Stanford University
Showing 1-5 of 5 Results
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Mohamadali Malakoutian
Postdoctoral Scholar, Electrical Engineering
BioMohamadali is an experienced Postdoctoral researcher at Stanford University with a demonstrated history of working in high-power high-frequency transistors, all-diamond diodes, and diamond integration for thermal management, III-V wide bandgap semiconductors, integrated microsystems including MEMS/NEMS devices, and microfluidic channels. He is an expert in fab process design-integration, process and device modeling (Athena, Atlas), thin-film deposition techniques (Evaporation, Sputtering, PVD, ALD, and PECVD), dry etching (ICP/RIE etching of Diamond, AlN, SiN, Al2O3, SiO2), wet etching (bulk Si micromachining), and single-crystalline/polycrystalline diamond growth. He is currently working on the growth, fabrication, and characteristics of GaN HEMTs with diamond integrated for thermal management to solve the self-heating problem of mm-wave devices.
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Shayan Mohajer Hamidi
Postdoctoral Scholar, Electrical Engineering
Current Research and Scholarly InterestsReasoning in large language models (LLMs) and improving their systematic generalization
Post-training and fine-tuning methods for alignment, reliability, and efficiency
Autonomous agent architectures built on top of foundation models
Generative modeling with diffusion models and their multimodal applications
Theory and optimization methods for modern deep learning systems -
Mete Muslu
Postdoctoral Scholar, Electrical Engineering
BioA. Mete Muslu received his B.Sc. and M.Sc. degrees in Mechanical Engineering from Ozyegin University, Istanbul, Turkey, in 2018 and 2020, respectively, and his Ph.D. in Mechanical Engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2025. His doctoral research focused on developing single- and two-phase cooling solutions for integrated power electronics packages and multi-functional cold plates. His current research interests include understanding device-level multi-physics and developing integrated thermal management solutions spanning from the chip to the package level for high-performance computing and power applications.
