School of Engineering
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Tiwei Wei
Postdoctoral Scholar, Mechanical Engineering
Current Research and Scholarly InterestsRESEARCH EXPERTISE
♦ Package/Chip Level Thermal Management
Perform thermal and flow dynamics analysis for electronics cooling solutions;
BEOL/Thin film thermal modeling and analysis;
♦ MEMS-based Microfluidic Cooling Device Demonstration
Strong background in Microfluidic cooler design and fabrication using CAD design tools, CFD
modeling, and semiconductor processing or additive manufacturing.
♦ 3D Electronic Packaging Development
Thorough understanding of the Chip/Package Level and Wafer Level Processes development with 5
years of cleanroom experience: 3D system integration, embedded packaging.
♦ Topology optimization for advanced manifold flow delivery system
Perform code development for jet cooling manifold fluidic system
