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All Publications

  • Three-Dimensional Stacked Neural Network Accelerator Architectures for AR/VR Applications IEEE MICRO Yang, L., Radway, R., Chen, Y., Wu, T., Liu, H., Ansari, E., Chandra, V., Mitra, S., Beigne, E. 2022; 42 (6): 116-124

    View details for DOI 10.1109/MM.2022.3202254

    View details for Web of Science ID 000878171600027

  • CHIMERA: A 0.92-TOPS, 2.2-TOPS/W Edge AI Accelerator With 2-MByte On-Chip Foundry Resistive RAM for Efficient Training and Inference IEEE JOURNAL OF SOLID-STATE CIRCUITS Prabhu, K., Gural, A., Khan, Z. F., Radway, R. M., Giordano, M., Koul, K., Doshi, R., Kustin, J. W., Liu, T., Lopes, G. B., Turbiner, V., Khwa, W., Chih, Y., Chang, M., Lallement, G., Murmann, B., Mitra, S., Raina, P. 2022

    View details for DOI 10.1109/JSSC.2022.3140753

    View details for Web of Science ID 000750226200001

  • RADAR: A Fast and Energy-Efficient Programming Technique for Multiple Bits-Per-Cell RRAM Arrays IEEE TRANSACTIONS ON ELECTRON DEVICES Le, B. Q., Levy, A., Wu, T. F., Radway, R. M., Hsieh, E., Zheng, X., Nelson, M., Raina, P., Wong, H., Wong, S., Mitra, S. 2021; 68 (9): 4397-4403

    View details for DOI 10.1109/TED.2021.3097975

    View details for Web of Science ID 000686761500038

  • Illusion of large on-chip memory by networked computing chips for neural network inference NATURE ELECTRONICS Radway, R. M., Bartolo, A., Jolly, P. C., Khan, Z. F., Le, B. Q., Tandon, P., Wu, T. F., Xin, Y., Vianello, E., Vivet, P., Nowak, E., Wong, H., Aly, M., Beigne, E., Wootters, M., Mitra, S. 2021

    View details for DOI 10.1038/s41928-020-00515-3

    View details for Web of Science ID 000607033100001

  • A 43pJ/Cycle Non-Volatile Microcontroller with 4.7 mu s Shutdown/Wake-up Integrating 2.3-bit/Cell Resistive RAM and Resilience Techniques Wu, T. F., Le, B. Q., Radway, R., Bartolo, A., Hwang, W., Jeong, S., Li, H., Tandon, P., Vianello, E., Vivet, P., Nowak, E., Wootters, M. K., Wong, H., Aly, M., Beigne, E., Mitra, S., Fujino, L. C., Anderson, J. H., Belostotski, L., Dunwell, D., Gaudet, Gulak, G., Haslett, J. W., Halupka, D., Smith, K. C. IEEE. 2019: 226-+

    View details for Web of Science ID 000463153600071