All Publications


  • Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)-Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Hazra, S., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K. E. ASME. 2020

    View details for DOI 10.1115/1.4047847

    View details for Web of Science ID 000576282500020

  • Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (similar to 1kW/cm(2)) Power Electronics Cooling Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K. E. ASME. 2020

    View details for DOI 10.1115/1.4047883

    View details for Web of Science ID 000576282500019

  • PARAMETRIC STUDY OF SILICON -BASED EMBEDDED MICROCHANNELS WITH 3D MANIFOLD COOLERS (EMMC) FOR HIGH HEAT FLUX (-1 kW/cm2) POWER ELECTRONICS COOLING Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2020
  • ADDRESSING THE CHALLENGES IN LASER MICRO-MACHINING AND BONDING OF SILICON MICROCHANNEL COLD-PLATE AND 3D-MANIFOLD FOR EMBEDDED COOLING APPLICATIONS: PERFECT DEBRIS REMOVAL Hazra, S., Jung, K., Lyengar, M., Malone, C., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2020