Honors & Awards

  • NSF GRFP, National Science Foundation (2022)
  • NeuroTech Graduate Training Program Fellow, NeuroTech Graduate Training Program (2021)

Education & Certifications

  • M.S., Stanford University, Materials Science and Engineering (2022)
  • B.S., California Institute of Technology, Materials Science (2020)

All Publications

  • Bioinspired nanoantennas for opsin sensitization in optogenetic applications: a theoretical investigation Multifunctional Materials Keck, C., Rommelfanger, N., Ou, Z., Hong, G. 2021

    View details for DOI 10.1088/2399-7532/abf0f9

  • Learning from the brain's architecture: bioinspired strategies towards implantable neural interfaces. Current opinion in biotechnology Rommelfanger, N. J., Keck, C. H., Chen, Y., Hong, G. 2021; 72: 8-12


    While early neural interfaces consisted of rigid, monolithic probes, recent implantable technologies include meshes, gels, and threads that imitate various properties of the neural tissue itself. Such mimicry brings new capabilities to the traditional electrophysiology toolbox, with benefits for both neuroscience studies and clinical treatments. Specifically, by matching the multi-dimensional mechanical properties of the brain, neural implants can preserve the endogenous environment while functioning over chronic timescales. Further, topological mimicry of neural structures enables seamless integration into the tissue and provides proximal access to neurons for high-quality recordings. Ultimately, we envision that neuromorphic devices incorporating functional, mechanical, and topological mimicry of the brain may facilitate stable operation of advanced brain machine interfaces with minimal disruption of the native tissue.

    View details for DOI 10.1016/j.copbio.2021.07.020

    View details for PubMedID 34365114

  • Differential Heating of Metal Nanostructures at Radio Frequencies PHYSICAL REVIEW APPLIED Rommelfanger, N. J., Ou, Z., Keck, C. C., Hong, G. 2021; 15 (5)
  • Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition JOURNAL OF THE ELECTROCHEMICAL SOCIETY Johnson, M. T., Keck, C. C., Faber, K. T. 2017; 164 (2): D48-D52