 1999
- Post-CMOS integration of germanium microstructures 1999
- Dynamics and control of micromachined gyroscopes 1999
- Mechanical performance of an integrated microgimbal / microactuators for disk drives 1999
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Surface micromachining for microelectromechanical systems
PROCEEDINGS OF THE IEEE
1998; 86 (8): 1552-1574
View details for Web of Science ID 000074840200004
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Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
1998; 7 (2): 252-260
View details for Web of Science ID 000073957900014
- Carbonized parylene as a conformal sacrificial layer for high aspect ratio molded polysilicon 1998
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Microassembly technologies for MEMS
SPIE Conference on Micromachining and Microfabrication Process Technology IV
SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16
View details for Web of Science ID 000076937000001
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Microassembly technologies for MEMS
Conference on Microelectronic Structures and MEMS for Optical Processing IV
SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16
View details for Web of Science ID 000076894900001
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Microassembly technologies for MEMS
Micromachined Devices amd Components IV
SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16
View details for Web of Science ID 000076796500001
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Microassembly technologies for MEMS
Materials and Device Characterization in Micromachining
SPIE - INT SOC OPTICAL ENGINEERING. 1998: 2–16
View details for Web of Science ID 000076704600001
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Microassembly technologies for MEMS
Microfluidic Devices and Systems
SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16
View details for Web of Science ID 000076705100001
- Microassembly technologies for MEMS 1998
- Fracture strength of polycrystalline silicon 1998
- Parallel microassembly with electrostatic force fields 1998
- Lubrication of polysilicon micromechanisms with self-assembled monolayers 1998
- Surface-micromachined 1 MHz oscillator with low-noise Pierce configuration 1998
- Commercialization of precision inertial sensors with integrated signal conditioning Sensors Expo West, San Jose, California 1998
- Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction IEEE/ASME J. of Micro-electromechanical Systems 1998; 7: 252-260
- Surface micromachining for micro-electro-mechanical systems Proc. of the IEEE 1998; 86: 1552-1574
- Microelectromechanical filters for signal processing IEEE/ASME J. of Microelectromechanical Systems 1998; 7: 286-294
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Stiction reduction processes for surface micromachines
TRIBOLOGY LETTERS
1997; 3 (3): 215-221
View details for Web of Science ID 000207956300002
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Effect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces
JOURNAL OF APPLIED PHYSICS
1997; 81 (8): 3474-3483
View details for Web of Science ID A1997WV36300021
- Stiction reduction processes for surface micromachines Tribology Letters 1997; 3: 215-221
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Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments
9th International Conference on Solid-State Sensors and Actuators
IEEE. 1997: 637–640
View details for Web of Science ID A1997BJ35B00162
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Surface-micromachined resonant accelerometer
9th International Conference on Solid-State Sensors and Actuators
IEEE. 1997: 859–862
View details for Web of Science ID A1997BJ35B00209
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Batch transfer of microstructures using flip-chip solder bump bonding
9th International Conference on Solid-State Sensors and Actuators
IEEE. 1997: 265–268
View details for Web of Science ID A1997BJ35B00064
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Self-assembled fluorocarbon films for enhanced stiction reduction
9th International Conference on Solid-State Sensors and Actuators
IEEE. 1997: 1399–1402
View details for Web of Science ID A1997BJ35B00345
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Critical review: Adhesion in surface micromechanical structures
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
1997; 15 (1): 1-20
View details for Web of Science ID A1997WH68800001
- Nonlinear mixing in surface-micromachined tuning fork oscillators 1997
- Effect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces J. of Applied Physics 1997; 81: 3474-3483
- Batch transfer of microstructures using flip-chip solder bump bonding 1997
- Hexsil tweezers for teleoperated micro-assembly 1997
- Self-assembled fluorocarbon films for enhanced stiction reduction 1997
- Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments 1997
- Experiments in micromanipulation and CAD-driven microassembly 1997
- A micro strain gauge with mechanical amplifier IEEE/ASME J. of Microelectromechanical Systems 1997; 6: 313-321
- Microelectronics: an Integrated Approach Prentice Hall. 1997
- Surface-micromachined resonant accelerometer 1997
- Critical review: stiction in surface micromechanical structures J. Vacuum Science and Technology B 1997; B15: 1-19
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Multimode digital control of a suspended polysilicon microstructure
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
1996; 5 (4): 283-297
View details for Web of Science ID A1996VY41300008
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Polysilicon integrated microsystems: Technologies and applications
SENSORS AND ACTUATORS A-PHYSICAL
1996; 56 (1-2): 167-177
View details for Web of Science ID A1996WA07000018
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Surface micromachined accelerometers
IEEE JOURNAL OF SOLID-STATE CIRCUITS
1996; 31 (3): 366-375
View details for Web of Science ID A1996UL10300010
- Surface micromachined accelerometers IEEE J. of Solid-State Circuits 1996; 31: 366-375
- Self-assembled monolayers as permanent anti-stiction coatings for polysilicon microstructures 1996
- Wafer-to-wafer microstructure transfer for vacuum packaging 1996
- Design, fabrication, position sensing, and control of an electrostatically driven polysilicon microactuator IEEE Trans. on Magnetics 1996; 32: 122-128
- Multi-mode digital control of suspended polysilicon microstructures IEEE/ASME J. of Microelectromechanical Systems 1996; 5: 283-297
- Micromechanical structures for fracture testing of brittle thin films 1996
- Hexsil tweezers with polysilicon piezoresistive strain gauges Late News Digest, 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C. 1996: 31-32
- Surface micromachined Z-axis vibratory rate gyroscope 1996
- Z-axis vibratory rate gyroscope 1996
- Polysilicon integrated microsystems: technologies and applications (invited) Sensors and Actuators A 1996; 56: 167-177
- Young's Modulus of in-situ Phophorus-Doped Polysilicon 1995
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Surface micromachined accelerometers
IEEE 1995 Custom Integrated Circuits Conference
IEEE. 1995: 337–344
View details for Web of Science ID A1995BD31E00075
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Diamond-like carbon films for silicon passivation in microelectromechanical devices
Symposium on Mechanical Behavior of Diamond and Other Forms of Carbon
MATERIALS RESEARCH SOC. 1995: 391–402
View details for Web of Science ID A1995BE33L00040
- Permeable Polysilicon Microshell Etch-Access Windows 1995
- Self-assembly of microsystems using non-contact electrostatic traps 1995
- High aspect ratio molded CVD silicon MEMS 1995
- Diamond-like carbon for silicon passivation in micromechanical devices 1995
- In Situ Phosphorus Doped Polysilicon for Integrated MEMS 1995
- Ammonium Fluoride Surface Treatments for Reducing In-Use Stiction in Polysilicon Microstructures 1995
- Polysilicon Integrated Microsystems: Technologies and Applications 1995
- Surface micromachined resonant force sensors 1995
- Surface micromachined angular accelerometer with force feedback 1995
- Surface Micromachining: from Vision to Reality to Vision edited by Drory, M., D., Bogy, D., B., Donley, M., S. 1995
- Recent Advances in Surface Micromachining 1995
- Hexsil bimorphs for vertical actuation 1995
- An integrated force-balanced capacitive accelerometer for low-G applications 1995
- Surface Micromachined Accelerometers 1995
- Nickel-filled thermally actuated hexsil tweezers 1995
- Silicon Micromachining for Resonator Fabrication 1994
- Silicon Surface Treatments for Stiction Reduction in Silicon Micromachining : A Surface Science Approach 1994
- Silicon dioxide sacrificial layer hydrofluoric acid etching: Part II -- modeling J. of the Electrochemical Society 1994; 141: 271-274
- Silicon dioxide sacrificial layer hydrofluoric acid etching: Part I - experimental observations J. of the Electrochemical Society 1994; 141: 264-269
- Integrated Testbed for Multi-Mode Digital Control of Suspended Microstructures 1994
- Design and Performance of CMOS Micromechanical Resonator Oscillators 1994
- Polysilicon Integrated Mechatronics: Applications and Recent Developments 1994
- Polysilicon microresonators for signal processing 1994
- Viscous damping model for laterally oscillating microstructures IEEE/ASME J. of Microelectromechanical Systems 1994; 3: 81-87
- Process Technology for the Modular Integration of CMOS and Microstructures (invited) Microsystem Technology 1994; 1: 30-41
- Micromechanical Resonators for Frequency References and Signal Processing 1994
- Slide film damping in laterally driven microstructures Sensors and Actuators A 1994; 40: 31-39
- Self-assembled monolayer film for enhanced imaging of rough surfaces with atomic force microscopy J. of Applied Physics 1994; 76: 5731-5737
- S-D Modulator interfacing with silicon microsensors Sensors 1993: 11-18
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A PASSIVE, INSITU MICRO STRAIN-GAUGE
1993 IEEE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 93 )
I E E E. 1993: 201–206
View details for Web of Science ID A1993BY05M00037
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POLYSILICON HOLLOW BEAM LATERAL RESONATORS
1993 IEEE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 93 )
I E E E. 1993: 265–271
View details for Web of Science ID A1993BY05M00048
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VISCOUS ENERGY-DISSIPATION IN LATERALLY OSCILLATING PLANAR MICROSTRUCTURES - A THEORETICAL AND EXPERIMENTAL-STUDY
1993 IEEE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 93 )
I E E E. 1993: 93–98
View details for Web of Science ID A1993BY05M00017
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STRESS-CORROSION CRACKING AND BLISTERING OF THIN POLYCRYSTALLINE SILICON FILMS IN HYDROFLUORIC-ACID
Symposium on Thin Films: Stresses and Mechanical Properties IV, at the 1993 Spring Meeting of the Materials-Research-Society
MATERIALS RESEARCH SOC. 1993: 641–646
View details for Web of Science ID A1993BZ55E00095
- Vacuum encapsulated lateral microresonators 1993
- Sigma-Delta modulator interfacing with microsensors Sensors Expo West, San Jose, California 1993: 159-164
- Determination of the etching kinetics for the hydrofluoric acid/silicon dioxide system J. of the Electrochemical Society 1993; 140: 2339-2346
- A novel micro in situ strain gauge 1993
- CMOS Micromechanical Resonator Oscillator 1993
- Polysilicon hollow beam lateral resonators 1993
- Stress-corrosion cracking and blistering of thin polycrystalline silicon films in hydrofluoric acid 1993
- Microresonator frequency control using an integrated micro oven 1993
- A Chemical Reaction Mechanism and Kinetics for Hydrofluoric Acid Etching of Silicon Dioxide Thin Films (invited review) Thin Solid Films 1993; 232 (1): 1-12
- Supercritical carbon dioxide drying of microstructures 1993
- Highly compliant lateral suspensions using sidewall beams 1993
- Surface roughness modification of interfacial contacts in polysilicon microstructures 1993
- Viscous energy dissipation in laterally oscillating planar microstructures: a theoretical and experimental study 1993
- Enhanced removal of sacrificial layers for silicon surface micromachining 1993
- Sacrificial layer Si02 wet etching for micromachining applications 1992
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MICRO ELECTROMECHANICAL FILTERS FOR SIGNAL-PROCESSING
5TH WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 92 )
I E E E. 1992: 226–231
View details for Web of Science ID A1992BV86N00042
- Stress and microstructure in phosphorus doped polycrystalline silicon 1992
- Electrostatic comb drive levitation and control method IEEE/ASME Journal of Microelectromechanical Systems 1992; 1 (4): 170-178
- Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry 1992
- Thermal microassembly of narrow-gap electrostatic comb-drive structures 1992
- Micro Electromechanical Filters 1992
- Silicon microfabricated accelerometers: a perspective on recent developments (invited paper), Sensors Expo, Chicago, Ill. 1992: 204A-1 - 204A-8.
- Recent developments in silicon microaccelerometers Sensors 1992: 31-41
- The effect of release-etch processing on surface microstructure stiction 1992
- Quality factor control for micromechanical resonators 1992
- Stress and microstructure in LPCVD polysilicon films: experimental results and closed form modeling of stresses 1992
- Sacrificial layer etching model for surface micromachining applications 1992
- Characterization of thin films using micromechanical structures 1992
- Sacrificial Silicon Dioxide Wet Etching for Micromachining Applications 1991
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SELF-ADJUSTING MICROSTRUCTURES (SAMS)
4TH IEEE WORKSHOP ON MICRO MECHANICAL SYSTEMS ( MEMS 91 )
I E E E. 1991: 51–56
View details for Web of Science ID A1991BT34N00009
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THERMAL ASSEMBLY OF POLYSILICON MICROSTRUCTURES
4TH IEEE WORKSHOP ON MICRO MECHANICAL SYSTEMS ( MEMS 91 )
I E E E. 1991: 63–68
View details for Web of Science ID A1991BT34N00011
- Stress in Undoped LPCVD Polycrystalline Silicon 1991
- Ultrasonically Induced Microtransport 1991
- Design and Modeling of a Linear Microactuator 1991
- Modeling and Position-Detection of a Polysilicon Linear Microactuator 1991
- Ultrasonically Induced Microtransport with Cylindrical Geometry 1991
- LPCVD Polysilicon Thin Films: The Evolution of Structure, Texture, and Stress 1991
- Micromechanical Structures for Thin Film Characterization 1991
- Self-Adjusting Microstructures 1991
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ELECTROSTATIC-COMB DRIVE OF LATERAL POLYSILICON RESONATORS
5TH INTERNATIONAL CONF ON SOLID-STATE SENSORS AND ACTUATORS AND EUROSENSORS 3 ( TRANSDUCERS 89 )
ELSEVIER SCIENCE SA. 1990: 328–31
View details for Web of Science ID A1990DB79100065
- Fluid Motion Produced by Ultrasonic Lamb waves 1990
- Resonant-Bridge Two-Axis Microaccelerometer Sensors and Actuators 1990; A21-A23: 342-345
- Electrostatically Balanced Comb Drive for Controlled Levitation 1990
- A Planar Air-Levitated Electrostatic Actuator System 1990
- Polysilicon Microstructures to Characterize Static Friction 1990
- Spiral Microstructures for the Measurement of Average Strain Gradients in Thin Films 1990
- missing title J. of Applied Physics 1990; 67: 572-574
- Fabrication Technologies for Integrated Microdynamic Systems (invited paper), Integrated Micro-Motion Systems Micromachining, Control and Applications edited by Harashima, F. Amsterdam: Elsevier Science Publishers. 1990: 297–312
- Silicon micromechanics: sensors and actuators on a chip IEEE Spectrum 1990: 29-35
- Electrostatic-Comb Drive of Lateral Polysilicon Resonators Sensors and Actuators A 1990; A21-A23: 328-331
- Ultrasonic Micromotors: Physics and Applications 1990
- Investigation of texture and stress in undoped polysilicon films edited by Kamins, T., Thompson, C., V., Raicu, B. 1990
- Fracture-Toughness Characterization of Brittle Thin Films Sensors and Actuators 1990; A21-A23: 872-874
- Microsensors for heat transfer and fluid flow measurements Experimental Thermal and Fluid Science 1990; 3: 52-59
- Technologies for microdynamic devices Nanotechnology 1990; 1: 8-12
- Lamb-Wave Interactions with the Chemical, Biological and Physical Environment 1990
- Texture of Undoped LPCVD Polycrystalline Silicon Films 1989
- Microstructures for Fracture Toughness Characterization of Brittle Thin Films 1989
- Laterally Driven Polysilicon Resonant Microstructures 1989
- Ultrasonic micromotor 1989
- Electrostatic-Comb Drive of Lateral Polysilicon Resonators 1989
- Fracture-Toughness Characterization of Brittle Thin Films 1989
- Resonant-Bridge Two-Axis Microaccelerometer 1989
- Vacuum-insulated field-effect transistor Electronics Letters 1989; 25: 1571-1573
- Microsensor and microactuator applications of thin films Thin Solid Films 1989; 181: 235-243
- One-Port Active Polysilicon Resonant Microstructures 1989
- Microsensor and Microactuator Applications of Thin Films 1989
- Laterally driven polysilicon resonant microstructures Sensors and Actuators 1989; 20: 25-32
- Silicon Microdynamic Systems: Recent Developments in Microactuators and Micromachinery (invited paper), IEEE WESCON, San Francisco, California 1989: 202-204
- Process integration for active polysilicon resonant microstructures Sensors and Actuators 1989; 20: 143-151
- A digital readout technique for capacitive sensor applications IEEE J. of Solid-State Circuits 1988; 23: 972-977
- Surface Micromachining Processes for Electrostatic Motor Fabrication 1988
- Surface Micromachining for Microsensors and Microactuators 1988
- Design considerations for microfabricated electric actuators Sensors and Actuators 1988; 14: 269-292
- A Thermally Isolated Microstructure Suitable for Gas Sensing Applications 1988
- Microsensors for heat transfer and fluid flow measurements 1988
- Design and calibration of a microfabricated floating-element shear-stress sensor IEEE Trans. on Electron Devices 1988; 35: 750-757
- Surface micromachining for microsensors and microactuators J. of Vacuum Science and Technology, Part B 1988; 6: 1809-1813
- Microfabricated structures for the in-situ measurement of residual stress, Young’s modulus, and ultimate strain in polyimide films Applied Physics Letters 1987; 51: 241-243
- Silicon resonant microsensors 1987
- Resonant microsensors 1987
- Surface micromachining of polyimide/metal composites for a shear-stress sensor 1987
- Novel microstructures for the in-situ measurement of mechanical properties of thin films J. of Applied Physics 1987; 62: 3579-3584
- Fabrication and testing of a micromachined shear sensor 1987
- A micromachined floating-element shear sensor 1987
- Applications of polysilicon films in microsensors and microactuators 1987
- Electric micromotors: electromechanical characteristics 1987
- Polycrystalline silicon micromachining: a new technology for integrated sensors Annals of Biomedical Engineering 1986; 14: 187-197
- Resonant-microbridge vapor sensor IEEE Trans. on Electron Devices 1986; ED-33: 499-506
- Resonant structures for integrated sensors 1986
- Polycrystalline silicon microstructures (invited), Micromachining and Micropackaging of Transducers edited by Fung, C., F., Cheung, P., W., Ko, W., H. Amsterdam: Elsevier Science Publishers. 1985: 169–187
- Polysilicon bridges for anemometer applications 1985
- Frequency response of polycrystalline silicon microbridges edited by Fung, C., F., Cheung, P., W., Ko, W., H. 1985
- Resonant polysilicon microbridge with integrated NMOS detection circuitry 1984
- Integrated resonant-microbridge vapor sensor 1984
- Polycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties Sensors and Actuators 1983; 4: 447-454
- Polycrystalline silicon micromechanical beams J. of the Electrochemical Society 1983; 130: 1420-1423
- Polycrystalline Silicon Micromechanical Beams 1982
- Epitaxial silicon microshell vacuum-encapsulated CMOS-compatible 200 MHz bulk-mode resonator
- Fully differential interal electrostatic transduction of a Lamé-mode resonator
- Photonic crystal mirrors for free-space communication and fiber-optic sensors
- Wafer scale encapsulation of large lateral deflection MEMS structures