All Publications


  • Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)-Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Hazra, S., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K. E. ASME. 2020

    View details for DOI 10.1115/1.4047847

    View details for Web of Science ID 000576282500020

  • Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (similar to 1kW/cm(2)) Power Electronics Cooling Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K. E. ASME. 2020

    View details for DOI 10.1115/1.4047883

    View details for Web of Science ID 000576282500019

  • ADDRESSING THE CHALLENGES IN LASER MICRO-MACHINING AND BONDING OF SILICON MICROCHANNEL COLD-PLATE AND 3D-MANIFOLD FOR EMBEDDED COOLING APPLICATIONS: PERFECT DEBRIS REMOVAL Hazra, S., Jung, K., Lyengar, M., Malone, C., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2020
  • Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications Piazza, A., Hazra, S., Jung, K., Degner, M., Gupta, M., Jih, E., Asheghi, M., Goodson, K. E., IEEE IEEE. 2020: 77-82
  • Microfabrication Challenges for Silicon-based Large Area (> 500 mm(2)) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal Hazra, S., Piazza, A., Jung, K., Asheghi, M., Gupta, M., Jih, E., Degner, M., Goodson, K. E., IEEE IEEE. 2020: 83-90