Roger Howe

All Publications

• "Deep approaches to learning" in a project-based nanofabrication graduate course JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY Tang, M., Kommera, S., Raghuram, U., Rincon, M., Xu, X., Fan, J., Howe, R. T. 2022

  View details for DOI 10.1002/jsid.1182

  View details for Web of Science ID 000871256700001

• Optimized Deep Reactive-Ion Etching of Nanostructured Black Silicon for High-Contrast Optical Alignment Marks ACS APPLIED NANO MATERIALS Yusuf, M., Herring, G. K., Neustock, L., Zaman, M., Raghuram, U., Narasimhan, V. K., Chia, C., Howe, R. T. 2021; 4 (7): 7047-7061

  View details for DOI 10.1021/acsanm.1c01070

  View details for Web of Science ID 000677582900055

• Encapsulated Cell Dynamics in Droplet Microfluidic Devices with Sheath Flow. Micromachines Beshay, P. E., Ibrahim, A. M., Jeffrey, S. S., Howe, R. T., Anis, Y. H. 2021; 12 (7)

  Abstract

  In this paper we study the dynamics of single cells encapsulated in water-in-oil emulsions in a microchannel. The flow field of a microfluidic channel is coupled to the internal flow field of a droplet through viscous traction at the interface, resulting in a rotational flow field inside the droplet. An encapsulated single cell being subjected to this flow field responds by undergoing multiple orbits, spins, and deformations that depend on its physical properties. Monitoring the cell dynamics, using a high-speed camera, can lead to the development of new label-free methods for the detection of rare cells, based on their biomechanical properties. A sheath flow microchannel was proposed to strengthen the rotational flow field inside droplets flowing in Poiseuille flow conditions. A numerical model was developed to investigate the effect of various parameters on the rotational flow field inside a droplet. The multi-phase flow model required the tracking of the fluid-fluid interface, which deforms over time due to the applied shear stresses. Experiments confirmed the significant effect of the sheath flow rate on the cell dynamics, where the speed of cell orbiting was doubled. Doubling the cell speed can double the amount of extracted biomechanical information from the encapsulated cell, while it remains within the field of view of the camera used.

  View details for DOI 10.3390/mi12070839

  View details for PubMedID 34357249

• Interpretable Classification of Bacterial Raman Spectra with Knockoff Wavelets. IEEE journal of biomedical and health informatics Chia, C., Sesia, M., Ho, C. S., Jeffrey, S. S., Dionne, J. A., Candes, E., Howe, R. T. 2021; PP

  Abstract

  Deep neural networks and other machine learning models are widely applied to biomedical signal data because they can detect complex patterns and compute accurate predictions. However, the difficulty of interpreting such models is a limitation, especially for applications involving high-stakes decision, including the identification of bacterial infections. This paper considers fast Raman spectroscopy data and demonstrates that a logistic regression model with carefully selected features achieves accuracy comparable to that of neural networks, while being much simpler and more transparent. Our analysis leverages wavelet features with intuitive chemical interpretations, and performs controlled variable selection with knockoffs to ensure the predictors are relevant and non-redundant. Although we focus on a particular data set, the proposed approach is broadly applicable to other types of signal data for which interpretability may be important.

  View details for DOI 10.1109/JBHI.2021.3094873

  View details for PubMedID 34232897

• Encapsulated Cell Dynamics in Droplet Microfluidic Devices with Sheath Flow MICROMACHINES Beshay, P. E., Ibrahim, A. M., Jeffrey, S. S., Howe, R. T., Anis, Y. H. 2021; 12 (7)

  View details for DOI 10.3390/mi12070839

  View details for Web of Science ID 000676672700001

• Modeling of Droplet Generation in a Microfluidic Flow-Focusing Junction for Droplet Size Control. Micromachines Ibrahim, A. M., Padovani, J. I., Howe, R. T., Anis, Y. H. 2021; 12 (6)

  Abstract

  In this paper, we study the parameters that affect the generation of droplets in a microfluidic flow-focusing junction. Droplets are evaluated based on the size and frequency of generation. Droplet size control is essential for microfluidic lab-on-a-chip applications in biology, chemistry, and medicine. We developed a three-dimensional numerical model that can emulate the performance of the physical system. A numerical model can help design droplet-generation chips with new junction geometries, different dispersed and continuous phase types, and different flow rates. Our model uses a conservative level-set method (LSM) to track the interface between two immiscible fluids using a fixed mesh. Water was used for the dispersed phase and mineral oil for the continuous phase. The effects of the continuous-to-dispersed flow rate ratio (Qo/Qw) and the surfactant concentration on the droplet generation were studied both using the numerical model and experimentally. The numerical model was found to render results that are in good agreement with the experimental ones, which validates the LSM model. The validated numerical model was used to study the time effect of changing Qo/Qw on the generated droplet size. Properly timing when the flow rates are changed enables control over the size of the next generated droplet, which is useful for single-droplet size modulation applications.

  View details for DOI 10.3390/mi12060590

  View details for PubMedID 34063839

• Electropermanent magnet-driven droplet size modulation for two-phase ferromicrofluidics MICROFLUIDICS AND NANOFLUIDICS Padovani, J., Ibrahim, A. M., Jeffrey, S. S., Anis, Y. H., Howe, R. T. 2020; 24 (12)

  View details for DOI 10.1007/s10404-020-02398-4

  View details for Web of Science ID 000585128100001

• A vibrating beam MEMS accelerometer for gravity and seismic measurements. Scientific reports Mustafazade, A., Pandit, M., Zhao, C., Sobreviela, G., Du, Z., Steinmann, P., Zou, X., Howe, R. T., Seshia, A. A. 2020; 10 (1): 10415

  Abstract

  This paper introduces a differential vibrating beam MEMS accelerometer demonstrating excellent long-term stability for applications in gravimetry and seismology. The MEMS gravimeter module demonstrates an output Allan deviation of 9 muGal for a 1000s integration time, a noise floor of 100 muGal/Hz, and measurement over the full ±1g dynamic range (1g=9.81ms-2). The sensitivity of the device is demonstrated through the tracking of Earth tides and recording of ground motion corresponding to a number of teleseismic events over several months. These results demonstrate that vibrating beam MEMS accelerometers can be employed for measurements requiring high levels of stability and resolution with wider implications for precision measurement employing other resonant-output MEMS devices such as gyroscopes and magnetometers.

  View details for DOI 10.1038/s41598-020-67046-x

  View details for PubMedID 32591608

• Neural network-based model of photoresist reflow JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B Chia, C., Martis, J., Jeffrey, S. S., Howe, R. T. 2019; 37 (6)

  View details for DOI 10.1116/1.5116857

  View details for Web of Science ID 000522021700022

• Surface Photovoltage-Induced Ultralow Work Function Material for Thermionic Energy Converters ACS ENERGY LETTERS Schindler, P., Riley, D. C., Bargatin, I., Sahasrahuddhe, K., Schwede, J. W., Sun, S., Pianetta, P., Shen, Z., Howe, R. T., Melosh, N. A. 2019; 4 (10): 2436–43

  Abstract

  Low work function materials are essential for efficient thermionic energy converters (TECs), electronics, and electron emission devices. Much effort has been put into finding thermally stable material combinations that exhibit low work functions. Submonolayer coatings of alkali metals have proven to significantly reduce the work function; however, a work function less than 1 eV has not been reached. We report a record-low work function of 0.70 eV by inducing a surface photovoltage (SPV) in an n-type semiconductor with an alkali metal coating. Ultraviolet photoelectron spectroscopy indicates a work function of 1.06 eV for cesium/oxygen-activated GaAs consistent with density functional theory model predictions. By illuminating with a 532 nm laser we induce an additional shift down to 0.70 eV due to the SPV. Further, we apply the SPV to the collector of an experimental TEC and demonstrate an I-V curve shift consistent with the collector work function reduction. This method opens an avenue toward efficient TECs and next-generation electron emission devices.

  View details for DOI 10.1021/acsenergylett.9b01214

  View details for Web of Science ID 000490365500011

  View details for PubMedID 31633034

  View details for PubMedCentralID PMC6792473

• Anomalous hysteresis and current fluctuations in cyclic voltammograms at microelectrodes due to Ag leaching from Ag/AgCl reference electrodes ELECTROCHEMISTRY COMMUNICATIONS Chia, C., Jeffrey, S. S., Howe, R. T. 2019; 105

  View details for DOI 10.1016/j.elecom.2019.106499

  View details for Web of Science ID 000484833800013

• ALD HfO2 Films for Defining Microelectrodes for Electrochemical Sensing and Other Applications ACS APPLIED MATERIALS & INTERFACES Chia, C., Shulaker, M. M., Provine, J., Jeffrey, S. S., Howe, R. T. 2019; 11 (29): 26082–92

  Abstract

  Microelectrodes are used in a wide range of applications from analytical electrochemistry and biomolecular sensing to in vivo implants. While a variety of insulating materials have been used to define the microelectrode active area, most are not suitable for nanoscale electrodes (<1 μm2) due to the limited robustness of these films when the film thickness is on the order of the nanoelectrode dimension. In this study, we investigate atomic layer deposited hafnium dioxide (ALD HfO2) as an insulating film to coat planar platinum microelectrodes, with the active areas being defined where the HfO2 is etched. Thermally grown films with thicknesses between 10 and 60 nm were deposited by 100 to 550 ALD cycles and were initially characterized by measuring their standard electrical properties and imaging incipient texture development. Electrochemical measurements on the structures were made, including linear sweep voltammetry and electrochemical impedance spectroscopy, which identified the presence of pinholes in films deposited over the range of 100 to 350 cycles, resulting in leakage. These measurements also suggest a lower limit to the size of microelectrodes below which the electrochemical current detected is no longer dominated by that through the exposed active area. A bilayer insulator comprising ALD HfO2 coated with parylene-C was investigated to minimize the pinhole leakage. Steady-state currents were measured for different electrode areas, qualitatively agreeing with the theory for areas down to ∼1 μm2. For sub-square micrometer electrode areas, bilayer-insulated devices with parylene-C apertures that exposed the smallest microelectrode area showed measured currents that were consistent with extrapolations, indicating that it reduces leakage through HfO2.

  View details for DOI 10.1021/acsami.9b06891

  View details for Web of Science ID 000477787200048

  View details for PubMedID 31305057

• Micron-gap spacers with ultrahigh thermal resistance and mechanical robustness for direct energy conversion. Microsystems & nanoengineering Nicaise, S. M., Lin, C., Azadi, M., Bozorg-Grayeli, T., Adebayo-Ige, P., Lilley, D. E., Pfitzer, Y., Cha, W., Van Houten, K., Melosh, N. A., Howe, R. T., Schwede, J. W., Bargatin, I. 2019; 5: 31

  Abstract

  In thermionic energy converters, the absolute efficiency can be increased up to 40% if space-charge losses are eliminated by using a sub-10-µm gap between the electrodes. One practical way to achieve such small gaps over large device areas is to use a stiff and thermally insulating spacer between the two electrodes. We report on the design, fabrication and characterization of thin-film alumina-based spacers that provided robust 3-8 μm gaps between planar substrates and had effective thermal conductivities less than those of aerogels. The spacers were fabricated on silicon molds and, after release, could be manually transferred onto any substrate. In large-scale compression testing, they sustained compressive stresses of 0.4-4 MPa without fracture. Experimentally, the thermal conductance was 10-30 mWcm-2K-1 and, surprisingly, independent of film thickness (100-800 nm) and spacer height. To explain this independence, we developed a model that includes the pressure-dependent conductance of locally distributed asperities and sparse contact points throughout the spacer structure, indicating that only 0.1-0.5% of the spacer-electrode interface was conducting heat. Our spacers show remarkable functionality over multiple length scales, providing insulating micrometer gaps over centimeter areas using nanoscale films. These innovations can be applied to other technologies requiring high thermal resistance in small spaces, such as thermophotovoltaic converters, insulation for spacecraft and cryogenic devices.

  View details for DOI 10.1038/s41378-019-0071-4

  View details for PubMedID 31636923

  View details for PubMedCentralID PMC6799816

• Micron-gap spacers with ultrahigh thermal resistance and mechanical robustness for direct energy conversion MICROSYSTEMS & NANOENGINEERING Nicaise, S. M., Lin, C., Azadi, M., Bozorg-Grayeli, T., Adebayo-Ige, P., Lilley, D. E., Pfitzer, Y., Cha, W., Van Houten, K., Melosh, N. A., Howe, R. T., Schwede, J. W., Bargatin, I. 2019; 5

  View details for DOI 10.1038/s41378-019-0071-4

  View details for Web of Science ID 000477598700001

• Quantum Tunneling Currents in a Nanoengineered Electrochemical System JOURNAL OF PHYSICAL CHEMISTRY C Gupta, C., Walker, R. M., Chang, S., Fischer, S. R., Seal, M., Murmann, B., Howe, R. T. 2017; 121 (28): 15085–105

  View details for DOI 10.1021/acs.jpcc.7b04350

  View details for Web of Science ID 000406355700012

• Three-dimensional integration of nanotechnologies for computing and data storage on a single chip NATURE Shulaker, M. M., Hills, G., Park, R. S., Howe, R. T., Saraswat, K., Wong, H., Mitra, S. 2017; 547 (7661): 74-+

  Abstract

  The computing demands of future data-intensive applications will greatly exceed the capabilities of current electronics, and are unlikely to be met by isolated improvements in transistors, data storage technologies or integrated circuit architectures alone. Instead, transformative nanosystems, which use new nanotechnologies to simultaneously realize improved devices and new integrated circuit architectures, are required. Here we present a prototype of such a transformative nanosystem. It consists of more than one million resistive random-access memory cells and more than two million carbon-nanotube field-effect transistors-promising new nanotechnologies for use in energy-efficient digital logic circuits and for dense data storage-fabricated on vertically stacked layers in a single chip. Unlike conventional integrated circuit architectures, the layered fabrication realizes a three-dimensional integrated circuit architecture with fine-grained and dense vertical connectivity between layers of computing, data storage, and input and output (in this instance, sensing). As a result, our nanosystem can capture massive amounts of data every second, store it directly on-chip, perform in situ processing of the captured data, and produce 'highly processed' information. As a working prototype, our nanosystem senses and classifies ambient gases. Furthermore, because the layers are fabricated on top of silicon logic circuitry, our nanosystem is compatible with existing infrastructure for silicon-based technologies. Such complex nano-electronic systems will be essential for future high-performance and highly energy-efficient electronic systems.

  View details for PubMedID 28682331

• Back-end-of-line compatible Poly-SiGe lateral nanoelectromechanical relays with multi-level interconnect Harrison, K. L., Clary, W. A., Provine, J., Howe, R. T. SPRINGER. 2017: 2125–30

  View details for DOI 10.1007/s00542-016-2932-1

  View details for Web of Science ID 000401630800052

• Back-gated graphene anode for more efficient thermionic energy converters NANO ENERGY Yuan, H., Riley, D. C., Shen, Z., Pianetta, P. A., Melosh, N. A., Howe, R. T. 2017; 32: 67-72

  View details for DOI 10.1016/j.nanoen.2016.12.027

  View details for Web of Science ID 000397003700009

• Active control of probability amplitudes in a mesoscale system via feedback-induced suppression of dissipation and noise JOURNAL OF APPLIED PHYSICS Gupta, C., Perez, A. P., Fischer, S. R., Weinreich, S. B., Murmann, B., Howe, R. T. 2016; 120 (22)

  View details for DOI 10.1063/1.4971867

  View details for Web of Science ID 000391535900013

• A Super Stretchable Organic Thin-Film Diodes Network That Can Be Embedded Into Carbon Fiber Composite Materials for Sensor Network Applications JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Guo, Z., Aboudi, U., Peumans, P., Howe, R. T., Chang, F. 2016; 25 (3): 524-532

  View details for DOI 10.1109/JMEMS.2016.2538788

  View details for Web of Science ID 000377372900013

• Electropermanent magnet actuation for droplet ferromicrofluidics. Technology Padovani, J. I., Jeffrey, S. S., Howe, R. T. 2016; 4 (2): 110-119

  Abstract

  Droplet actuation is an essential mechanism for droplet-based microfluidic systems. On-demand electromagnetic actuation is used in a ferrofluid-based microfluidic system for water droplet displacement. Electropermanent magnets (EPMs) are used to induce 50 mT magnetic fields in a ferrofluid filled microchannel with gradients up to 6.4 × 10(4) kA/m(2). Short 50 µs current pulses activate the electropermanent magnets and generate negative magnetophoretic forces that range from 10 to 70 nN on 40 to 80 µm water-in-ferrofluid droplets. Maximum droplet displacement velocities of up to 300 µm/s are obtained under flow and no-flow conditions. Electropermanent magnet-activated droplet sorting under continuous flow is demonstrated using a split-junction microfluidic design.

  View details for PubMedID 27583301

• Design and fabrication of silicon-tessellated structures for monocentric imagers. Microsystems & nanoengineering Wu, T., Hamann, S. S., Ceballos, A. C., Chang, C. E., Solgaard, O., Howe, R. T. 2016; 2: 16019

  Abstract

  Compared with conventional planar optical image sensors, a curved focal plane array can simplify the lens design and improve the field of view. In this paper, we introduce the design and implementation of a segmented, hemispherical, CMOS-compatible silicon image plane for a 10-mm diameter spherical monocentric lens. To conform to the hemispherical focal plane of the lens, we use flexible gores that consist of arrays of spring-connected silicon hexagons. Mechanical functionality is demonstrated by assembling the 20-μm-thick silicon gores into a hemispherical test fixture. We have also fabricated and tested a photodiode array on a silicon-on-insulator substrate for use with the curved imager. Optical testing shows that the fabricated photodiodes achieve good performance; the hemispherical imager enables a compact 160 ° field of view camera with >80% fill factor using a single spherical lens.

  View details for DOI 10.1038/micronano.2016.19

  View details for PubMedID 31057822

  View details for PubMedCentralID PMC6444745

• Design and fabrication of silicon-tessellated structures for monocentric imagers MICROSYSTEMS & NANOENGINEERING Wu, T., Hamann, S. S., Ceballos, A. C., Chang, C., Solgaard, O., Howe, R. T. 2016; 2

  View details for DOI 10.1038/micronano.2016.19

  View details for Web of Science ID 000394942200001

• Stable Encapsulated Charge-Biased Resonators JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Ng, E. J., Harrison, K. L., Yang, Y., Ahn, C. H., Hong, V. A., Howe, R. T., Kenny, T. W. 2016; 25 (1): 30-37

  View details for DOI 10.1109/JMEMS.2015.2483365

  View details for Web of Science ID 000370763900003

• Engineering Ultra-Low Work Function of Graphene NANO LETTERS Yuan, H., Chang, S., Bargatin, I., Wang, N. C., Riley, D. C., Wang, H., Schwede, J. W., Provine, J., Pop, E., Shen, Z., Pianetta, P. A., Melosh, N. A., Howe, R. T. 2015; 15 (10): 6475-6480

  Abstract

  Low work function materials are critical for energy conversion and electron emission applications. Here, we demonstrate for the first time that an ultralow work function graphene is achieved by combining electrostatic gating with a Cs/O surface coating. A simple device is built from large-area monolayer graphene grown by chemical vapor deposition, transferred onto 20 nm HfO2 on Si, enabling high electric fields capacitive charge accumulation in the graphene. We first observed over 0.7 eV work function change due to electrostatic gating as measured by scanning Kelvin probe force microscopy and confirmed by conductivity measurements. The deposition of Cs/O further reduced the work function, as measured by photoemission in an ultrahigh vacuum environment, which reaches nearly 1 eV, the lowest reported to date for a conductive, nondiamond material.

  View details for DOI 10.1021/acs.nanolett.5b01916

  View details for PubMedID 26401728

• Thermionic and photon-enhanced emission energy conversion Melosh, N., Riley, D., Sahasrabuddhe, K., Shen, Z. X., Schwede, J., Howe, R. AMER CHEMICAL SOC. 2015

  View details for Web of Science ID 000432475703009

• Partitioning Electrostatic and Mechanical Domains in Nanoelectromechanical Relays JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Shavezipur, M., Harrison, K., Lee, W. S., Mitra, S., Wong, H. P., Howe, R. T. 2015; 24 (3): 592-598

  View details for DOI 10.1109/JMEMS.2014.2335157

  View details for Web of Science ID 000356520200015

• Tunable control of antibody immobilization using electric field. Proceedings of the National Academy of Sciences of the United States of America Emaminejad, S., Javanmard, M., Gupta, C., Chang, S., Davis, R. W., Howe, R. T. 2015; 112 (7): 1995-1999

  Abstract

  The controlled immobilization of proteins on solid-state surfaces can play an important role in enhancing the sensitivity of both affinity-based biosensors and probe-free sensing platforms. Typical methods of controlling the orientation of probe proteins on a sensor surface involve surface chemistry-based techniques. Here, we present a method of tunably controlling the immobilization of proteins on a solid-state surface using electric field. We study the ability to orient molecules by immobilizing IgG molecules in microchannels while applying lateral fields. We use atomic force microscopy to both qualitatively and quantitatively study the orientation of antibodies on glass surfaces. We apply this ability for controlled orientation to enhance the performance of affinity-based assays. As a proof of concept, we use fluorescence detection to indirectly verify the modulation of the orientation of proteins bound to the surface. We studied the interaction of fluorescently tagged anti-IgG with surface immobilized IgG controlled by electric field. Our study demonstrates that the use of electric field can result in more than 100% enhancement in signal-to-noise ratio compared with normal physical adsorption.

  View details for DOI 10.1073/pnas.1424592112

  View details for PubMedID 25650429

  View details for PubMedCentralID PMC4343132

• Integrated atomistic chemical imaging and reactive force field molecular dynamic simulations on silicon oxidation APPLIED PHYSICS LETTERS Dumpala, S., Broderick, S. R., Khalilov, U., Neyts, E. C., van Duin, A. C., Provine, J., Howe, R. T., Rajan, K. 2015; 106 (1)

  View details for DOI 10.1063/1.4905442

  View details for Web of Science ID 000347976900008

• Polyether Ether Ketone (PEEK) Fluidic Cell to Study Electrochemistry of Microelectrodes on Silicon Substrate ECS SOLID STATE LETTERS Arun, A., Gupta, C., Howe, R. 2015; 4 (10): P67-P71

  View details for DOI 10.1149/2.0021510ssI

  View details for Web of Science ID 000361272100001

• Microfabricated Thermally Isolated Low Work-Function Emitter JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Lee, J., Bargatin, I., Vancil, B. K., Gwinn, T. O., Maboudian, R., Melosh, N. A., Howe, R. T. 2014; 23 (5): 1182-1187

  View details for DOI 10.1109/JMEMS.2014.2307882

  View details for Web of Science ID 000343318500019

• Inherent Enhancement of Electronic Emission from Hexaboride Heterostructure PHYSICAL REVIEW APPLIED Voss, J., Vojvodic, A., Chou, S. H., Howe, R. T., Abild-Pedersen, F. 2014; 2 (2)

  View details for DOI 10.1103/PhysRevApplied.2.024004

  View details for Web of Science ID 000344331500001

• Improved Performance of Bottom-Contact Organic Thin-Film Transistor Using Al Doped HfO2 Gate Dielectric IEEE TRANSACTIONS ON ELECTRON DEVICES Tang, W. M., Aboudi, U., Provine, J., Howe, R. T., Wong, H. P. 2014; 61 (7): 2398-2403

  View details for DOI 10.1109/TED.2014.2325042

  View details for Web of Science ID 000338027200024

• Optical MEMS: From Micromirrors to Complex Systems JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Solgaard, O., Godil, A. A., Howe, R. T., Lee, L. P., Peter, Y., Zappe, H. 2014; 23 (3): 517-538

  View details for DOI 10.1109/JMEMS.2014.2319266

  View details for Web of Science ID 000337128200007

• DFT Study of Atomically-Modified Alkali-Earth Metal Oxide Films on Tungsten JOURNAL OF PHYSICAL CHEMISTRY C Chou, S. H., Voss, J., Vojvodic, A., Howe, R. T., Abild-Pedersen, F. 2014; 118 (21): 11303-11309

  View details for DOI 10.1021/jp4120578

  View details for Web of Science ID 000336771700017

• Double-Layer Silicon Photonic Crystal Fiber-Tip Temperature Sensors IEEE PHOTONICS TECHNOLOGY LETTERS Park, B., Jung, I. W., Provine, J., Gellineau, A., Landry, J., Howe, R. T., Solgaard, O. 2014; 26 (9): 900-903

  View details for DOI 10.1109/LPT.2014.2309345

  View details for Web of Science ID 000335819300003

• Depletion of cells and abundant proteins from biological samples by enhanced dielectrophoresis 17th International Conference on Solid-State Sensors, Actuators and Microsystems Javanmard, M., Emaminejad, S., Gupta, C., Provine, J., Davis, R. W., Howe, R. T. ELSEVIER SCIENCE SA. 2014: 918–24

  Abstract

  Platforms that are sensitive and specific enough to assay low-abundance protein biomarkers, in a high throughput multiplex format, within a complex biological fluid specimen, are necessary to enable protein biomarker based diagnostics for diseases such as cancer. The signal from an assay for a low-abundance protein biomarker in a biological fluid sample like blood is typically buried in a background that arises from the presence of blood cells and from high-abundance proteins that make up 90% of the assayed protein mass. We present an automated on-chip platform for the depletion of cells and highly abundant serum proteins in blood. Our platform consists of two components, the first of which is a microfluidic mixer that mixes beads containing antibodies against the highly abundant proteins in the whole blood. This complex mixture (consisting of beads, cells, and serum proteins) is then injected into the second component of our microfluidic platform, which comprises a filter trench to capture all the cells and the beads. The size-based trapping of the cells and beads into the filter trench is significantly enhanced by leveraging additional negative dielectrophoretic forces to push the micron sized particles (cells and beads which have captured the highly abundant proteins) down into the trench, allowing the serum proteins of lower abundance to flow through. In general, dielectrophoresis using bare electrodes is incapable of producing forces beyond the low piconewton range that tend to be insufficient for separation applications. However, by using electrodes passivated with atomic layer deposition, we demonstrate the application of enhanced negative DEP electrodes together with size-based flltration induced by the filter trench, to deplete 100% of the micron sized particles in the mixture.

  View details for DOI 10.1016/j.snb.2013.11.100

  View details for Web of Science ID 000330113600128

  View details for PubMedCentralID PMC4765371

• STABLE CHARGE-BIASED CAPACITIVE RESONATORS WITH ENCAPSULATED SWITCHES Ng, E. J., Harrison, K. L., Everhart, C. L., Hong, V. A., Yang, Y., Ahn, C., Heinz, D. B., Howe, R. T., Kenny, T. W., IEEE IEEE. 2014: 1277–80

  View details for Web of Science ID 000352217500325

• Analysis of Asperity Dominated Contacts in Nanoelectromechanical Relays Using Thin Films Harrison, K. L., Dalvi, C., Asheghi, M., Howe, R. T., IEEE IEEE. 2014: 1256–60

  View details for Web of Science ID 000366567000168

• Vacuum encapsulated resonators for humidity measurement SENSORS AND ACTUATORS B-CHEMICAL Hennessy, R. G., Shulaker, M. M., Messana, M., Graham, A. B., Klejwa, N., Provine, J., Kenny, T. W., Howe, R. T. 2013; 185: 575-581

  View details for DOI 10.1016/j.snb.2013.05.016

  View details for Web of Science ID 000321509600077

• Laterally Actuated Platinum-Coated Polysilicon NEM Relays JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Parsa, R., Lee, W. S., Shavezipur, M., Provine, J., Maboudian, R., Mitra, S., Wong, H. P., Howe, R. T. 2013; 22 (3): 768-778

  View details for DOI 10.1109/JMEMS.2013.2244779

  View details for Web of Science ID 000319827700029

• Thermionic current densities from first principles. journal of chemical physics Voss, J., Vojvodic, A., Chou, S. H., Howe, R. T., Bargatin, I., Abild-Pedersen, F. 2013; 138 (20): 204701-?

  Abstract

  We present a density functional theory-based method for calculating thermionic emission currents from a cathode into vacuum using a non-equilibrium Green's function approach. It does not require semi-classical approximations or crude simplifications of the electronic structure used in previous methods and thus provides quantitative predictions of thermionic emission for adsorbate-coated surfaces. The obtained results match well with experimental measurements of temperature-dependent current densities. Our approach can thus enable computational design of composite electrode materials.

  View details for DOI 10.1063/1.4805002

  View details for PubMedID 23742494

• Thermionic current densities from first principles. journal of chemical physics Voss, J., Vojvodic, A., Chou, S. H., Howe, R. T., Bargatin, I., Abild-Pedersen, F. 2013; 138 (20): 204701-?

  View details for DOI 10.1063/1.4805002

  View details for PubMedID 23742494

• Combinational Logic Design Using Six-Terminal NEM Relays IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS Lee, D., Lee, W. S., Chen, C., Fallah, F., Provine, J., Chong, S., Watkins, J., Howe, R. T., Wong, H. P., Mitra, S. 2013; 32 (5): 653-666

  View details for DOI 10.1109/TCAD.2012.2232707

  View details for Web of Science ID 000318163800001

• Photon-enhanced thermionic emission from heterostructures with low interface recombination. Nature communications Schwede, J. W., Sarmiento, T., NARASIMHAN, V. K., Rosenthal, S. J., Riley, D. C., Schmitt, F., Bargatin, I., Sahasrabuddhe, K., Howe, R. T., Harris, J. S., Melosh, N. A., Shen, Z. 2013; 4: 1576-?

  Abstract

  Photon-enhanced thermionic emission is a method of solar-energy conversion that promises to combine photon and thermal processes into a single mechanism, overcoming fundamental limits on the efficiency of photovoltaic cells. Photon-enhanced thermionic emission relies on vacuum emission of photoexcited electrons that are in thermal equilibrium with a semiconductor lattice, avoiding challenging non-equilibrium requirements and exotic material properties. However, although previous work demonstrated the photon-enhanced thermionic emission effect, efficiency has until now remained very low. Here we describe electron-emission measurements on a GaAs/AlGaAs heterostructure that introduces an internal interface, decoupling the basic physics of photon-enhanced thermionic emission from the vacuum emission process. Quantum efficiencies are dramatically higher than in previous experiments because of low interface recombination and are projected to increase another order of magnitude with more stable, low work-function coatings. The results highlight the effectiveness of the photon-enhanced thermionic emission process and demonstrate that efficient photon-enhanced thermionic emission is achievable, a key step towards realistic photon-enhanced thermionic emission based energy conversion.

  View details for DOI 10.1038/ncomms2577

  View details for PubMedID 23481384

• Dual-beam six-terminal nanoelectromechanical relays Harrison, K., L., Lee, W., S., Shavezipur, K., Provine, J., Mitra, S., Wong, H., S. P., Howe, R. T. 2013
• SUB-10 NANOMETER UNCOOLED PLATINUM BOLOMETERS VIA PLASMA ENHANCED ATOMIC LAYER DEPOSITION Purkl, F., English, T., Yama, G., Provine, J., Samarao, A. K., Feyh, A., O'Brien, G., Ambacher, O., Howe, R. T., Kenny, T. W., IEEE IEEE. 2013: 185–88

  View details for Web of Science ID 000320549200048

• Photon-enhanced thermionic emission from heterostructures with low interface recombination. Nature communications Schwede, J. W., Sarmiento, T., NARASIMHAN, V. K., Rosenthal, S. J., Riley, D. C., Schmitt, F., Bargatin, I., Sahasrabuddhe, K., Howe, R. T., Harris, J. S., Melosh, N. A., Shen, Z. 2013; 4: 1576-?

  Abstract

  Photon-enhanced thermionic emission is a method of solar-energy conversion that promises to combine photon and thermal processes into a single mechanism, overcoming fundamental limits on the efficiency of photovoltaic cells. Photon-enhanced thermionic emission relies on vacuum emission of photoexcited electrons that are in thermal equilibrium with a semiconductor lattice, avoiding challenging non-equilibrium requirements and exotic material properties. However, although previous work demonstrated the photon-enhanced thermionic emission effect, efficiency has until now remained very low. Here we describe electron-emission measurements on a GaAs/AlGaAs heterostructure that introduces an internal interface, decoupling the basic physics of photon-enhanced thermionic emission from the vacuum emission process. Quantum efficiencies are dramatically higher than in previous experiments because of low interface recombination and are projected to increase another order of magnitude with more stable, low work-function coatings. The results highlight the effectiveness of the photon-enhanced thermionic emission process and demonstrate that efficient photon-enhanced thermionic emission is achievable, a key step towards realistic photon-enhanced thermionic emission based energy conversion.

  View details for DOI 10.1038/ncomms2577

  View details for PubMedID 23481384

• Engineering an electrochemical sensor for the characterization of bond vibration frequencies of a chemical analyte. Gupta, C., Chang, S., Howe, R., T. 2013
• Serpentine geometry for enhanced performance of nanometer-thin platinum bolometers Purkl, F., English, T., S., Yama, G., Provine, J., Samarao, A., Feyh, A., Howe, R. T. 2013
• Ultra-thin atomic layer deposition films for corrosion resistance Haemmerli, A., J., Doll, J., C., Provine, J., Howe, R., T., Goldhaber-Gordon, D., Pruitt, B., L. 2013
• Immobilization of antibodies on solid-state surfaces with controlled orientation using electric field Javanmard, M., Emaminjad, S., Gupta, C., Chang, S., Davis, R., W., Howe, R., T. 2013
• Three stage sample preparation for purificaiton of proteins from complex biological samples IEEE Sensors 2013, Baltimore, Maryland Javanmard, M., Emaminejad, S., Davis, R., W., Gupta, C., Howe, R., T. 2013: 1-4
• Applications of nanonewton dielectrophoresis forces using atomic layer deposted oxides for microfluidic sample preparation and proteomics Emaminejad, S., Javanmard, M., Gupta, C., Dutton, R., W., Davis, R., W., Howe, R., T. 2013
• Ultra dielectrophoresis: electrothermal analysis and its applications in microfluidic sample preparation and proteomics Emaminejad, S., Javanmard, M., Gupta, C., Davis, R., W, Howe, R., T. 2013
• Capacitive Accelerometer Laboratory Using Polymer-Film Rapid Prototyping Technology 3rd Interdisciplinary Engineering Design Education Conference (IEDEC) Gellineau, A. A., Rastegar, A. J., Howe, R. T. IEEE. 2013: 79–82

  View details for Web of Science ID 000325586800016

• Microbead-separated thermionic energy converter with enhanced emission current PHYSICAL CHEMISTRY CHEMICAL PHYSICS Littau, K. A., Sahasrabuddhe, K., Barfield, D., Yuan, H., Shen, Z., Howe, R. T., Melosh, N. A. 2013; 15 (34): 14442-14446

  Abstract

  The efficiency of thermionic energy converters is a strong function of the inter-electrode separation due to space-charge limitations. Here we demonstrate vacuum thermionic energy converters constructed using barium dispenser cathodes and thin film tungsten anodes, separated by size specific alumina microbeads for simple device fabrication and inter-electrode gap control. The current and device efficiency at the maximum power point are strongly dependent on the inter-electrode gap, with a maximum device efficiency of 0.61% observed for a gap on the order of 5 μm. Paths to further reductions in space charge and improved anode work function are outlined with potential for over an order of magnitude improvement in output power and efficiency.

  View details for DOI 10.1039/c3cp52895b

  View details for Web of Science ID 000322725000036

  View details for PubMedID 23881241

• LATERALLY ACTUATED NANOELECTROMECHANICAL RELAYS WITH COMPLIANT, LOW RESISTANCE CONTACT 26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Shavezipur, M., Lee, W. S., Harrison, K. L., Provine, J., Mitra, S., Wong, H. P., Howe, R. T. IEEE. 2013: 520–523

  View details for Web of Science ID 000320549200133

• An orbital-overlap model for minimal work functions of cesiated metal surfaces JOURNAL OF PHYSICS-CONDENSED MATTER Chou, S. H., Voss, J., Bargatin, I., Vojvodic, A., Howe, R. T., Abild-Pedersen, F. 2012; 24 (44)

  Abstract

  We introduce a model for the effect of cesium adsorbates on the work function of transition metal surfaces. The model builds on the classical point-dipole equation by adding exponential terms that characterize the degree of orbital overlap between the 6s states of neighboring cesium adsorbates and its effect on the strength and orientation of electric dipoles along the adsorbate-substrate interface. The new model improves upon earlier models in terms of agreement with the work function-coverage curves obtained via first-principles calculations based on density functional theory. All the cesiated metal surfaces have optimal coverages between 0.6 and 0.8 monolayers, in accordance with experimental data. Of all the cesiated metal surfaces that we have considered, tungsten has the lowest minimum work function, also in accordance with experiments.

  View details for DOI 10.1088/0953-8984/24/44/445007

  View details for Web of Science ID 000310571100009

  View details for PubMedID 23018485

• A model for emission yield from planar photocathodes based on photon-enhanced thermionic emission or negative-electron-affinity photoemission JOURNAL OF APPLIED PHYSICS Sahasrabuddhe, K., Schwede, J. W., Bargatin, I., Jean, J., Howe, R. T., Shen, Z., Melosh, N. A. 2012; 112 (9)

  View details for DOI 10.1063/1.4764106

  View details for Web of Science ID 000311968400139

• Control of DNA Capture by Nanofluidic Transistors ACS NANO Paik, K., Liu, Y., Tabard-Cossa, V., Waugh, M. J., Huber, D. E., Provine, J., Howe, R. T., Dutton, R. W., Davis, R. W. 2012; 6 (8): 6767-6775

  Abstract

  We report the use of an array of electrically gated ~200 nm solid-state pores as nanofluidic transistors to manipulate the capture and passage of DNA. The devices are capable of reversibly altering the rate of DNA capture by over 3 orders of magnitude using sub-1 V biasing of a gate electrode. This efficient gating originates from the counter-balance of electrophoresis and electroosmosis, as revealed by quantitative numerical simulations. Such a reversible electronically tunable biomolecular switch may be used to manipulate nucleic acid delivery in a fluidic circuit, and its development is an important first step toward active control of DNA motion through solid-state nanopores for sensing applications.

  View details for DOI 10.1021/nn3014917

  View details for Web of Science ID 000307988900029

  View details for PubMedID 22762282

  View details for PubMedCentralID PMC3429714

• Microencapsulation of silicon cavities using a pulsed excimer laser JOURNAL OF MICROMECHANICS AND MICROENGINEERING Sedky, S., Tawfik, H., Ashour, M., Graham, A. B., Provine, J., Wang, Q., Zhang, X. X., Howe, R. T. 2012; 22 (7)

  View details for DOI 10.1088/0960-1317/22/7/075012

  View details for Web of Science ID 000305890600026

• Smart-cut layer transfer of single-crystal SiC using spin-on-glass JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B Lee, J., Bargatin, I., Park, J., Milaninia, K. M., Theogarajan, L. S., Sinclair, R., Howe, R. T. 2012; 30 (4)

  View details for DOI 10.1116/1.4734006

  View details for Web of Science ID 000306750700046

• Single crystal silicon nanopillars, nanoneedles and nanoblades with precise positioning for massively parallel nanoscale device integration NANOTECHNOLOGY Roper, C. S., Gutes, A., Carraro, C., Howe, R. T., Maboudian, R. 2012; 23 (22)

  Abstract

  Arrays of precisely positioned single crystal silicon nanopillars, nanoneedles, and nanoblades with minimum feature sizes as small as 30 nm are fabricated using entirely scalable top-down fabrication techniques. Using the same scalable technologies, devices consisting of electrically connected silicon nanopillars with multiple addressable electrodes for each nanostructure are realized. The arrays of nanopillars, nanoneedles, and nanoblades are shown to exhibit Raman signal enhancement on 1,2-benzenedithiol monolayers, opening a path to nanodevices that manipulate, position, detect and analyze molecules.

  View details for DOI 10.1088/0957-4484/23/22/225303

  View details for Web of Science ID 000305160300005

• A dry wafer-reconstitution process with zero insertion force by embedded alignment guide tabs JOURNAL OF MICROMECHANICS AND MICROENGINEERING Chen, J. P., Provine, J., Klejwa, N., Howe, R. T. 2012; 22 (6)

  View details for DOI 10.1088/0960-1317/22/6/065007

  View details for Web of Science ID 000304609600007

• A micromachining-based technology for enhancing germanium light emission via tensile strain NATURE PHOTONICS Jain, J. R., Hryciw, A., Baer, T. M., Miller, D. A., Brongersma, M. L., Howe, R. T. 2012; 6 (6): 398-405

  View details for DOI 10.1038/NPHOTON.2012.111

  View details for Web of Science ID 000304598200018

• Optimal emitter-collector gap for thermionic energy converters APPLIED PHYSICS LETTERS Lee, J., Bargatin, I., Melosh, N. A., Howe, R. T. 2012; 100 (17)

  View details for DOI 10.1063/1.4707379

  View details for Web of Science ID 000303340300106

• Application of principal component analysis to a full profile correlative analysis of FTIR spectra SURFACE AND INTERFACE ANALYSIS Broderick, S. R., Suh, C., Provine, J., Roper, C. S., Maboudian, R., Howe, R. T., Rajan, K. 2012; 44 (3): 365-371

  View details for DOI 10.1002/sia.3813

  View details for Web of Science ID 000303250500014

• Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness NANO LETTERS Yoneoka, S., Lee, J., Liger, M., Yama, G., Kodama, T., Gunji, M., Provine, J., Howe, R. T., Goodson, K. E., Kennyt, T. W. 2012; 12 (2): 683-686

  Abstract

  While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.

  View details for DOI 10.1021/nl203548w

  View details for PubMedID 22224582

• Integration of Nanoelectromechanical Relays With Silicon nMOS IEEE TRANSACTIONS ON ELECTRON DEVICES Chong, S., Lee, B., Mitra, S., Howe, R. T., Wong, H. P. 2012; 59 (1): 255-258

  View details for DOI 10.1109/TED.2011.2172946

  View details for Web of Science ID 000298756100038

• Nano-Electro-Mechanical Relays for FPGA Routing: Experimental Demonstration and a Design Technique Chen, C., Lee, W., Parsa, R., Chong, S., Provine, J., Watt, J., Howe, R. T., Wong, H., Mitra, S., IEEE IEEE. 2012: 1361–66

  View details for Web of Science ID 000415126300278

• CVD hafnium diboride as a contact material for nano-electromechanical switches Lee, W., S., Cloud, A., N., Provine, J., Tayebi, N., Parsa, R., Mitra, S., Howe, R. T. 2012
• Nano-electro-mechanical relays for FPGA routing: experimental demonstration and a design technique Chen, C., Lee, W., S., Parsa, R., Chong, S., Provine, J., Watt, J., Howe, R. T. 2012
• Encapsulated thermionic energy converter with stiffened suspension Lee, J., H., Bargatin,  I., Iwami, K., Littau, K., A., Vincent, M., Maboudian, R., Howe, R. T. 2012
• Sidewall silicon carbide emitters for terahertz vacuum electronics Snapp, J., P., Lee, J., H., Provine, J., Bargatin, I., Maboudian,  R., Lee, T., H., Howe, R. T. 2012
• Electrochemical quantum tunneling for electronic detection and characterization of biological toxins Gupta, C., Walker, R., M., Gharpuray, R., Shulaker, M., M., Zhang, Z., Javanmard, M., Howe, R. T. 2012
• Multiband charge-coupled device Chang, C., E., Siegel, J., D., Kenney, C., J., Roodman, A., J., Howe, R., T. 2012
• Smart-cut layer transfer of single-crystal SiC using spin-on-glass J. Vacuum Sci. Tech. B: Microelectronics and Nanometer Structures Lee, J., H., Bargatin, Igor, I., Park, J., Milaninia, K., M., Theogarajan, L., S., Sinclair, R., Howe, R. T. 2012; 30: 42001
• Multiband Charge-Coupled Device IEEE Nuclear Science Symposium / Medical Imaging Conference Record (NSS/MIC) / 19th Room-Temperature Semiconductor X-ray and Gamma-ray Detector Workshop Chang, C., Segal, J. D., Roodman, A. J., Howe, R. T., Kenney, C. J. IEEE. 2012: 743–746

  View details for Web of Science ID 000326814200155

• Electrochemical quantum tunneling for electronic detection and characterization of biological toxins Conference on Micro- and Nanotechnology Sensors, Systems, and Applications IV Gupta, C., Walker, R. M., Gharpuray, R., Shulaker, M. M., Zhang, Z., Javanmard, M., Davis, R. W., Murmann, B., Howe, R. T. SPIE-INT SOC OPTICAL ENGINEERING. 2012

  View details for DOI 10.1117/12.920692

  View details for Web of Science ID 000306560400002

• Nano-Electro-Mechanical (NEM) Relays and their Application to FPGA Routing 17th Asia and South Pacific Design Automation Conference (ASP-DAC) Chen, C., Lee, S., Provine, J., Chong, S., Parsa, R., Lee, D., Howe, R. T., Wong, H. P., Mitra, S. IEEE. 2012: 639–639

  View details for Web of Science ID 000309240000115

• MICROFABRICATED SILICON CARBIDE THERMIONIC ENERGY CONVERTER FOR SOLAR ELECTRICITY GENERATION 25th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Lee, J. H., Bargatin, I., Gwinn, T. O., Vincent, M., Littau, K. A., Maboudian, R., Shen, Z., Melosh, N. A., Howe, R. T. IEEE. 2012

  View details for Web of Science ID 000312912800317

• Electrical Properties of CuPc-based OTFTs with Atomic Layer Deposited HfAlO Gate Dielectric 8th IEEE International Conference on Electron Devices and Solid State Circuit (EDSSC) Tang, W. M., Aboudi, U., Provine, J., Howe, R. T., Wong, H. P. IEEE. 2012

  View details for Web of Science ID 000318549000101

• Double-Layer Silicon Photonic Crystal Fiber Tip Temperature Sensor 25th IEEE Photonics Conference (IPC) Park, B., Jung, I. W., Provine, J., Howe, R. T., Solgaard, O. IEEE. 2012: 550–551

  View details for Web of Science ID 000312865000274

• Photonic Crystal Fiber Tip Sensor for High-Temperature Measurement IEEE SENSORS JOURNAL Park, B., Provine, J., Jung, I. W., Howe, R. T., Solgaard, O. 2011; 11 (11): 2643-2648

  View details for DOI 10.1109/JSEN.2011.2153844

  View details for Web of Science ID 000304162300004

• Tensile-strained germanium-on-insulator substrate fabrication for silicon-compatible optoelectronics OPTICAL MATERIALS EXPRESS Jain, J. R., Ly-Gagnon, D., Balram, K. C., White, J. S., Brongersma, M. L., Miller, D. A., Howe, R. T. 2011; 1 (6): 1121-1126

  View details for Web of Science ID 000299048700007

• Multilayered Monolithic Silicon Photonic Crystals IEEE PHOTONICS TECHNOLOGY LETTERS Mallick, S. B., Jung, I. W., Meisner, A. M., Provine, J., Howe, R. T., Solgaard, O. 2011; 23 (11): 730-732

  View details for DOI 10.1109/LPT.2011.2132698

  View details for Web of Science ID 000290629800008

• Highly Sensitive Monolithic Silicon Photonic Crystal Fiber Tip Sensor for Simultaneous Measurement of Refractive Index and Temperature JOURNAL OF LIGHTWAVE TECHNOLOGY Jung, I. W., Park, B., Provine, J., Howe, R. T., Solgaard, O. 2011; 29 (9): 1367-1374

  View details for DOI 10.1109/JLT.2011.2126018

  View details for Web of Science ID 000289802300007

• AC Polarization for Charge-Drift Elimination in Resonant Electrostatic MEMS and Oscillators JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Bahl, G., Salvia, J. C., Melamud, R., Kim, B., Howe, R. T., Kenny, T. W. 2011; 20 (2): 355-364

  View details for DOI 10.1109/JMEMS.2010.2100027

  View details for Web of Science ID 000289205400002

• Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators with Integrated Actuation Electrodes IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Chen, K., Wang, S., Salvia, J. C., Melamud, R., Howe, R. T., Kenny, T. W. 2011; 1 (3): 310-317

  View details for DOI 10.1109/TCPMT.2010.2100711

  View details for Web of Science ID 000292780700004

• Electromechanical Sensing of Charge Retention on Floating Electrodes JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Elata, D., Leus, V., Provine, J., Hirshberg, A., Howe, R. T. 2011; 20 (1): 150-156

  View details for DOI 10.1109/JMEMS.2010.2090499

  View details for Web of Science ID 000286934900020

• Magnetic, Mechanical, and Optical Characterization of a Magnetic Nanoparticle-Embedded Polymer for Microactuation JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Tsai, K. L., Ziaei-Moayyed, M., Candler, R. N., Hu, W., Brand, V., Klejwa, N., Wang, S. X., Howe, R. T. 2011; 20 (1): 65-72

  View details for DOI 10.1109/JMEMS.2010.2093560

  View details for Web of Science ID 000286934900012

• NANOELECTROMECHANICAL RELAYS WITH DECOUPLED ELECTRODE AND SUSPENSION 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Parsa, R., Shavezipur, M., Lee, W. S., Chong, S., Lee, D., Wong, H. P., Maboudian, R., Howe, R. T. IEEE. 2011: 1361–1364

  View details for Web of Science ID 000295841200340

• A reel-to-reel printed accelerometer Klejwa, N., Hennessy, R., G., Chen, J., W. P., Howe, R., T. 2011
• Low thermal-budget silicon sealed-cavity microencapsulation process Sedky, S., Tawfik, H., Aziz, A., Abdel, ElSaegh, S., Graham, A., B., Provine, J., Howe, R. T. 2011
• Spacer technique for low-voltage, high-aspect-ratio lateral electrostatic actuators Lee, D., Mitra, S., Howe, R., T., Wong, H., S. P. 2011
• Vacuum microsystems for energy conversion and other applications Howe, R., T. 2011
• Atomic layer deposition of Al2O3 to protect carbon nanotubes for integration with top-down fabrication Shulaker, M., M., Provine, J., Howe, R., T., Mitra, S. 2011
• Effect of illumination on thermionic emission of microfabricated silicon carbide structures Lee, J., H., Bargatin, I., Provine, J., Liu, F., Seo, M., K., Maboudian, R., Howe, R. T. 2011
• Dual sidewall lateral nanoelectromechanical relays with beam isolation Lee, W., S., Chong, S., Parsa, R., Provine, J., Lee, D., Mitra, S., Howe, R. T. 2011
• Suppression of wear in cyclically loaded polycrystalline silicon via a thin silicon carbide coating Laboriante, I., Klejwa, N., Suwandi, A., Carraro, C., Howe, R., T., Maboudian, R. 2011
• Temperature dependence of vacuum encapsulated resonators for humidity measurement Hennessy, R., G., Shulaker, M., M., Messana, M., W., Graham, A., B., Klejwa, N., Provine, J., Howe, R. T. 2011
• Double-layered monolithic silicon photonic crystal fiber tip sensor Park, B., Jung, I., W., Provine, J., Howe, R., T., Solgaard, O. 2011
• ALD-METAL UNCOOLED BOLOMETER 24th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Yoneoka, S., Liger, M., Yama, G., Schuster, R., Purkl, F., Provine, J., Prinz, F. B., Howe, R. T., Kenny, T. W. IEEE. 2011: 676–679

  View details for Web of Science ID 000295841200168

• Double-Layer Silicon Photonic Crystal Fiber Tip Sensor 16th International Conference on Optical MEMS and Nanophotonics (OMN) Park, B., Jung, I. W., Provine, J., Shambat, G., Vuckovic, J., Howe, R. T., Solgaard, O. IEEE. 2011: 97–98

  View details for Web of Science ID 000297850100040

• Integration of Nanoelectromechanical (NEM) Relays with Silicon CMOS with Functional CMOS-NEM Circuit IEEE International Electron Devices Meeting (IEDM) Chong, S., Lee, B., Parizi, K. B., Provine, J., Mitra, S., Howe, R. T., Wong, H. P. IEEE. 2011

  View details for Web of Science ID 000300015300177

• Experimental Demonstration and Analysis of DNA Passage in Nanopore-based Nanofluidic Transistors IEEE International Electron Devices Meeting (IEDM) Paik, K., Liu, Y., Tabard-Cossa, V., Huber, D. E., Provine, J., Howe, R. T., Davis, R. W., Dutton, R. W. IEEE. 2011

  View details for Web of Science ID 000300015300178

• Differential internal dielectric transduction of a Lame-mode resonator JOURNAL OF MICROMECHANICS AND MICROENGINEERING Ziaei-Moayyed, M., Elata, D., Quevy, E. P., Howe, R. T. 2010; 20 (11)

  View details for DOI 10.1088/0960-1317/20/11/115036

  View details for Web of Science ID 000283691600037

• Photon-enhanced thermionic emission for solar concentrator systems NATURE MATERIALS Schwede, J. W., Bargatin, I., Riley, D. C., Hardin, B. E., Rosenthal, S. J., Sun, Y., Schmitt, F., Pianetta, P., Howe, R. T., Shen, Z., Melosh, N. A. 2010; 9 (9): 762-767

  Abstract

  Solar-energy conversion usually takes one of two forms: the 'quantum' approach, which uses the large per-photon energy of solar radiation to excite electrons, as in photovoltaic cells, or the 'thermal' approach, which uses concentrated sunlight as a thermal-energy source to indirectly produce electricity using a heat engine. Here we present a new concept for solar electricity generation, photon-enhanced thermionic emission, which combines quantum and thermal mechanisms into a single physical process. The device is based on thermionic emission of photoexcited electrons from a semiconductor cathode at high temperature. Temperature-dependent photoemission-yield measurements from GaN show strong evidence for photon-enhanced thermionic emission, and calculated efficiencies for idealized devices can exceed the theoretical limits of single-junction photovoltaic cells. The proposed solar converter would operate at temperatures exceeding 200 degrees C, enabling its waste heat to be used to power a secondary thermal engine, boosting theoretical combined conversion efficiencies above 50%.

  View details for DOI 10.1038/NMAT2814

  View details for Web of Science ID 000281178400029

  View details for PubMedID 20676086

• Characterization of Encapsulated Micromechanical Resonators Sealed and Coated With Polycrystalline SiC JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Yoneoka, S., Roper, C. S., Candler, R. N., Chandorkar, S. A., Graham, A. B., Provine, J., Maboudian, R., Howe, R. T., Kenny, T. W. 2010; 19 (2): 357-366

  View details for DOI 10.1109/JMEMS.2010.2040460

  View details for Web of Science ID 000276257700014

• Model and Observations of Dielectric Charge in Thermally Oxidized Silicon Resonators JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Bahl, G., Melamud, R., Kim, B., Chandorkar, S. A., Salvia, J. C., Hopcroft, M. A., Elata, D., Hennessy, R. G., Candler, R. N., Howe, R. T., Kenny, T. W. 2010; 19 (1): 162-174

  View details for DOI 10.1109/JMEMS.2009.2036274

  View details for Web of Science ID 000274213700016

• A Method for Wafer-Scale Encapsulation of Large Lateral Deflection MEMS Devices JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Graham, A. B., Messana, M. W., Hartwell, P. G., Provine, J., Yoneoka, S., Melamud, R., Kim, B., Howe, R. T., Kenny, T. W. 2010; 19 (1): 28-37

  View details for DOI 10.1109/JMEMS.2009.2035717

  View details for Web of Science ID 000274213700003

• CHARGE-DRIFT ELIMINATION IN RESONANT ELECTROSTATIC MEMS 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Bahl, G., Salvia, J., Bargatin, I., Yoneoka, S., Melamud, R., Kim, B., Chandorkar, S., Hopcroft, M. A., Bahl, R., Howe, R. T., Kenny, T. W. IEEE. 2010: 108–111

  View details for Web of Science ID 000278416400025

• Electromechanical Sensing of Charge Retention on Floating Electrodes 2010 IEEE Sensors Conference Elata, D., Leus, V., Hirshberg, A., Provine, J., Howe, R. T. IEEE. 2010: 1395–1398

  View details for Web of Science ID 000287982100307

• Time evolution of released hole arrays into membranes via vacuum silicon migration Provine, J., Ferralis, N., Graham, A., B., Messana, M., W., Kang, R., Maboudian, R., Howe, R. T. 2010
• Packaging of large lateral deflection MEMS using a combination of fusion bonding and epitaxial reactor sealing Messana, M., W., Graham, A., B., Yoneoka, S., Howe, R., T., Kenny, T., W. 2010
• Four-mask process based on spacer technology for scaled-down electrostatic actuators Lee, D., Lee, W., S., Mitra, S., Howe, R., T., Wong, H., S. P. 2010
• Vacuum encapsulated resonators for humidity measurement Hennessy, R., G., Shulaker, M., M., Melamud, R., Klejwa, N., Chandorkar, S., Kim, B., Howe, R. T. 2010
• Heterodyned electrostatic transduction oscillators evade low frequency noise aliasing Bahl, G., Salvia, J., Lee, H., K., Melamud, R., Kim, B., Howe, R., T. 2010
• Single-step, wafer-scale, hermetic sealing using silicon migration, to be presented at the Kant, R., Choo, H., Howe, R., T. 2010
• Composite polysilicon-platinum lateral nanoelectromechanical relays Parsa, R., Akarvardar, K., Provine, J., Lee, D., Elata, D., Mitra, S., Howe, R. T. 2010
• 2D analytical model for the study of NEM relay device scaling Shen, X., Chong, S., Lee, D., Parsa, R., Howe, R., T., Wong, H., S. P. 2010
• Non-adiabatic electronic relaxation events at monolayer-modified electrode-electrolyte interfaces: physics and applications Gupta, C., Howe, R., T., Shannon, M., A. 2010
• Higher-order Dielectrically Transduced Bulk-mode Ring Resonator with Low Motional Resistance 2010 IEEE International Frequency Control Symposium Ziaei-Moayyed, M., Howe, R. T. IEEE. 2010: 19–24

  View details for Web of Science ID 000287378700005

• pH Sensor Demonstrating a Layout Programmable Squeeze Pumped Microfluidic Platform 2010 IEEE Sensors Conference Klejwa, N., Provine, J., Howe, R. T. IEEE. 2010: 936–939

  View details for Web of Science ID 000287982100208

• EFFICIENT INTERNAL ELECTROSTATIC TRANSDUCTION OF THE 41(ST) RADIAL MODE OF A RING RESONATOR 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Ziaei-Moayyed, M., Quevy, E. P., Hsieh, J., Howe, R. T. IEEE. 2010: 711–714

  View details for Web of Science ID 000278416400176

• Efficient FPGAs using Nanoelectromechanical Relays 18th ACM International Symposium on Field-Programmable Gate Arrays Chen, C., Parsa, R., Patil, N., Chong, S., Akarvardar, K., Provine, J., Lewis, D., Watt, J., Howe, R. T., Wong, H. P., Mitra, S. ASSOC COMPUTING MACHINERY. 2010: 273–282

  View details for Web of Science ID 000285022000035

• TITANIUM NITRIDE SIDEWALL STRINGER PROCESS FOR LATERAL NANOELECTROMECHANICAL RELAYS 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Lee, D., Lee, W. S., Provine, J., Lee, J., Yoon, J., Howe, R. T., Mitra, S., Wong, H. P. IEEE. 2010: 456–459

  View details for Web of Science ID 000278416400112

• High Temperature Photonic Crystal Fiber Tip Sensor 2010 IEEE Sensors Conference Park, B., Provine, J., Howe, R. T., Solgaard, O., Jung, I. W. IEEE. 2010: 970–974

  View details for Web of Science ID 000287982100215

• Monolithic Silicon Photonic Crystal Fiber Tip Sensor for Refractive Index and Temperature Sensing Conference on Lasers and Electro-Optics (CLEO)/Quantum Electronics and Laser Science Conference (QELS) Park, B., Jung, I. W., Provine, J., Howe, R. T., Solgaard, O. IEEE. 2010

  View details for Web of Science ID 000290513600412

• Laser print patterning of planar spiral inductors and interdigitated capacitors JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B Klejwa, N., Misra, R., Provine, J., Howe, R. T., Klejwa, S. J. 2009; 27 (6): 2745-2749

  View details for DOI 10.1116/1.3264673

  View details for Web of Science ID 000272803400084

• Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS Devices IEEE TRANSACTIONS ON ADVANCED PACKAGING Chen, K., Salvia, J., Potter, R., Howe, R. T., Kenny, T. W. 2009; 32 (2): 402-409

  View details for DOI 10.1109/TADVP.2008.2005114

  View details for Web of Science ID 000266778000018

• Photonic Crystal Fiber Tip Sensor for Precision Temperature Sensing 22nd Annual Meeting of the IEEE-Photonics-Society Jung, I. W., Park, B., Provine, J., Howe, R. T., Solgaard, O. IEEE. 2009: 761–762

  View details for Web of Science ID 000279577600388

• Magnetic nanoparticle-driven pumping in microchannels Tsai, K., L., Pickard, D., Kao, J., Yin, X., Leen, B., Knutson, K., Howe, R. T. 2009
• Thermionic emission from microfabricated silicon carbide filaments Lee, J., H., Bargatin, I., Provine, J., Howe, R., T., Clay, W., A., Melosh, N., A. 2009
• WAFER SCALE ENCAPSULATION OF LARGE LATERAL DEFLECTION MEMS STRUCTURES 22nd International Conference on Micro Electro Mechanical Systems (MEMS) Graham, A. B., Messana, M., Hartwell, P., Provine, J., Yoneoka, S., Kim, B., Melamud, R., Howe, R. T., Kenny, T. W. IEEE. 2009: 745–748

  View details for Web of Science ID 000341431500186

• FULLY DIFFERENTIAL INTERNAL ELECTROSTATIC TRANSDUCTION OF A LAME-MODE RESONATOR 22nd International Conference on Micro Electro Mechanical Systems (MEMS) Ziaei-Moayyed, M., Elata, D., Hsieh, J., Chen, J. P., Quevy, E. P., Howe, R. T. IEEE. 2009: 931–934

  View details for Web of Science ID 000341431500233

• EPITAXIAL SILICON MICROSHELL VACUUM-ENCAPSULATED CMOS-COMPATIBLE 200 MHz BULK-MODE RESONATOR 22nd International Conference on Micro Electro Mechanical Systems (MEMS) Chen, K., Chandrahalim, H., Graham, A. B., Bhave, S. A., Howe, R. T., Kenny, T. W. IEEE. 2009: 23–26

  View details for Web of Science ID 000341431500006

• Structural transformation of silicon due to hydrogen ambient during germanium epitaxy on silicon nano-pillars Thareja, G., Kant, R., Howe, R., Nishi, Y. 2009
• Nanoelectromechanical (NEM) relays integrated with SRAM for improved stability and low leakage Chong, S., Akarvardar, K., Parsa, R., Yoon, J., B., Howe, R., T., Mitra, S. 2009
• Laser print patterning of planar spiral inductors Klejwa, N., Misra, R., Klejwa, S., J., Howe, R., T. 2009
• Simultaneous wafer-scale vacuum encapsulation and microstructure cladding with LPCVD polycrystalline 3C-SiC Roper, C., S., Candler, R., Yoneoka, S., Kenny, T., Howe, R., T., Maboudian, R. 2009
• Encapsulated out-of-plane differential square-plate resonators with integrated actuation electrodes Chen, K., L., Wang, S., Salvia, J., Howe, R., T., Kenny, T., W. 2009
• Wafer reconstitution with precision dry front-to-front registration Chen, J., W. P., Howe, R., T. 2009
• Microfluidic device with integrated nanopores for protein detection Zangle, T., A., Kant, R., Howe, R., T., Santiago, J., G. 2009
• Laser-printed magnetic-polymer microstructures Klejwa, N., Misra, R., Provine, J., Klejwa, S., J., Zhang, M., Wang, S., X., Howe, R. T. 2009
• Suspended microstructures made using silicon microstructures Kant, R., Ziaei-Moayyed, M., Howe, R., T. 2009
• Epitaxial growth of graphene on high topology SiC structures patterned by focused ion beam Provine, J., Ferralis, N., Klejwa, N., Carraro, C., Maboudian, R., Howe, R., T. 2009
• Higher-order mode internal electrostatic transduction of a bulk-mode ring resonator on a quartz substrate Ziaei-Moayyed, M., Hsieh, J., Chen, J., W. P., Quévy, E., P., Elata, D., Howe, R., T. 2009
• Monolithic Silicon Photonic Crystal Slab Fiber Tip Sensor Jung, I., W., Park, B., Provine, J., Howe, R., T., Solgaard, O. 2009
• Room-Temperature Wet Etching of Polycrystalline and Nanocrystalline Silicon Carbide Thin Films with HF and HNO3 JOURNAL OF THE ELECTROCHEMICAL SOCIETY Roper, C. S., Howe, R. T., Maboudian, R. 2009; 156 (3): D104-D107

  View details for DOI 10.1149/1.3061944

  View details for Web of Science ID 000265837900044

• Experimental Investigation of Silicon Surface Migration in Low Pressure Nonreducing Gas Environments ELECTROCHEMICAL AND SOLID STATE LETTERS Kant, R., Ferralis, N., Provine, J., Maboudian, R., Howe, R. T. 2009; 12 (12): H437-H440

  View details for DOI 10.1149/1.3236781

  View details for Web of Science ID 000270915300022

• Electrical and Mechanical Characterization of Doped and Annealed Polycrystalline 3C-SiC Thin Films JOURNAL OF THE ELECTROCHEMICAL SOCIETY Roper, C. S., Radmilovic, V., Howe, R. T., Maboudian, R. 2009; 156 (1): D5-D10

  View details for DOI 10.1149/1.3000002

  View details for Web of Science ID 000261209800048

• Characterization of polycrystalline 3C-SiC films deposited from the precursors 1,3-disilabutane and dichlorosilane JOURNAL OF APPLIED PHYSICS Roper, C. S., Radmilovic, V., Howe, R. T., Maboudian, R. 2008; 103 (8)

  View details for DOI 10.1063/1.2907871

  View details for Web of Science ID 000255456200180

• Technologies for cofabricating MEMS and electronics PROCEEDINGS OF THE IEEE Fedder, G. K., Howe, R. T., Liu, T. K., Quevy, E. P. 2008; 96 (2): 306-322

  View details for DOI 10.1109/JPROC.2007.911064

  View details for Web of Science ID 000252583700009

• Effects of annealing on residual stress and strain gradient of doped polycrystalline SiC thin films ELECTROCHEMICAL AND SOLID STATE LETTERS Roper, C. S., Radmilovic, V., Howe, R. T., Maboudian, R. 2008; 11 (4): D35-D37

  View details for DOI 10.1149/1.2831906

  View details for Web of Science ID 000253238000009

• Silicon nanowire coupled micro-resonators 21st IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2008) Arellano, N., Quevy, E. P., Provine, J., Maboudian, R., Howe, R. T. IEEE. 2008: 721–724

  View details for Web of Science ID 000253356900181

• Obserations of fixed and mobile charge in composite MEMS resonators Bahl, G., Melamud, R., Kim, B., Chandorkar, S., Salvia, J., Hopcroft, M., A., Howe, R. T. 2008
• Energy-reversible complementary NEM logic gates Arkarvardar, K., Elata, D., Howe, R., T., Wong, H., S. P. 2008
• Characterization of magnetic nanoparticle-embedded SU8 for microactuation Tsai, K., L., Ziaei-Moayyed, M., Klejwa, N., Candler, R., N., Hu, W., Wang, S., X., Howe, R. T. 2008
• Measuring charge and charge-decay in floating electrode electrostatic MEMS actuators Elata, D., Hennessy, R., Leus, V., Klejwa, N., Hirshberg, A., Provine, J., Howe, R. T. 2008
• Nanowire coupled micro-resonators Arellano, N., Quévy, E., P., Provine, J., Maboudian, R., Howe, R., T. 2008
• Characterization of boron-doped micro- and nanocrystalline diamond films deposited by wafer-scale hot filament chemical vapor deposition for MEMS applications DIAMOND AND RELATED MATERIALS Zhang, J., Zimmer, J. W., Howe, R. T., Maboudian, R. 2008; 17 (1): 23-28

  View details for DOI 10.1016/j.diamond.2007.09.010

  View details for Web of Science ID 000252545600004

• The Dependence of Poly-crystalline SiC Mid-Infrared Optical Properties on Deposition Conditions IEEE/LEOS International Conference on Optical MEMS and Nanophotonics Provine, J., Roper, C., Schuller, J. A., Brongersma, M. L., Maboudian, R., Howe, R. T. IEEE. 2008: 182–183

  View details for Web of Science ID 000264556700092

• Interface Quality Control of Monolithic Photonic Crystals by Hydrogen Annealing Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference (CLEO/QELS 2008) Kim, S., Kant, R., Hadzialic, S., Howe, R. T., Solgaard, O. IEEE. 2008: 316–317

  View details for Web of Science ID 000260498400159

• Analytical modeling of the suspended-gate FET and design insights for low-power logic IEEE TRANSACTIONS ON ELECTRON DEVICES Akarvardar, K., Eggimann, C., Tsamados, D., Chauhan, Y. S., Wan, G. C., Lonescu, A. M., Howe, R. T., Wong, H. P. 2008; 55 (1): 48-59

  View details for DOI 10.1109/TED.2007.911070

  View details for Web of Science ID 000252059000005

• Electrical, mechanical and metal contact properties of polycrystalline 3C-SiC films for MEMS in harsh environments 16th European Conference on Chemical Vapor Deposition Zhang, J., Carraro, C., Howe, R. T., Maboudian, R. ELSEVIER SCIENCE SA. 2007: 8893–98

  View details for DOI 10.1016/j.sufcoat.2007.05.007

  View details for Web of Science ID 000249340400019

• Nickel and platinum ohmic contacts to polycrystalline 3C-silicon carbide MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY Zhang, J., Howe, R. T., Maboudian, R. 2007; 139 (2-3): 235-239

  View details for DOI 10.1016/j.mseb.2007.03.006

  View details for Web of Science ID 000247182000021

• Mode shape imaging of out-of-plane and in-plane vibrating RF micromechanical resonators by atomic force microscopy 32nd International Conference on Micro- and Nano-Engineering San Paulo, A., Quevy, E., Black, J., Howe, R. T., White, R., Bokor, J. ELSEVIER SCIENCE BV. 2007: 1354–57

  View details for DOI 10.1016/j.mee.2007.01.223

  View details for Web of Science ID 000247182500155

• Suspended mechanical structures based on elastic silicon nanowire arrays NANO LETTERS San Paulo, A., Arellano, N., Plaza, J. A., He, R., Carraro, C., Maboudian, R., Howe, R. T., Bokor, J., Yang, P. 2007; 7 (4): 1100-1104

  Abstract

  We demonstrate a bottom-up/top-down combined method for the fabrication of horizontally suspended, well-oriented and size-controlled Si nanowire arrays. Mechanical beamlike structures composed of multiple ordered arrays consecutively linked by transversal microspacers are obtained by this method. Such structures are used to investigate the mechanical elasticity of the nanowire arrays by atomic force microscopy. Our results point out important differences in the morphology and mechanical behavior of the fabricated nanowire-based structures with respect to equivalent bulk material structures.

  View details for DOI 10.1021/nl062877n

  View details for Web of Science ID 000245600500047

  View details for PubMedID 17375964

• Characterization of polycrystalline silicon-germanium film deposition for modularly integrated MEMS applications JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Low, C. W., Liu, T. K., Howe, R. T. 2007; 16 (1): 68-77

  View details for DOI 10.1109/JMEMS.2006.886030

  View details for Web of Science ID 000244434300010

• Design considerations for complementary nanoelectromechanical logic gates IEEE International Electron Devices Meeting Akarvardar, K., Elata, D., Parsa, R., WAN, G. C., Yoo, K., Provine, J., Peurnans, P., Howe, R. T., Wong, H. P. IEEE. 2007: 299–302

  View details for Web of Science ID 000259347800066

• WetFET - A novel fluidic gate-dielectric transistor for sensor applications International Symposium on VLSI Technology, Systems and Applications Lee, D., Sun, X., Quevy, E., Howe, R. T., Liu, T. K. IEEE. 2007: 124–125

  View details for Web of Science ID 000247059300055

• Aqueous transduction of poly-sige disk resonators 14th International Conference on Solid-State Sensors, Actuators and Microsystems/21st European Conference on Solid-State Transducers Chandrahalim, H., Bhave, S. A., Quevy, E. P., Howe, R. T. IEEE. 2007

  View details for Web of Science ID 000249603700074

• Suspended mechanical structures based on elastic silicon nanowire arrays Nano Letters Paulo, A., San, Arellano, N., Plaza, J., A., He, R., Carraro, C., Maboudian, R., Howe, R. T. 2007; 7: 1100-1104
• Aqueous transduction of poly-SiGe disk resonators Chandrahalim, H., Bhave, S., A., Quévy, E., P., Howe, R., T. 2007
• Characterization of polycrystalline silicon-germanium film deposition for modularly integrated MEMS applications IEEE/ASME J. Microelectromechanical Systems Low, C., W., King Liu, T., J., Howe, R., T. 2007; 16: 68-77
• Effect of a vertical stack of aligned subwavelength metal hole arrays on extraordinary transmission spectra IEEE/LEOS International Conference on Optical MEMS and Nanophotonics Provine, J., Kant, R., Horsley, D. A., Howe, R. T. IEEE. 2007: 117–118

  View details for Web of Science ID 000251224200059

• Phonon polariton reflectance spectra in a silicon carbide membrane hole array 20th Annual Meeting of the IEEE-Lasers-and-Electro-Optics-Society Provine, J., Catrysse, P. B., Roper, C. S., Maboudian, R., Fan, S., Howe, R. T. IEEE. 2007: 466–467

  View details for Web of Science ID 000259345200232

• Extraordinary transmission through a poly-SiC membrane with subwavelength hole arrays IEEE/LEOS International Conference on Optical MEMS and Nanophotonics Provine, J., Catrysse, P. B., Roper, C., Maboudian, R., Fan, S., Howe, R. T. IEEE. 2007: 157–158

  View details for Web of Science ID 000251224200077

• Stress control of polycrystalline 3C-SiC films in a large-scale LPCVD reactor using 1,3-disilabutane and dichlorosilane as precursors JOURNAL OF MICROMECHANICS AND MICROENGINEERING Roper, C. S., Howe, R. T., Maboudian, R. 2006; 16 (12): 2736-2739

  View details for DOI 10.1088/0960-1317/16/12/029

  View details for Web of Science ID 000242475200029

• Control of strain gradient in doped polycrystalline silicon carbide films through tailored doping JOURNAL OF MICROMECHANICS AND MICROENGINEERING Zhang, J., Howe, R. T., Maboudian, R. 2006; 16 (10): L1-L5

  View details for DOI 10.1088/0960-1317/16/10/L01

  View details for Web of Science ID 000242169400001

• Modal coupling in micromechanical vibratory rate gyroscopes IEEE SENSORS JOURNAL Phani, A. S., Seshia, A. A., Palaniapan, M., Howe, R. T., Yasaitis, J. A. 2006; 6 (5): 1144-1152

  View details for DOI 10.1109/JSEN.2006.881432

  View details for Web of Science ID 000240698200015

• Polycrystalline silicon carbide as a substrate material for reducing adhesion in MEMS TRIBOLOGY LETTERS Gao, D., Carraro, C., Howe, R. T., Maboudian, R. 2006; 21 (3): 226-232

  View details for DOI 10.1007/s11249-006-9024-9

  View details for Web of Science ID 000238140800006

• Single-source chemical vapor deposition of SiC films in a large-scale low-pressure CVD growth, chemical, and mechanical characterization reactor JOURNAL OF THE ELECTROCHEMICAL SOCIETY Roper, C. S., Radmilovic, V., Howe, R. T., Maboudian, R. 2006; 153 (8): C562-C566

  View details for DOI 10.1149/1.2208911

  View details for Web of Science ID 000238470100043

• Back-end-of-line poly-SiGe disk resonators 19th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2006) Quevy, E. P., Paulo, A., Basol, E., Howe, R. T., King, T. J., Bokor, G. IEEE. 2006: 234–237

  View details for Web of Science ID 000236994500059

• Reconstituted wafer technology for heterogeneous integration 19th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2006) Quevy, E. P., Howe, R. T., King, T. J. IEEE. 2006: 302–305

  View details for Web of Science ID 000236994500076

• Electrical characterization of n-type polycrystalline 3C-silicon carbide thin films deposited by 1,3-disilabutane JOURNAL OF THE ELECTROCHEMICAL SOCIETY Zhang, J. C., Howe, R. T., Maboudian, R. 2006; 153 (6): G548-G551

  View details for DOI 10.1149/1.2188327

  View details for Web of Science ID 000237229300078

• Back-end-of-line poly-SiGe disk resonators Quévy, E., P., Paulo, A., San, Basol, E., Howe, R., T., King, T., J., Bokor, J. 2006
• Electrical characterization of n-type polycrystalline 3C-silicon carbide thin films deposited by 1,3-disilabutane J. Electrochem. Soc. Zhang, J., C., Howe, R., T., Maboudian, R. 2006; 153: G548-G551
• Reconstituted wafer technology for heterogeneous integration Quévy, E., P., Howe, R., T., King, T., J. 2006
• Microfluidic generation of tunable monodisperse double emulsions for templated silica particles Zendejas, F., J., Srinivasan, U., Holtz, W., J., Keasling, J., D., Howe, R., T. 2006
• Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices IEEE TRANSACTIONS ON ELECTRON DEVICES Takeuchi, H., Wung, A., Sun, X., Howe, R. T., King, T. J. 2005; 52 (9): 2081-2086

  View details for DOI 10.1109/TED.2005.854287

  View details for Web of Science ID 000231542100022

• Mechanical elasticity of single and double clamped silicon nanobeams fabricated by the vapor-liquid-solid method APPLIED PHYSICS LETTERS San Paulo, A., Bokor, J., Howe, R. T., He, R., Yang, P., Gao, D., Carraro, C., Maboudian, R. 2005; 87 (5)

  View details for DOI 10.1063/1.2008364

  View details for Web of Science ID 000230886100057

• Selective growth of Si nanowire arrays via galvanic displacement processes in water-in-oil microemulsions JOURNAL OF THE AMERICAN CHEMICAL SOCIETY Gao, D., He, R. R., Carraro, C., Howe, R. T., Yang, P. D., Maboudian, R. 2005; 127 (13): 4574-4575

  Abstract

  Galvanic displacement processes are employed in water-in-oil microemulsions to deposit gold nanoclusters selectively on Si surfaces and sidewalls. The gold clusters then serve as catalysts to achieve selective growth of vertically and laterally aligned Si nanowire arrays by chemical vapor deposition via the vapor-liquid-solid growth mechanism. The size of the gold clusters is shown to have a good correlation with the microemulsion parameters, which in turn controls the size of the synthesized nanowires.

  View details for DOI 10.1021/ja043645y

  View details for Web of Science ID 000228089300016

  View details for PubMedID 15796513

• A new nano-electro-mechanical field effect transistor (NEMFET) design for low-power electronics IEEE International Electron Devices Meeting Kam, H., Lee, D. T., Howe, R. T., King, T. J. IEEE. 2005: 477–480

  View details for Web of Science ID 000236225100108

• Anchor loss simulation in resonators 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Bindel, D. S., Quevy, E., Koyama, T., Govindjee, S., Demmel, J. W., Howe, R. T. IEEE. 2005: 133–136

  View details for Web of Science ID 000228430000033

• Silicon nitride-on-silicon bar resonator using internal electrostatic transduction 13th International Conference on Solid-State Sensors, Actuators and Microsystems Bhave, S. A., Howe, R. T. IEEE. 2005: 2139–2142

  View details for Web of Science ID 000232189100529

• Fully-differential poly-SiC Lame-mode resonator and checkerboard filter 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Bhave, S. A., Gao, D., Maboudian, R., Howe, R. T. IEEE. 2005: 223–226

  View details for Web of Science ID 000228430000055

• Simulation tools for damping in high frequency resonators 4th IEEE Conference on Sensors Koyama, T., Bindel, D. S., He, W., Quevy, E. P., Govindjee, S., Demmel, J. W., Howe, R. T. IEEE. 2005: 349–352

  View details for Web of Science ID 000237003500087

• Redundant MEMS resonators for precise reference oscillators IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Quevy, E. P., Howe, R. T. IEEE. 2005: 113–116

  View details for Web of Science ID 000230541500025

• Microfluidic generation of tunable emulsions for templated monodisperse silica Zendejas, F., J., Srinivasan, U., Holtz, W., J., Keasling, J., D., Howe, R., T. 2005
• Anchor loss simulation in resonators Bindel, D., S., Quévy, E., Govinjee, S., Demmel, J., W., Howe, R., T. 2005
• Silicon nitride-on-silicon bar resonator using internal electrostatic transduction Bhave, S., A., Howe, R., T. 2005
• Selective growth of Si nanowire arrays via galvanic displacement processes in water-in-oil microemulsions Journal of the Americal Chemical Society Gao, D., He, R., Carraro, C., Howe, R., T., Yang, P., Maboudian, R. 2005; 127: 4574-4575
• Mechanical elasticity of single and double clamped silicon nanobeams fabricated by the vapor-liquid-solid method Applied Physics Letters Paulo, A., San, Bokor, J., Howe, R., T., He, R., Yang, P., Gao, D. 2005; 87: 53111-13
• Fully differential poly-SiC Lamé-mode resonator and checkerboard filter Bhave, S., A., Gao, D., Maboudian, R., Howe, R., T. 2005
• Redundant MEMS resonators for precise reference oscillators Quévy, E., P., Howe, R., T. 2005
• Simulation tools for damping in high frequency resonators Koyama, T., Bindel, D., S., He, W., Quévy, E., P., Govindjee, S., Demmel, J., W., Howe, R. T. 2005
• Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices IEEE Trans. Electron Devices Takeuchi, H., Wun, A., Sun, X., Howe, R., T., King, T., J. 2005; 52: 2081-2086
• Fracture of polycrystalline 3C-SiC films in microelectromechanical systems JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Gao, D., Carraro, C., Radmilovic, V., Howe, R. T., Maboudian, R. 2004; 13 (6): 972-976

  View details for DOI 10.1109/JMEMS.2004.838372

  View details for Web of Science ID 000225515100011

• Effect of excimer laser annealing on the structural properties of silicon germanium films JOURNAL OF MATERIALS RESEARCH Sedky, S., Schroeder, J., Sands, T., King, T. J., Howe, R. T. 2004; 19 (12): 3503-3511

  View details for DOI 10.1557/JMR.2004.0450

  View details for Web of Science ID 000225559900008

• Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology IEEE SENSORS JOURNAL Gao, D., Wijesundara, M. B., Carraro, C., Howe, R. T., Maboudian, R. 2004; 4 (4): 441-448

  View details for DOI 10.1109/JSEN.2004.828859

  View details for Web of Science ID 000222724900007

• Pulsed-laser annealing, a low-thermal-budget technique for eliminating stress gradient in poly-SiGe MEMS structures JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Sedky, S., Howe, R. T., King, T. J. 2004; 13 (4): 669-675

  View details for DOI 10.1109/JMEMS.2004.832189

  View details for Web of Science ID 000223180200015

• Ge-blade damascene process for post-CMOS integration of nano-mechanical resonators IEEE ELECTRON DEVICE LETTERS Takeuchi, H., Quevy, E., Bhave, S. A., King, T. J., Howe, R. T. 2004; 25 (8): 529-531

  View details for DOI 10.1109/LED.2004.831898

  View details for Web of Science ID 000222905100005

• Single-source chemical vapor deposition of 3C-SiC films in a LPCVD reactor - I. Growth, structure, and chemical characterization JOURNAL OF THE ELECTROCHEMICAL SOCIETY Wijesundara, M. B., Valente, G., Ashurst, W. R., Howe, R. T., Pisano, A. P., Carraro, C., Maboudian, R. 2004; 151 (3): C210-C214

  View details for DOI 10.1149/1.1646141

  View details for Web of Science ID 000188943800043

• Transformer coupled plasma etching of 3C-SiC films using fluorinated chemistry for microelectromechanical systems applications JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B Gao, D., Wijesundara, M. B., Carraro, C., Howe, R. T., Maboudian, R. 2004; 22 (2): 513-518

  View details for DOI 10.1116/1.1648067

  View details for Web of Science ID 000221092300009

• Pulsed Laser Annealing, a Low Thermal Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures IEEE/ASME J. of Microelectromechanical Systems Sedky, S., Howe, R., T., King, T., J. 2004; 13: 669-675
• Optimization of poly-SiGe deposition processes for modular MEMS integration Symposium on Micro- and Nanosystems held at the 2003 MRS Fall Meeting Lin, B. C., King, T. J., Howe, R. T. MATERIALS RESEARCH SOCIETY. 2004: 43–48

  View details for Web of Science ID 000222177500006

• Integrated poly-SiGe nanomechanical resonators for wireless sensor nodes Conference on Nanosensing Quevy, E. P., King, T. J., Howe, R. T. SPIE-INT SOC OPTICAL ENGINEERING. 2004: 368–377

  View details for DOI 10.1117/12.573034

  View details for Web of Science ID 000226789700038

• Ashing technique for nano-gap fabrication of electrostatic transducers Symposium on Nontraditional Approaches to Patterning held at the 2003 MRS Fall Meeting Eyoum, M. A., Quevy, E., Takeuchi, H., King, T. J., Howe, R. T. MATERIALS RESEARCH SOCIETY. 2004: 145–147

  View details for Web of Science ID 000221437000031

• Coupling of resonant modes in micromechanical vibratory rate gyroscopes Nanotechnology Conference and Trade Show (Nanotech 2004) Phani, A. S., Seshia, A. A., Palaniapan, M., Howe, R. T., Yasaitis, J. NANO SCIENCE & TECHNOLOGY INST. 2004: 335–338

  View details for Web of Science ID 000223076800081

• Stress Stability of Poly-SiGe and Various Oxide Films in Humid Environments Low, C., W., Bircumshaw, B., L., Dorofeeva, T., Solomon, G., King, T., J., Howe, R., T. 2004
• Fatigue of Polycrystalline Silicon for Microelectromechanical Systems: Crack Growth and Stability under Resonant Loading Conditions Mechanics of Materials Muhlstein, C., L., Howe, R., T., Ritchie, R., O. 2004; 36: 13-33
• Fracture of polycrystalline 3C-SiC films in microelectromechanical systems IEEE/ASME J. of Microelectromechanical Systems Gao, D., Carraro, C., Radmilovic, V., Howe, R., T., Maboudian, R. 2004; 13: 972-976
• Effects of boron concentration on Si1-xGex properties for integrated MEMS technology Eyoum, M., A. N., Su, Y., R., Bircumshaw, B., L., Kouzimov, D., Takeuchi, H., Howe, R., T. 2004
• Internal electrostatic transduction for bulk-mode MEMS resonators Bhave, S., A., Howe, R., T. 2004
• Effect of eximer laser annealing on the structural propoerties of silicon germanium films J. Materials Research Sedky, S., Schroeder, J., King, T., J., Howe, R., T. 2004; 19: 3503-3511
• Transformer coupled plasma etching of 3C-SiC films using fluorinated chemistry for MEMS applications J. Vac. Sci. Tech. B Gao, D., Howe, R., T., Mabouidan, R. 2004; 22: 513-518
• Single-source chemical vapor deposition of 3C-SiC films in a LPCVD reactor, part I: Growth, Structure, and Chemical Characterization Journal of the Electrochemical Society Wijesundara, M., B. J., Valente, G., Howe, R., T., Pisano, A., P., Carraro, C., Maboudian, R. 2004; 151: 210-214
• High performance inductors using capillary based fluidic self-assembly IEEE/ASME J. of Microelectromechanical Systems Scott, K., L., Hirano, T., Yang, H., Singh, H., Howe, R., T., Niknejad, A., M. 2004; 13: 300-309
• Poly-SiGe high frequency resonators based on lithographic definition of nano-gap lateral transducers Quévy, E., P., Bhave, S., A., Takeuchi, H., King, T., J., Howe, R., T. 2004
• Hydrogen peroxide etching and stability of p-type poly-SiGe films Bircumshaw, B., L., Wasilik, M., L., Kim, E., B., Su, Y., R., Takeuchi, H., Low, C., W., Howe, R. T. 2004
• In-situ doped poly-SiGe LPCVD process using BCl3 for post-CMOS integration of MEMS devices Low, C., W., Wasilik, M., L., Takeuchi, H., King, T., J., Howe, R., T. 2004
• Ge-blade damascene process for post-CMOS integration of nano-mechanical resonators IEEE Electron Device Lett. Takeuchi, H., Quevy, E., Bhave, S., King, T., J., Howe, R., T. 2004; 25: 529-531
• Silicon carbide for enhanced MEMS reliability Gao, D., Ashurst, W., R., Carraro, C., Howe, R., T., Maboudian, R. 2004
• Coupling of resonant modes in micromechanical vibratory rate gyroscopes Phani, A., S., Seshia, A., A., Palaniapan, M., Howe, R., T. 2004
• Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology IEEE Sensors Journal Gao, D., Wijesundara, M., B. J., Carraro, C., Howe, R., T., Maboudian, R. 2004; 4: 441-448
• Microbioreactor arrays with parametric control for high-throughput experimentation Biotechnology and Bioengineering Maharbiz, M., M., Holtz, W., J., Howe, R., T., Keasling, J., D. 2004; 85: 376-381
• Nitrogen doping of polycrystalline 3C-SiC films grown using 1,3-disilabutane in a conventional LPCVD reactor JOURNAL OF CRYSTAL GROWTH Wijesundara, M. B., Gao, D., Carraro, C., Howe, R. T., Maboudian, R. 2003; 259 (1-2): 18-25

  View details for DOI 10.1016/S0022-0248(03)01573-2

  View details for Web of Science ID 000186123700004

• Electrostatic charge and field sensors based on micromechanical resonators JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Riehl, P. S., Scott, K. L., Muller, R. S., Howe, R. T., Yasaitis, J. A. 2003; 12 (5): 577-589

  View details for DOI 10.1109/JMEMS.2003.818066

  View details for Web of Science ID 000186149600006

• High-selectivity etching of polycrystalline 3C-SiC films using HBr-based transformer coupled plasma APPLIED PHYSICS LETTERS Gao, D., Howe, R. T., Maboudian, R. 2003; 82 (11): 1742-1744

  View details for DOI 10.1063/1.1560561

  View details for Web of Science ID 000181442300032

• Electrostatic charge and field sensors based on micromechanical resonators IEEE/ASME J. of Microelectromechanical Systems Riehl, P., S., Scott, K., L., Muller, R., S., Howe, R., T., Yasaitis, J., A. 2003; 12: 577-589
• Model for micropart planarization in capillary-based microassembly BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 Scott, K. L., Howe, R. T., RADKE, C. J. 2003: 1319-1322

  View details for Web of Science ID 000184567300331

• Pulsed laser annealing of silicon-germanium films Symposium on Nano- and Microelectromechanical Systems (NEMS and MEMS) and Molecular Machines held at the 2002 MRS Fall Meeting Sedky, S., Schroeder, J., Sands, T., Howe, R., King, T. J. MATERIALS RESEARCH SOCIETY. 2003: 61–66

  View details for Web of Science ID 000183489300009

• Temporal variation of angular momentum in the convection zone Meeting on Local and Global Helioseismology Komm, R., Howe, R., Durney, B. R., Hill, F. ESA PUBLICATIONS DIVISION C/O ESTEC. 2003: 97–102

  View details for Web of Science ID 000183306100013

• An integrated, vertical-drive, in-plane-sense microgyroscope 12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 03) Bhave, S. A., Seeger, J. I., Jiang, X., Boser, B. E., Howe, R. T., Yasaitis, J. IEEE. 2003: 171–174

  View details for Web of Science ID 000184567300043

• High modulus polycrystalline 3C-SiC technology for RF MEMS 12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 03) Gao, D., Wijesundara, M. B., Carraro, C., Low, C. W., Howe, R. T., Maboudian, R. IEEE. 2003: 1160–1163

  View details for Web of Science ID 000184567300292

• The radial bulk annular resonator: Towards a 50 Omega RF MEMS filter 12th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 03) Bircumshaw, B., Liu, G., Takeuchi, H., King, T. J., Howe, R., O'Reilly, O., Pisano, A. IEEE. 2003: 875–878

  View details for Web of Science ID 000184567300220

• A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS Yasaitis, J., Judy, M., Brosnihan, T., Garone, P., Pokrovskiy, N., Sniderman, D., Howe, R. T. 2003
• Performance comparison of integrated z-axis frame microgyroscopes 16th IEEE Annual International Conference on Micro Electro Mechanical Systems Palaniapan, M., Howe, R. T., Yasaitis, J. IEEE. 2003: 482–485

  View details for Web of Science ID 000182405500120

• High modulus polycrystalline 3C-SiC technology for RF MEMS Gao, D., Wijesundara, B., J., Carraro, C., Low, C., W., Howe, R., T., Maboudian, R. 2003
• Properties of phosphorus-doped poly-SiGe films for MEMS applications Journal of the Electrochemical Society Jeon, Y., C., King, T., J., Howe, R., T. 2003; 150: H1-H6
• Model for micropart planarization in capillary-based microassembly Scott, K., L., Howe, R., T., Radke, C., J. 2003
• Integrated Z-axis frame microgyroscope with ISOD design Palaniapan, M., Howe, R., T., Yasaitis, J. 2003
• The radial bulk annular resonator: towards a 50W RF MEMS filter Bircumshaw, B., Liu, G., Takeuchi, H., King, T., J., Howe, R., O’Reilly, O. 2003
• Optimization of poly-SiGe deposition processes for modular MEMS integration Lin, B., C. Y., King, T., J., Howe, R., T. 2003
• Polycrystalline silicon germanium films for integrated microsystems IEEE/ASME Journal of Micro-electromechanical Systems Franke, A., E., Heck, J., M., King, T., J., Howe, R., T. 2003; 12: 160-171
• Characterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS applications J. Microlith. Gao, D., Wijesundara, M., B. J., Carraro, C., Howe, R., T., Maboudian, R. 2003; 2: 259-264
• Nitrogen doping of polycrystalline 3C-SiC films using 1,3-disilabutane in a conventional LPCVD reactor J. Crystal Growth Wijesundara, M., B. J., Gao, D., Carraro, C., Howe, R., T., Maboudian, R. 2003; 259: 18-25
• An integrated, vertical drive, in-plane-sense microgyroscope Bhave, S., A., Seeger, J., I., Jiang, X., Boser, B., E., Howe, R., T., Yasaitis, J. 2003
• A microfabricated electrochemical oxygen generator for high-density cell culture arrays IEEE/ASME J. of Microelectromechanical Systems Maharbiz, M., M., Holtz, W., J., Sharifzadeh, S., Keasling, J., D., Howe, R., T. 2003; 12: 590-599
• High-selectivity etching of polycrystalline 3C-SiC films using HBr-based transformer coupled plasma Applied Physics Letters Gao, D., Howe, R., T., Maboudian, R. 2003; 82: 1742-1744
• A vacuum packaged surface micromachined resonant accelerometer JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Seshia, A. A., Palaniapan, M., Roessig, T. A., Howe, R. T., Gooch, R. W., Schimert, T. R., Montague, S. 2002; 11 (6): 784-793

  View details for DOI 10.1109/JMEMS.2002.805207

  View details for Web of Science ID 000179740900019

• Nitrogen doping of polycrystalline 3C-SiC films grown by single-source chemical vapor deposition THIN SOLID FILMS Wijesundara, M. B., Stoldt, C. R., Carraro, C., Howe, R. T., Maboudian, R. 2002; 419 (1-2): 69-75

  View details for Web of Science ID 000179280400012

• A low-temperature CVD process for silicon carbide MEMS Transducers 2001 Conference/Eurosensor XVth Conference Stoldt, C. R., Carraro, C., Ashurst, W. R., Gao, D., Howe, R. T., Maboudian, R. ELSEVIER SCIENCE SA. 2002: 410–415

  View details for Web of Science ID 000176297000056

• Microsystems Research in Japan WTEC, Baltimore, Maryland Howe, R., Allen, M., Berlin, A., Hui, E., Monk, D., Najafi, K. 2002
• Fluidic self-assembly of micromirrors onto microactuators using capillary forces IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS Srinivasan, U., Helmbrecht, M. A., Rembe, C., Muller, R. S., Howe, R. T. 2002; 8 (1): 4-11

  View details for Web of Science ID 000174519300002

• Low-temperature LPCVD MEMS technologies Symposium on MEMS and BioMEMS held at the 2002 MRS Spring Meeting Howe, R. T., King, T. J. MATERIALS RESEARCH SOCIETY. 2002: 205–213

  View details for Web of Science ID 000178928100030

• Recent progress in modularly integrated MEMS technologies IEEE International Electron Devices Meeting King, T. J., Howe, R. T., Sedky, S., Liu, G., Lin, B. C., Wasilik, M., Duenn, C. IEEE. 2002: 199–202

  View details for Web of Science ID 000185143400045

• An integrated microelectromechanical resonant output gyroscope 15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2002) Seshia, A. A., Howe, R. T., Montague, S. IEEE. 2002: 722–726

  View details for Web of Science ID 000174908700176

• Integrated surface-micromachined z-axis frame microgyroscope IEEE International Electron Devices Meeting Palaniapan, M., Howe, R. T., Yasaitis, J. IEEE. 2002: 203–206

  View details for Web of Science ID 000185143400046

• Fluidic self-assembly of micromirrors onto microactuators using capillary forces (invited) IEEE Journal on Selected Topics in Quantum Electronics Srinivasan, U., Helmbrecht, M., A., Rembe, C., Muller, R., S., Howe, R., T. 2002; 8: 4-11
• Capacitive Interface for a Vertically Driven X&Y-Axis Rate Gyroscope Jiang, X., Bhave, S., A., Seeger, J., I., Howe, R., T., Boser, B., E., Yasaitis, J. 2002
• Interconnect issues for integrated MEMS technologies King, T., J., Howe, R., T., Eyoum, M., A., Bhave, S., A. 2002
• A low-temperature CVD process for silicon carbide MEMS Sensors and Actuators A Stoldt, C., R., Carraro, C., Ashurst, W., R., Gao, D., Howe, R., T., Maboudian, R. 2002; 97-98: 410-415
• A vacuum packaged surface micromachined resonant accelerometer IEEE/ASME Journal of Microelectromechanical Systems Seshia, A., A., Palaniapan, M., Roessig, T., A., Howe, R., T., Gooch, R., W., Schimert, T., R. 2002; 11: 784-793
• Nitrogen doping of 3C-SiC films grown by single-source chemical vapor deposition Thin Solid Films Wijesundara, M., B. J., Stoldt, C., R., Carraro, C., Howe, R., T., Maboudian, R. 2002; 419: 69-75
• High-resolution electrometer with micromechanical variable capacitor Riehl, P., Scott, K., Muller, R., S., Howe, R., T. 2002
• Recent progress in modularly integrated MEMS technologies King, T., J., Howe, R., T., Sedky, S., Liu, G., Lin, B., C.-Y., Wasilik, M. 2002
• Low-temperature LPCVD MEMS technologies Howe, R., T., King, T., J. 2002
• Pulsed laser annealing of silicon germanium films Sedky, S., Schroeder, J., Sands, T., Howe, R., King, T., J. 2002
• A microfabricated electrochemical oxygen generator for high-density cell culture arrays Maharbiz, M., M., Holtz, W., J., Keasling, J., D., Howe, R., T. 2002
• Poly-SiGe: a high-Q structural material for integrated RF MEMS Bhave, S., A., Bircumshaw, B., L., Kim, Y., S., Low, W., Z., King, T., J., Howe, R., T. 2002
• Integrated surface-micromachined Z-axis frame microgyroscope Palaniapan, M., Howe, R., T., Yasaitis, J. 2002
• MEMS: Some Self-Assembly Required Optics & Photonics News Srinivasan, U., King, T., J., Howe, R., T. 2002: 26-30
• Micromechanical Pierce oscillator for resonator sensor applications Seshia, A., A., Low, W., Z., Bhave, S., A., Howe, R., T. 2002
• An integrated microelectromechanical resonant-output gyroscope Seshia, A., A., Howe, R., T., Montague, S. 2002
• Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS Solid-State Sensors and Actuators Workshop Ashurst, W. R., Yau, C., Carraro, C., Lee, C., Kluth, G. J., Howe, R. T., Maboudian, R. ELSEVIER SCIENCE SA. 2001: 239–48

  View details for Web of Science ID 000169970700001

• Integrated MEMS technologies (invited) MRS Bulletin Franke, A., E., King, T., J., Howe, R., T. 2001
• High-aspect-ratio, molded microstructures with electrical isolation and embedded interconnects Microsystem Technologies Muller, L., Howe, R., T., Pisano, A., P. 2001; 7: 47-54
• Modeling of capillary forces and binding sites for fluidic self-assembly Böhringer, K., F., Srinivasan, U., Howe, R., T. 2001
• Full three-dimensional motion characterization of a gimballed electrostatic microactuator Rembe, C., Muller, L., Muller, R., S., Pisano, A., P., Howe, R., T. 2001
• Microstructure to substrate self-assembly using capillary forces IEEE/ASME J. of Microelectromechanical Systems Srinivasan, U., Liepmann, D., Howe, R., T. 2001; 10: 17-24
• Microgimbal torsion beam design using open, thin-walled cross sections IEEE/ASME J. of Microelectromechanical Systems Muller, L., Pisano, A., P., Howe, R., T. 2001; 10: 550-560
• Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS Sensors and Actuators A Ashurst, W., R., Yau, C., Carraro, C., Lee, C., Kluth, G., J., Howe, R., T. 2001; 91: 239-248
• Micromirrors for adaptive optics Helmbrecht, M., A., Srinivasan, U., Rembe, C., Howe, R., T., Muller, R., S. 2001
• Single-step assembly of complex 3-D microstructures Hui, E., E., Howe, R., T., Rodgers, M., S. 2000
• Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS Ashurst, W., R., Yao, C., Carraro, C., Howe, R., T., Maboudian, R. 2000
• Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures Muller, L., Heck, J., M., Howe, R., T., Pisano, A., P. 2000
• Silicon microbial bioreactor arrays Maharbiz, M., Howe, R., T., Keasling, J., D. 2000
• Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers Franke, A., E., Jiao, Y., Wu, M., T., King, T., J., Howe, R., T. 2000
• Stroboscropic interferometer with variable magnification to measure dynamics in an adaptive-optics micromirror Rembe, C., Hart, M., Helmbrecht, M., A., Srinivasan, U., Muller, R., S., Lau, K., Y., Howe, R. T. 2000
• Fluidic self-assembly of micromirrors onto surface micromachined actuators Srinivasan, U., Helmbrecht, M., Rembe, C., Muller, R., S., Howe, R., T. 2000
• High aspect ratio poly-silicon-germanium microstructures Heck, J., M., Keller, C., G., Franke, A., E., Muller, L., King, T., J., Howe, R., T. 1999
• Post-CMOS integration of germanium microstructures 12th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 99) Franke, A. E., BILIC, D., Chang, D. T., Jones, P. T., King, T. J., Howe, R. T., Johnson, G. C. IEEE. 1999: 630–637

  View details for Web of Science ID 000078743100110

• Batch transfer assembly of micro-components onto surface and SOI MEMS Maharbiz, M., Howe, R., T., Pister, K., S. J. 1999
• Integrated resonant accelerometer based on rigidity change Tabata, O., Yamamoto, T., Seshia, A., A., Howe, R., T. 1999
• Batch micropackaging by compression-bonded wafer-wafer transfer MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST Maharbiz, M. M., Cohn, M. B., Howe, R. T., Horowitz, R., Pisano, A. P. 1999: 482-489

  View details for Web of Science ID 000078743100085

• An integrated CMOS micromechanical resonator high-Q oscillator IEEE J. Solid-State Circuits Nguyen, C., T.-C., Howe, R., T. 1999; 34: 440-455
• Batch micropackaging by compression-bonded wafer-wafer transfer Maharbiz, M., M., Cohn, M., B., Howe, R., T., Horowitz, R., Pisano, A., P. 1999
• Vacuum encapsulation of resonant devices using permeable polysilicon Lebouitz, K., S., Mazaheri, A., Howe, R., T., Pisano, A., P. 1999
• Modeling and simulation of micromachined gyroscopes in the presence of imperfections Shkel, A., M., Howe, R., T., Horowitz, R. 1999
• Fluidic microassembly using patterned self-assembled monolayers and shape matching Srinivasan, U., Howe, R., T., Liepmann, D. 1999
• Optimization of poly-silicon-germanium as a microstructural material Franke, A., E., Bilic, D., Chang, D., T., Jones, P., T., King, T., J., Howe, R., T. 1999
• Third harmonic double-ended tuning fork resonator Bilic, D., Howe, R., T., Clark, W., A., Roessig, T., A. 1999
• Materials characterization for MEMS - a comparison of uniaxial and bending tests Jones, P., T., Johnson, G., C., Howe, R., T. 1999
• Performance evaluation of batch-transferred surface micromachined resonators Singh, A., Bilic, D., Howe, R., T. 1999
• Statistical characterization of fracture of brittle MEMS materials Jones, P., T., Johnson, G., C., Howe, R., T. 1999
• Post-CMOS integration of germanium microstructures Franke, A., E., Bilic, D., Chang, D., T., Jones, P., T., King, T., J., Howe, R., T. 1999
• Dynamics and control of micromachined gyroscopes Shkel, A., M., Horowitz, R., Seshia, A., A., Park, S., Howe, R., T. 1999
• Mechanical performance of an integrated microgimbal / microactuators for disk drives Muller, L., Noworolski, J., M., Howe, R., T., Pisano, A., P. 1999
• Surface micromachining for microelectromechanical systems PROCEEDINGS OF THE IEEE Bustillo, J. M., Howe, R. T., Muller, R. S. 1998; 86 (8): 1552-1574

  View details for Web of Science ID 000074840200004

• Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Srinivasan, U., Houston, M. R., Howe, R. T., Maboudian, R. 1998; 7 (2): 252-260

  View details for Web of Science ID 000073957900014

• Carbonized parylene as a conformal sacrificial layer for high aspect ratio molded polysilicon Hui, E., E., Keller, C., G., Howe, R., T. 1998
• Microassembly technologies for MEMS SPIE Conference on Micromachining and Microfabrication Process Technology IV Cohn, M. B., Bohringer, K. F., NOWOROLSKI, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., Howe, R. T. SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16

  View details for Web of Science ID 000076937000001

• Microassembly technologies for MEMS Conference on Microelectronic Structures and MEMS for Optical Processing IV Cohn, M. B., Bohringer, K. F., NOWOROLSKI, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., Howe, R. T. SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16

  View details for Web of Science ID 000076894900001

• Microassembly technologies for MEMS Micromachined Devices amd Components IV Cohn, M. B., Bohringer, K. F., NOWOROLSKI, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., Howe, R. T. SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16

  View details for Web of Science ID 000076796500001

• Microassembly technologies for MEMS Materials and Device Characterization in Micromachining Cohn, M. B., Bohringer, K. F., NOWOROLSKI, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., Howe, R. T. SPIE - INT SOC OPTICAL ENGINEERING. 1998: 2–16

  View details for Web of Science ID 000076704600001

• Microassembly technologies for MEMS Microfluidic Devices and Systems Cohn, M. B., Bohringer, K. F., NOWOROLSKI, J. M., Singh, A., Keller, C. G., Goldberg, K. Y., Howe, R. T. SPIE-INT SOC OPTICAL ENGINEERING. 1998: 2–16

  View details for Web of Science ID 000076705100001

• Microassembly technologies for MEMS Cohn, M., B., Bohringer, K., F., Noworolski, J., M., Singh, A., Keller, C., G., Goldberg, K., Y., Howe, R. T. 1998
• Fracture strength of polycrystalline silicon Jones, P., T., Johnson, G., C., Howe, R., T. 1998
• Parallel microassembly with electrostatic force fields Bohringer, K., F., Goldberg, K., Cohn, M., Howe, R., Pisano, A. 1998
• Lubrication of polysilicon micromechanisms with self-assembled monolayers Srinivasan, U., Foster, J., D., Maboudian, R., Howe, R., T., Senft, D., C., Dugger, M., D. 1998
• Surface-micromachined 1 MHz oscillator with low-noise Pierce configuration Roessig, T., A., Howe, R., T., Pisano, A., P., Smith, J., H. 1998
• Commercialization of precision inertial sensors with integrated signal conditioning Sensors Expo West, San Jose, California Juneau, T., N., Lemkin, M., A., Roessig, T., A., Clark, W., A., Howe, R., T., Bustillo, J., M. 1998
• Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction IEEE/ASME J. of Micro-electromechanical Systems Srinivasan, U., Houston, M., R., Howe, R., T., Maboudian, R. 1998; 7: 252-260
• Surface micromachining for micro-electro-mechanical systems Proc. of the IEEE Bustillo, J., M., Howe, R., T., Muller, R., S. 1998; 86: 1552-1574
• Microelectromechanical filters for signal processing IEEE/ASME J. of Microelectromechanical Systems Lin, L., Howe, R., T., Pisano, A., P. 1998; 7: 286-294
• Stiction reduction processes for surface micromachines TRIBOLOGY LETTERS Maboudian, R., Howe, R. T. 1997; 3 (3): 215-221

  View details for Web of Science ID 000207956300002

• Effect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces JOURNAL OF APPLIED PHYSICS Houston, M. R., Howe, R. T., Maboudian, R. 1997; 81 (8): 3474-3483

  View details for Web of Science ID A1997WV36300021

• Stiction reduction processes for surface micromachines Tribology Letters Maboudian, R., Howe, R., T. 1997; 3: 215-221
• Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments 9th International Conference on Solid-State Sensors and Actuators Brosnihan, T. J., Bustillo, J. M., Pisano, A. P., Howe, R. T. IEEE. 1997: 637–640

  View details for Web of Science ID A1997BJ35B00162

• Surface-micromachined resonant accelerometer 9th International Conference on Solid-State Sensors and Actuators Roessig, T. A., Howe, R. T., Pisano, A. P., Smith, J. H. IEEE. 1997: 859–862

  View details for Web of Science ID A1997BJ35B00209

• Batch transfer of microstructures using flip-chip solder bump bonding 9th International Conference on Solid-State Sensors and Actuators Singh, A., Horsley, D. A., Cohn, M. B., Pisano, A. P., Howe, R. T. IEEE. 1997: 265–268

  View details for Web of Science ID A1997BJ35B00064

• Self-assembled fluorocarbon films for enhanced stiction reduction 9th International Conference on Solid-State Sensors and Actuators Srinivasan, U., Houston, M. R., Howe, R. T., Maboudian, R. IEEE. 1997: 1399–1402

  View details for Web of Science ID A1997BJ35B00345

• Critical review: Adhesion in surface micromechanical structures JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B Maboudian, R., Howe, R. T. 1997; 15 (1): 1-20

  View details for Web of Science ID A1997WH68800001

• Nonlinear mixing in surface-micromachined tuning fork oscillators Roessig, T., A., Howe, R., T., Pisano, A., P. 1997
• Effect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces J. of Applied Physics Houston, M., R., Howe, R., T., Maboudian, R. 1997; 81: 3474-3483
• Batch transfer of microstructures using flip-chip solder bump bonding Singh, A., Horsley, D., A., Cohn, M., B., Pisano, A., P., Howe, R., T. 1997
• Hexsil tweezers for teleoperated micro-assembly Keller, C., G., Howe, R., T. 1997
• Self-assembled fluorocarbon films for enhanced stiction reduction Srinivasan, U., Houston, M., R., Howe, R., T., Maboudian, R. 1997
• Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments Brosnihan, T., J., Bustillo, J., M., Pisano, A., P., Howe, R., T. 1997
• Experiments in micromanipulation and CAD-driven microassembly Feddema, J., T., Keller, C., G., Howe, R., T. 1997
• A micro strain gauge with mechanical amplifier IEEE/ASME J. of Microelectromechanical Systems Lin, L., Pisano, A., P., Howe, R., T. 1997; 6: 313-321
• Microelectronics: an Integrated Approach Howe, R., T., Sodini, C., G. Prentice Hall. 1997
• Surface-micromachined resonant accelerometer Roessig, T., A., Howe, R., T., Pisano, A., P. 1997
• Critical review: stiction in surface micromechanical structures J. Vacuum Science and Technology B Maboudian, R., Howe, R., T. 1997; B15: 1-19
• Multimode digital control of a suspended polysilicon microstructure JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Fedder, G. K., Howe, R. T. 1996; 5 (4): 283-297

  View details for Web of Science ID A1996VY41300008

• Polysilicon integrated microsystems: Technologies and applications SENSORS AND ACTUATORS A-PHYSICAL Howe, R. T., Boser, B. E., Pisano, A. P. 1996; 56 (1-2): 167-177

  View details for Web of Science ID A1996WA07000018

• Surface micromachined accelerometers IEEE JOURNAL OF SOLID-STATE CIRCUITS Boser, B. E., Howe, R. T. 1996; 31 (3): 366-375

  View details for Web of Science ID A1996UL10300010

• Surface micromachined accelerometers IEEE J. of Solid-State Circuits Boser, B., E., Howe, R., T. 1996; 31: 366-375
• Self-assembled monolayers as permanent anti-stiction coatings for polysilicon microstructures Houston, M., R., Maboudian, R., Howe, R., T. 1996
• Wafer-to-wafer microstructure transfer for vacuum packaging Cohn, M., B., Liang, Y., Howe, R., T., Pisano, A., P. 1996
• Z-axis vibratory rate gyroscope Clark, W., A., Howe, R., T., Horowitz, R. 1996
• Design, fabrication, position sensing, and control of an electrostatically driven polysilicon microactuator IEEE Trans. on Magnetics Cheung, P., Horowitz, R., Howe, R., T. 1996; 32: 122-128
• Multi-mode digital control of suspended polysilicon microstructures IEEE/ASME J. of Microelectromechanical Systems Fedder, G., K., Howe, R., T. 1996; 5: 283-297
• Micromechanical structures for fracture testing of brittle thin films Jones, P., T., Johnson, G., C., Howe, R., T. 1996
• Hexsil tweezers with polysilicon piezoresistive strain gauges Late News Digest, 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C. Keller, C., G., Howe, R., T. 1996: 31-32
• Surface micromachined Z-axis vibratory rate gyroscope Clark, W., A., Howe, R., T., Horowitz, R. 1996
• Polysilicon integrated microsystems: technologies and applications (invited) Sensors and Actuators A Howe, R., T., Boser, B., E., Pisano, A., P. 1996; 56: 167-177
• Young's Modulus of in-situ Phophorus-Doped Polysilicon Biebl, M., Brandl, G., Howe, R., T. 1995
• Surface micromachined accelerometers IEEE 1995 Custom Integrated Circuits Conference Boser, B. E., Howe, R. T. IEEE. 1995: 337–344

  View details for Web of Science ID A1995BD31E00075

• Diamond-like carbon films for silicon passivation in microelectromechanical devices Symposium on Mechanical Behavior of Diamond and Other Forms of Carbon Houston, M. R., Howe, R. T., Komvopoulos, K., Maboudian, R. MATERIALS RESEARCH SOC. 1995: 391–402

  View details for Web of Science ID A1995BE33L00040

• Permeable Polysilicon Microshell Etch-Access Windows Lebouitz, K., S., Howe, R., T., Pisano, A., P. 1995
• Self-assembly of microsystems using non-contact electrostatic traps Cohn, M., B., Howe, R., T., Pisano, A., P. 1995
• High aspect ratio molded CVD silicon MEMS Keller, C., G., Howe, R., T. 1995
• Diamond-like carbon for silicon passivation in micromechanical devices Houston, M., R., Howe, R., T., Komvopoulos, K., Maboudian, R. 1995
• In Situ Phosphorus Doped Polysilicon for Integrated MEMS Biebl, M., Mulhern, G., T., Howe, R., T. 1995
• Ammonium Fluoride Surface Treatments for Reducing In-Use Stiction in Polysilicon Microstructures Houston, M., R., Howe, R., T., Maboudian, R. 1995
• Polysilicon Integrated Microsystems: Technologies and Applications Howe, R., T. 1995
• Surface micromachined resonant force sensors Roessig, T., A., Pisano, A., P., Howe, R., T. 1995
• Surface micromachined angular accelerometer with force feedback Brosnihan, T., J., Pisano, A., P., Howe, R., T. 1995
• Surface Micromachining: from Vision to Reality to Vision Payne, R., S., Sherman, S., Lewis, S., Howe, R., T. edited by Drory, M., D., Bogy, D., B., Donley, M., S. 1995
• Recent Advances in Surface Micromachining Howe, R., T. 1995
• Hexsil bimorphs for vertical actuation Keller, C., G., Howe, R., T. 1995
• An integrated force-balanced capacitive accelerometer for low-G applications Chau, K., H.-L., Lewis, S., R., Zhao, Y., Howe, R., T., Bart, S., F., Marcheselli, R., G. 1995
• Surface Micromachined Accelerometers Boser, B., E., Howe, R., T. 1995
• Nickel-filled thermally actuated hexsil tweezers Keller, C., G., Howe, R., T. 1995
• Silicon Micromachining for Resonator Fabrication Howe, R., T. 1994
• Silicon Surface Treatments for Stiction Reduction in Silicon Micromachining : A Surface Science Approach Houston, M., R., Maboudian, R., Howe, R., T. 1994
• Silicon dioxide sacrificial layer hydrofluoric acid etching: Part II -- modeling J. of the Electrochemical Society Monk, D., J., Soane, D., S., Howe, R., T. 1994; 141: 271-274
• Silicon dioxide sacrificial layer hydrofluoric acid etching: Part I - experimental observations J. of the Electrochemical Society Monk, D., J., Soane, D., S., Howe, R., T. 1994; 141: 264-269
• Integrated Testbed for Multi-Mode Digital Control of Suspended Microstructures Fedder, G., K., Howe, R., T. 1994
• Design and Performance of CMOS Micromechanical Resonator Oscillators Nguyen, C., T.-C., Howe, R., T. 1994
• Polysilicon Integrated Mechatronics: Applications and Recent Developments Howe, R., T. 1994
• Polysilicon microresonators for signal processing Nguyen, C., T.-C., Howe, R., T. 1994
• Viscous damping model for laterally oscillating microstructures IEEE/ASME J. of Microelectromechanical Systems Cho, Y., H., Kwak, B., M., Pisano, A., P., Howe, R., T. 1994; 3: 81-87
• Process Technology for the Modular Integration of CMOS and Microstructures (invited) Microsystem Technology Bustillo, J., M., Fedder, G., K., Nguyen, C., T.-C., Howe, R., T. 1994; 1: 30-41
• Micromechanical Resonators for Frequency References and Signal Processing Howe, R., T., Nguyen, C., T.-C. 1994
• Slide film damping in laterally driven microstructures Sensors and Actuators A Cho, Y., H., Kwak, B., M., Pisano, A., P., Howe, R., T. 1994; 40: 31-39
• Self-assembled monolayer film for enhanced imaging of rough surfaces with atomic force microscopy J. of Applied Physics Alley, R., L., Komvopoulos, K., Howe, R., T. 1994; 76: 5731-5737
• S-D Modulator interfacing with silicon microsensors Sensors Yun, W., Howe, R., T. 1993: 11-18
• A PASSIVE, INSITU MICRO STRAIN-GAUGE 1993 IEEE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 93 ) Lin, L. W., Howe, R. T., Pisano, A. P. I E E E. 1993: 201–206

  View details for Web of Science ID A1993BY05M00037

• POLYSILICON HOLLOW BEAM LATERAL RESONATORS 1993 IEEE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 93 ) JUDY, M. W., Howe, R. T. I E E E. 1993: 265–271

  View details for Web of Science ID A1993BY05M00048

• VISCOUS ENERGY-DISSIPATION IN LATERALLY OSCILLATING PLANAR MICROSTRUCTURES - A THEORETICAL AND EXPERIMENTAL-STUDY 1993 IEEE WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 93 ) Cho, Y. H., Kwak, B. M., Pisano, A. P., Howe, R. T. I E E E. 1993: 93–98

  View details for Web of Science ID A1993BY05M00017

• Vacuum encapsulated lateral microresonators Lin, L., McNair, K., M., Howe, R., T., Pisano, A., P. 1993
• Sigma-Delta modulator interfacing with microsensors Sensors Expo West, San Jose, California Yun, W., Howe, R., T. 1993: 159-164
• STRESS-CORROSION CRACKING AND BLISTERING OF THIN POLYCRYSTALLINE SILICON FILMS IN HYDROFLUORIC-ACID Symposium on Thin Films: Stresses and Mechanical Properties IV, at the 1993 Spring Meeting of the Materials-Research-Society Monk, D. J., Krulevitch, P., Howe, R. T., Johnson, G. C. MATERIALS RESEARCH SOC. 1993: 641–646

  View details for Web of Science ID A1993BZ55E00095

• Determination of the etching kinetics for the hydrofluoric acid/silicon dioxide system J. of the Electrochemical Society Monk, D., J., Soane, D., S., Howe, R., T. 1993; 140: 2339-2346
• A novel micro in situ strain gauge Lin, L., Howe, R., T., Pisano, A., P. 1993
• CMOS Micromechanical Resonator Oscillator Nguyen, C., T.-C., Howe, R., T. 1993
• Polysilicon hollow beam lateral resonators Judy, M., W., Howe, R., T. 1993
• Stress-corrosion cracking and blistering of thin polycrystalline silicon films in hydrofluoric acid Monk, D., J., Krulevitch, P., Howe, R., T., Johnson, G., C. 1993
• Microresonator frequency control using an integrated micro oven Nguyen, C., T., Howe, R., T. 1993
• A Chemical Reaction Mechanism and Kinetics for Hydrofluoric Acid Etching of Silicon Dioxide Thin Films (invited review) Thin Solid Films Monk, D., J., Soane, D., S., Howe, R., T. 1993; 232 (1): 1-12
• Supercritical carbon dioxide drying of microstructures Mulhern, G., T., Soane, D., S., Howe, R., T. 1993
• Highly compliant lateral suspensions using sidewall beams Judy, M., W., Howe, R., T. 1993
• Surface roughness modification of interfacial contacts in polysilicon microstructures Alley, R., L., Mai, P., Komvopoulos, K., Howe, R., T. 1993
• Viscous energy dissipation in laterally oscillating planar microstructures: a theoretical and experimental study Cho, Y., H., Kwak, B., M., Pisano, A., P., Howe, R., T. 1993
• Enhanced removal of sacrificial layers for silicon surface micromachining Monk, D., J., Soane, D., S., Howe, R., T. 1993
• Characterization of thin films using micromechanical structures Pratt, R., I., Johnson, G., C., Howe, R., T., Nikkel Jr., D., J. 1992
• MICRO ELECTROMECHANICAL FILTERS FOR SIGNAL-PROCESSING 5TH WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS ( MEMS 92 ) Lin, L. W., Nguyen, C. T., Howe, R. T., Pisano, A. P. I E E E. 1992: 226–231

  View details for Web of Science ID A1992BV86N00042

• Stress and microstructure in phosphorus doped polycrystalline silicon Krulevitch, P., Johnson, G., C., Howe, R., T. 1992
• Electrostatic comb drive levitation and control method IEEE/ASME Journal of Microelectromechanical Systems Tang, W., C., Lim, M., G., Howe, R., T. 1992; 1 (4): 170-178
• Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry Yun, W., Howe, R., T., Gray, P., R. 1992
• Thermal microassembly of narrow-gap electrostatic comb-drive structures Fedder, G., K., Chang, J., C., Howe, R., T. 1992
• Micro Electromechanical Filters Lin, L., Nguyen, C., T.-C., Howe, R., T., Pisano, A., P. 1992
• Silicon microfabricated accelerometers: a perspective on recent developments (invited paper), Sensors Expo, Chicago, Ill. Yun, W., Howe, R., T., Gabriel, K., J., Trimmer, W., S. N. 1992: 204A-1 - 204A-8.
• Recent developments in silicon microaccelerometers Sensors Yun, W., Howe, R., T. 1992: 31-41
• The effect of release-etch processing on surface microstructure stiction Alley, R., L., Howe, R., T., Komvopoulos, K. 1992
• Quality factor control for micromechanical resonators Nguyen, C., T.-C., Howe, R., T. 1992
• Stress and microstructure in LPCVD polysilicon films: experimental results and closed form modeling of stresses Krulevitch, P., Johnson, G., C., Howe, R., T. 1992
• Sacrificial layer etching model for surface micromachining applications Monk, D., J., Soane, D., S., Howe, R., T. 1992
• Sacrificial layer Si02 wet etching for micromachining applications Monk, D., J., Soane, D., S., Howe, R., T. 1992
• Sacrificial Silicon Dioxide Wet Etching for Micromachining Applications Monk, D., J., Soane, D., S., Howe, R., T. 1991
• SELF-ADJUSTING MICROSTRUCTURES (SAMS) 4TH IEEE WORKSHOP ON MICRO MECHANICAL SYSTEMS ( MEMS 91 ) JUDY, M. W., Cho, Y. H., Howe, R. T., Pisano, A. P. I E E E. 1991: 51–56

  View details for Web of Science ID A1991BT34N00009

• THERMAL ASSEMBLY OF POLYSILICON MICROSTRUCTURES 4TH IEEE WORKSHOP ON MICRO MECHANICAL SYSTEMS ( MEMS 91 ) Fedder, G. K., Howe, R. T. I E E E. 1991: 63–68

  View details for Web of Science ID A1991BT34N00011

• Stress in Undoped LPCVD Polycrystalline Silicon Krulevitch, P., Johnson, G., C., Howe, R., T. 1991
• Ultrasonically Induced Microtransport Moroney, R., M., White, R., M., Howe, R., T. 1991
• Design and Modeling of a Linear Microactuator Cheung, P., Horowitz, R., Howe, R. 1991
• Modeling and Position-Detection of a Polysilicon Linear Microactuator Cheung, P., Horowitz, R., Howe, R. 1991
• Ultrasonically Induced Microtransport with Cylindrical Geometry Moroney, R., M., White, R., M., Howe, R., T. 1991
• LPCVD Polysilicon Thin Films: The Evolution of Structure, Texture, and Stress Krulevitch, P., A., Nguyen, T., D., Johnson, G., C., Howe, R., T., Wenk, H., R., Gronsky, R. 1991
• Micromechanical Structures for Thin Film Characterization Pratt, R., I., Johnson, G., C., Howe, R., T. 1991
• Self-Adjusting Microstructures Judy, M., W., Cho, Y., H., Howe, R., T., Pisano, A., P. 1991
• ELECTROSTATIC-COMB DRIVE OF LATERAL POLYSILICON RESONATORS 5TH INTERNATIONAL CONF ON SOLID-STATE SENSORS AND ACTUATORS AND EUROSENSORS 3 ( TRANSDUCERS 89 ) Tang, W. C., NGUYEN, T. C., JUDY, M. W., Howe, R. T. ELSEVIER SCIENCE SA. 1990: 328–31

  View details for Web of Science ID A1990DB79100065

• Fluid Motion Produced by Ultrasonic Lamb waves Moroney, R., M., White, R., M., Howe, R., T. 1990
• Resonant-Bridge Two-Axis Microaccelerometer Sensors and Actuators Chang, S., C., Putty, M., W., Hicks, D., B., Li, C., H., Howe, R., T. 1990; A21-A23: 342-345
• Electrostatically Balanced Comb Drive for Controlled Levitation Tang, W., C., Lim, M., G., Howe, R., T. 1990
• A Planar Air-Levitated Electrostatic Actuator System Pister, K., S. J., Fearing, R., S., Howe, R., T. 1990
• Polysilicon Microstructures to Characterize Static Friction Lim, M., G., Chang, J., Schultz, D., P., Howe, R., T., White, R., M. 1990
• Spiral Microstructures for the Measurement of Average Strain Gradients in Thin Films Fan, L., S., Yun, W., Muller, R., S., Howe, R., T., Huang, J. 1990
• missing title J. of Applied Physics Wenk, H., R., Sintubin, M., Huang, J., Johnson, G., C., Howe, R., T. 1990; 67: 572-574
• Fabrication Technologies for Integrated Microdynamic Systems (invited paper), Integrated Micro-Motion Systems Micromachining, Control and Applications Yun, W., Tang, W., C., Howe, R., T. edited by Harashima, F. Amsterdam: Elsevier Science Publishers. 1990: 297–312
• Silicon micromechanics: sensors and actuators on a chip IEEE Spectrum Howe, R., T., Muller, R., S., Gabriel, K., J., Trimmer, W., S. N. 1990: 29-35
• Electrostatic-Comb Drive of Lateral Polysilicon Resonators Sensors and Actuators A Tang, W., C., Nguyen, T., C. H., Judy, M., W., Howe, R., T. 1990; A21-A23: 328-331
• Ultrasonic Micromotors: Physics and Applications Moroney, R., M., White, R., M., Howe, R., T. 1990
• Investigation of texture and stress in undoped polysilicon films Huang, J., Krulevitch, P., Johnson, G., C., Howe, R., T., Wenk, H., R. edited by Kamins, T., Thompson, C., V., Raicu, B. 1990
• Fracture-Toughness Characterization of Brittle Thin Films Sensors and Actuators Fan, L., S., Howe, R., T., Muller, R., S. 1990; A21-A23: 872-874
• Microsensors for heat transfer and fluid flow measurements Experimental Thermal and Fluid Science Udell, K., S., Pisano, A., P., Howe, R., T., White, R., M., Muller, R., S. 1990; 3: 52-59
• Technologies for microdynamic devices Nanotechnology Muller, R., S., Howe, R., T. 1990; 1: 8-12
• Lamb-Wave Interactions with the Chemical, Biological and Physical Environment White, R., M., Wenzel, S., W., Martin, B., A., Moroney, R., M., Costello, B., J., Straub, M., A., Howe, R. T. 1990
• Texture of Undoped LPCVD Polycrystalline Silicon Films Huang, J., Lin, K., K., Lau, J., Hodges, D., A., Spanos, C., Johnson, G., C., Howe, R. T. 1989
• Microstructures for Fracture Toughness Characterization of Brittle Thin Films Fan, L., S., Howe, R., T., Muller, R., S. 1989
• Laterally Driven Polysilicon Resonant Microstructures Tang, W., C., Nguyen, T., C. H., Howe, R., T. 1989
• Ultrasonic micromotor Moroney, R., M., White, R., M., Howe, R., T. 1989
• Electrostatic-Comb Drive of Lateral Polysilicon Resonators Tang, W., C., Nguyen, T., C. H., Howe, R., T. 1989
• Fracture-Toughness Characterization of Brittle Thin Films Fan, L., S., Howe, R., T., Muller, R., S. 1989
• Resonant-Bridge Two-Axis Microaccelerometer Chang, S., C., Putty, M., W., Hicks, D., B., Li, C., H., Howe, R., T. 1989
• Vacuum-insulated field-effect transistor Electronics Letters Huang, J., Howe, R., T., Lee, H., S. 1989; 25: 1571-1573
• Microsensor and microactuator applications of thin films Thin Solid Films Howe, R., T. 1989; 181: 235-243
• One-Port Active Polysilicon Resonant Microstructures Putty, M., W., Chang, S., C., Howe, R., T., Robinson, A., L., Wise, K., D. 1989
• Microsensor and Microactuator Applications of Thin Films Howe, R., T. 1989
• Laterally driven polysilicon resonant microstructures Sensors and Actuators Tang, W., C., Nguyen, T., C. H., Howe, R., T. 1989; 20: 25-32
• Silicon Microdynamic Systems: Recent Developments in Microactuators and Micromachinery (invited paper), IEEE WESCON, San Francisco, California Howe, R., T. 1989: 202-204
• Process integration for active polysilicon resonant microstructures Sensors and Actuators Putty, M., W., Chang, S., C., Howe, R., T., Robinson, A., L., Wise, K., D. 1989; 20: 143-151
• A digital readout technique for capacitive sensor applications IEEE J. of Solid-State Circuits Kung, J., T., Lee, H., S., Howe, R., T. 1988; 23: 972-977
• A Thermally Isolated Microstructure Suitable for Gas Sensing Applications Huff, M., A., Senturia, S., D., Howe, R., T. 1988
• Surface Micromachining Processes for Electrostatic Motor Fabrication Lober, T., A., Howe, R., T. 1988
• Surface Micromachining for Microsensors and Microactuators Howe, R., T. 1988
• Design considerations for microfabricated electric actuators Sensors and Actuators Bart, S., F., Lober, T., A., Lang, J., H., Howe, R., T., Schlecht, M., F. 1988; 14: 269-292
• Microsensors for heat transfer and fluid flow measurements Udell, K., S., Pisano, A., P., Howe, R., T., White, R., M., Muller, R., S. 1988
• Design and calibration of a microfabricated floating-element shear-stress sensor IEEE Trans. on Electron Devices Schmidt, M., A., Howe, R., T., Senturia, S., D., Haritonidis, J., H. 1988; 35: 750-757
• Surface micromachining for microsensors and microactuators J. of Vacuum Science and Technology, Part B Howe, R., T. 1988; 6: 1809-1813
• Microfabricated structures for the in-situ measurement of residual stress, Young’s modulus, and ultimate strain in polyimide films Applied Physics Letters Allen, M., G., Mehregany, M., Howe, R., T., Senturia, S., D. 1987; 51: 241-243
• Silicon resonant microsensors Schmidt, M., A., Howe, R., T. 1987
• Resonant microsensors Howe, R., T. 1987
• Surface micromachining of polyimide/metal composites for a shear-stress sensor Schmidt, M., A., Howe, R., T., Senturia, S., D., Haritonidis, J., H. 1987
• Novel microstructures for the in-situ measurement of mechanical properties of thin films J. of Applied Physics Mehregany, M., Howe, R., T., Senturia, S., D. 1987; 62: 3579-3584
• Fabrication and testing of a micromachined shear sensor Schmidt, M., A., Howe, R., T., Senturia, S., D., Haritonidis, J., H. 1987
• A micromachined floating-element shear sensor Schmidt, M., A., Howe, R., T., Senturia, S., D., Haritonidis, J., H. 1987
• Applications of polysilicon films in microsensors and microactuators Howe, R., T. 1987
• Electric micromotors: electromechanical characteristics Lang, J., H., Schlecht, M., F., Howe, R., T. 1987
• Polycrystalline silicon micromachining: a new technology for integrated sensors Annals of Biomedical Engineering Howe, R., T. 1986; 14: 187-197
• Resonant-microbridge vapor sensor IEEE Trans. on Electron Devices Howe, R., T., Muller, R., S. 1986; ED-33: 499-506
• Resonant structures for integrated sensors Schmidt, M., A., Howe, R., T. 1986
• Polycrystalline silicon microstructures (invited), Micromachining and Micropackaging of Transducers Howe, R., T. edited by Fung, C., F., Cheung, P., W., Ko, W., H. Amsterdam: Elsevier Science Publishers. 1985: 169–187
• Polysilicon bridges for anemometer applications Tai, Y., C., Muller, R., S., Howe, R., T. 1985
• Frequency response of polycrystalline silicon microbridges Howe, R., T., Muller, R., S. edited by Fung, C., F., Cheung, P., W., Ko, W., H. 1985
• Resonant polysilicon microbridge with integrated NMOS detection circuitry Howe, R., T., Muller, R., S. 1984
• Integrated resonant-microbridge vapor sensor Howe, R., T., Muller, R., S. 1984
• Polycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties Sensors and Actuators Howe, R., T., Muller, R., S. 1983; 4: 447-454
• Polycrystalline silicon micromechanical beams J. of the Electrochemical Society Howe, R., T., Muller, R., S. 1983; 130: 1420-1423
• Polycrystalline Silicon Micromechanical Beams Howe, R., T., Muller, R., S. 1982
• Epitaxial silicon microshell vacuum-encapsulated CMOS-compatible 200 MHz bulk-mode resonator Chen, K, L., Chandrahalim, H., Graham, A., B., Bhave, S., A., Howe, R., T., Kenny, T., W.
• Fully differential interal electrostatic transduction of a Lamé-mode resonator Ziaei-Moayyed, M., Elata, D., Hsieh, J., Chen, J., W., Quévy, E., P., Howe, R., T.
• Wafer scale encapsulation of large lateral deflection MEMS structures Graham, A., B., Messana, M., Hartwell, P., Provine, J., Yoneoka, S., Kim, B., Howe, R. T.
• Photonic crystal mirrors for free-space communication and fiber-optic sensors Hadzialic, S., Jung, I., W., Kilic, O., Kim, S., Provine, J., Howe, R., T.