Jerry A. Yang is a PhD student in electrical engineering at Stanford University. He received his BS in electrical engineering from the University of Texas at Austin and MA in Education from Stanford University. He currently works on strain engineering in two-dimensional materials in Prof. Eric Pop's lab. In addition, he works on equity issues in engineering education in Prof. Sheri Sheppard's Designing Education Lab. His research interests span novel materials, devices, and systems for next-generation computing, engineering education research methods, and critical theories in engineering education. He is a student member of the Institute for Electrical and Electronics Engineers (IEEE), Materials Research Society (MRS), and American Society of Engineering Education (ASEE).

Professional Affiliations and Activities

  • Student Member, Materials Research Society (2022 - Present)
  • Student Affiliate, American Society of Engineering Education (ASEE) (2018 - Present)
  • Member, Institute of Electrical and Electronics Engineers (IEEE) (2017 - Present)
  • Student Member, National Science Teachers' Association (2017 - 2019)

Education & Certifications

  • MA, Stanford University, Education (2023)
  • BS, University of Texas at Austin, Electrical and Computer Engineering (2020)

Lab Affiliations

All Publications

  • Today's Grad Students, Tomorrow's Faculty LGBTQIA plus Graduate Student Experiences Navigating the Insider/Outsider Paradox in Engineering QUEERNESS AS DOING IN HIGHER EDUCATION Bakka, B., Jennings, M., Yang, J. A., Cisneros, J., Jourian, T. J., Miller, R. A., Duran, A. 2023: 142-156
  • LGBTQ plus in ECE: Culture and (Non)Visibility IEEE TRANSACTIONS ON EDUCATION Yang, J. A., Sherard, M. K., Julien, C., Borrego, M. 2021; 64 (4): 345-352
  • Resistance and Community-Building in LGBTQ+ Engineering Students Journal of Women and Minorities in Science and Engineering Yang, J. A., Sherard, M. K., Julien, C., Borrego, M. 2021; 27 (4): 1-33
  • Buckled beam mechanical memory using an asymmetric piezoresistor for readout JOURNAL OF MICROMECHANICS AND MICROENGINEERING Lin, J., Shuvra, P., Yang, J. A., McNamara, S., Walsh, K., Alphenaar, B. 2020; 30 (7)