School of Engineering
Showing 31-35 of 35 Results
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Shayan Mohajer Hamidi
Postdoctoral Scholar, Electrical Engineering
Current Research and Scholarly InterestsReasoning in large language models (LLMs) and improving their systematic generalization
Post-training and fine-tuning methods for alignment, reliability, and efficiency
Autonomous agent architectures built on top of foundation models
Generative modeling with diffusion models and their multimodal applications
Theory and optimization methods for modern deep learning systems -
Jordan Moore
Postdoctoral Scholar, Materials Science and Engineering
BioJordan Moore is currently a postdoctoral fellow at Stanford University, appointed in both the Departments of Materials Science & Engineering and Neurology. He earned his Ph.D. from The Ohio State University within the Department of Biomedical Engineering, where he was mentored by Dr. Daniel Gallego Perez. During his doctoral studies, Jordan's research primarily centered around the application of electroporation for gene delivery in vivo, with a specific focus on cell-reprogramming.
His work in his Ph.D. program aimed to address the restoration of blood flow to damaged peripheral nerves, contributing to the promotion of nerve regeneration and functional recovery. As a postdoctoral researcher, Jordan is currently co-mentored by Professor Sarah Heilshorn and Dr. Marion Buckwalter. In this role, he is dedicated to the development of innovative biomaterial-based platforms for gene and drug delivery. His research focuses on the treatment of stroke-related injuries and the prevention of cognitive decline. -
Mete Muslu
Postdoctoral Scholar, Electrical Engineering
BioA. Mete Muslu received his B.Sc. and M.Sc. degrees in Mechanical Engineering from Ozyegin University, Istanbul, Turkey, in 2018 and 2020, respectively, and his Ph.D. in Mechanical Engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2025. His doctoral research focused on developing single- and two-phase cooling solutions for integrated power electronics packages and multi-functional cold plates. His current research interests include understanding device-level multi-physics and developing integrated thermal management solutions spanning from the chip to the package level for high-performance computing and power applications.
