Dennis Rich

All Publications

• Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits Rich, D., Kasperovich, A., Malakoutian, M., Radway, R. M., Hagiwara, S., Yoshikawa, T., Chowdhury, S., Mitra, S., IEEE IEEE. 2023

  View details for DOI 10.1109/DAC56929.2023.10247815

  View details for Web of Science ID 001073487300131

• Lossless Phonon Transition Through GaN-Diamond and Si-Diamond Interfaces ADVANCED ELECTRONIC MATERIALS Malakoutian, M., Woo, K., Rich, D., Mandia, R., Zheng, X., Kasperovich, A., Saraswat, D., Soman, R., Jo, Y., Pfeifer, T., Hwang, T., Aller, H., Kim, J., Lyu, J., Mabrey, J., Rodriguez, T., Pomeroy, J., Hopkins, P. E., Graham, S., Smith, D. J., Mitra, S., Cho, K., Kuball, M., Chowdhury, S. 2024

  View details for DOI 10.1002/aelm.202400146

  View details for Web of Science ID 001265392700001

• EMBER: Efficient Multiple-Bits-Per-Cell Embedded RRAM Macro for High-Density Digital Storage IEEE JOURNAL OF SOLID-STATE CIRCUITS Levy, A., Upton, L. R., Scott, M. D., Rich, D., Khwa, W., Chih, Y., Chang, M., Mitra, S., Murmann, B., Raina, P. 2024

  View details for DOI 10.1109/JSSC.2024.3387566

  View details for Web of Science ID 001205858500001

• Efficient Ultra-Dense 3D IC Power Delivery and Cooling Using 3D Thermal Scaffolding Rich, D., Srimani, T., Malakoutian, M., Chowdhury, S., Mitra, S., ACM ASSOC COMPUTING MACHINERY. 2024

  View details for DOI 10.1145/3676536.3676760

  View details for Web of Science ID 001479882200073

• Cooling future system-on-chips with diamond inter-tiers CELL REPORTS PHYSICAL SCIENCE Malakoutian, M., Kasperovich, A., Rich, D., Woo, K., Perez, C., Soman, R., Saraswat, D., Kim, J., Noshin, M., Chen, M., Vaziri, S., Bao, X., Shih, C., Woon, W., Asheghi, M., Goodson, K. E., Liao, S., Mitra, S., Chowdhury, S. 2023; 4 (12)

  View details for DOI 10.1016/j.xcrp.2023.101686

  View details for Web of Science ID 001144107300001

• Testbench on a Chip: A Yield Test Vehicle for Resistive Memory Devices Upton, L. R., Lallement, G., Scott, M. D., Taylor, J., Radway, R. M., Rich, D., Nelson, M., Mitra, S., Murmann, B., IEEE IEEE. 2023: 576-582

  View details for DOI 10.1109/ISQED57927.2023.10129298

  View details for Web of Science ID 001013619400081

• Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits Srimani, T., Radway, R. M., Kim, J., Prabhu, K., Rich, D., Gilardi, C., Raina, P., Shulaker, M., Lim, S., Mitra, S., IEEE IEEE. 2023

  View details for Web of Science ID 001027444200118

• EMBER: A 100 MHz, 0.86 mm<SUP>2</SUP>, Multiple-Bits-per-Cell RRAM Macro in 40 nm CMOS with Compact Peripherals and 1.0 pJ/bit Read Circuitry Upton, L. R., Levy, A., Scott, M. D., Rich, D., Khwa, W., Chih, Y., Chang, M., Mitra, S., Raina, P., Murmann, B., IEEE IEEE. 2023: 469-472

  View details for DOI 10.1109/ESSCIRC59616.2023.10268807

  View details for Web of Science ID 001088613100118