Aidan James Fitzpatrick
Ph.D. Student in Electrical Engineering, admitted Autumn 2018
Bio
AIDAN FITZPATRICK received the B.S. degree in electrical and computer engineering from the University of Massachusetts Amherst, in 2018, and the M.S. degree in electrical engineering from Stanford University in 2020, where he is currently pursuing the Ph.D. degree in electrical engineering.
His current research interests are in computational imaging - specifically at the intersection of electromagnetics, acoustics, and signal processing for the codesign of imaging algorithms and system hardware for non-contact thermoacoustic/photoacoustic, and millimeter wave applications.
All Publications
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A Thermoacoustic Imaging System for Noninvasive and Nondestructive Root Phenotyping
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS
2022; 69 (5): 2493-2497
View details for DOI 10.1109/TCSII.2022.3159448
View details for Web of Science ID 000790814000025
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Multi-Watt-Level 4.9-GHz Silicon Power Amplifier for Portable Thermoacoustic Imaging
IEEE JOURNAL OF SOLID-STATE CIRCUITS
2022
View details for DOI 10.1109/JSSC.2022.3149910
View details for Web of Science ID 000764854600001
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Dynamic Tuning of Sensitivity and Bandwidth of High-Q Transducers via Nested Phase Modulations
IEEE. 2022: 876-880
View details for DOI 10.1109/ISCAS48785.2022.9937917
View details for Web of Science ID 000946638601017
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Laser Scanning for Single-Shot Frequency Diverse Photoacoustic Excitation
IEEE. 2022
View details for DOI 10.1109/IUS54386.2022.9957210
View details for Web of Science ID 000896080400025
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Multi-Task Learning for Simultaneous Speed-of-Sound Mapping and Image Reconstruction Using Non-Contact Thermoacoustics
IEEE. 2021
View details for DOI 10.1109/IUS52206.2021.9593748
View details for Web of Science ID 000832095000405
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Spatial Reconstruction of Soil Moisture Content using Non-Contact Thermoacoustic Imaging
2020 IEEE SENSORS
2020: 1–4
View details for DOI 10.1109/SENSORS47125.2020.9278654
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Resolution Enhanced Non-Contact Thermoacoustic Imaging using Coded Pulse Excitation
IEEE International Ultrasonics Symposium (IUS)
2020: 1–4
View details for DOI 10.1109/IUS46767.2020.9251350
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Spatial Reconstruction of Soil Moisture Content using Non-Contact Thermoacoustic Imaging
IEEE. 2020
View details for Web of Science ID 000646236300082
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Resolution Enhanced Non-Contact Thermoacoustic Imaging using Coded Pulse Excitation
IEEE. 2020
View details for Web of Science ID 000635688900049
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An Airborne Sonar System for Underwater Remote Sensing and Imaging
IEEE ACCESS
2020; 8: 189945–59
View details for DOI 10.1109/ACCESS.2020.3031808
View details for Web of Science ID 000584877300001
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Non-Invasive Remote Temperature Monitoring Using Microwave-Induced Thermoacoustic Imaging.
Conference proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference
2019; 2019: 6375–78
Abstract
Non-invasive temperature monitoring of tissue at depth in real-time is critical to hyperthermia therapies such as high-intensity focused ultrasound. Knowledge of temperature allows for monitoring treatment as well as providing real-time feedback to adjust deposited power in order to maintain safe and effective temperatures. Microwave-induced thermoacoustic (TA) imaging, which combines the conductivity/dielectric contrast of microwave imaging with the resolution of ultrasound, shows potential for estimating temperature non-invasively in real-time by indirectly measuring the temperature dependent parameters from reconstructed images. In this work, we study the temperature dependent behavior of the generated pressure in the TA effect and experimentally demonstrate simultaneous imaging and temperature monitoring using TA imaging. The proof-of-concept experiments demonstrate millimeter spatial resolution while achieving degree-level accuracy.
View details for DOI 10.1109/EMBC.2019.8857309
View details for PubMedID 31947301
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Non-Invasive Remote Temperature Monitoring Using Microwave-Induced Thermoacoustic Imaging
IEEE. 2019: 6375–78
View details for Web of Science ID 000557295306183