Kenneth Goodson

All Publications

• Publication Overview: 250 Journal Articles, 330 Conference Papers, 36 Patents, 13 Book Chapters, 2 Books. 42000+ Citations, H = 97 (Google Scholar). 23000+ Citations, H = 70 (Web of Science) Goodson, K. E. 2023
• Dominant Energy Carrier Transitions and Thermal Anisotropy in Epitaxial Iridium Thin Films ADVANCED FUNCTIONAL MATERIALS Perez, C., Jog, A., Kwon, H., Gall, D., Asheghi, M., Kumar, S., Park, W., Goodson, K. E. 2022

  View details for DOI 10.1002/adfm.202207781

  View details for Web of Science ID 000846638000001

• An electrochemical thermal transistor NATURE COMMUNICATIONS Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C. J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K. E. 2018; 9

  View details for DOI 10.1038/s41467-018-06760-7

  View details for Web of Science ID 000448710400004

• Enhanced Capillary-Fed Boiling in Copper Inverse Opals via Template Sintering ADVANCED FUNCTIONAL MATERIALS Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Santiago, J. G., Goodson, K. E. 2018; 28 (41)

  View details for DOI 10.1002/adfm.201803689

  View details for Web of Science ID 000446550700009

• Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper ADVANCED FUNCTIONAL MATERIALS Palko, J. W., Lee, H., Zhang, C., Dusseault, T. J., Maitra, T., Won, Y., Agonafer, D. D., Moss, J., Houshmand, F., Rong, G., Wilbur, J. D., Rockosi, D., Mykyta, I., Resler, D., Altman, D., Asheghi, M., Santiago, J. G., Goodson, K. E. 2017; 27 (45)

  View details for DOI 10.1002/adfm.201703283

  View details for Web of Science ID 000416828500008

• Modulation of thermal and thermoelectric transport in individual carbon nanotubes by fullerene encapsulation NATURE MATERIALS Kodama, T., Ohnishi, M., Park, W., Shiga, T., Park, J., Shimada, T., Shinohara, H., Shiomi, J., Goodson, K. E. 2017; 16 (9): 892-+

  Abstract

  The potential impact of encapsulated molecules on the thermal properties of individual carbon nanotubes (CNTs) has been an important open question since the first reports of the strong modulation of electrical properties in 2002. However, thermal property modulation has not been demonstrated experimentally because of the difficulty of realizing CNT-encapsulated molecules as part of thermal transport microstructures. Here we develop a nanofabrication strategy that enables measurement of the impact of encapsulation on the thermal conductivity (κ) and thermopower (S) of single CNT bundles that encapsulate C 60, Gd@C 82 and Er 2@C 82. Encapsulation causes 35-55% suppression in κ and approximately 40% enhancement in S compared with the properties of hollow CNTs at room temperature. Measurements of temperature dependence from 40 to 320 K demonstrate a shift of the peak in the κ to lower temperature. The data are consistent with simulations accounting for the interaction between CNTs and encapsulated fullerenes.

  View details for PubMedID 28759031

• Thermal transport: Cool electronics. Nature materials Cho, J., Goodson, K. E. 2015; 14 (2): 136-137

  View details for DOI 10.1038/nmat4194

  View details for PubMedID 25613710

• Ordering up the Minimum Thermal Conductivity of Solids SCIENCE Goodson, K. E. 2007; 315: 342-343
• Heat generation and transport in nanometer-scale transistors PROCEEDINGS OF THE IEEE Pop, E., Sinha, S., Goodson, K. E. 2006; 94 (8): 1587-1601

  View details for DOI 10.1109/JPROC.2006.879794

  View details for Web of Science ID 000240963400010

• Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module JOURNAL OF ELECTRONIC PACKAGING Lin, Y., Wei, T., Moy, W., Chen, H., Gupta, M., Degner, M., Asheghi, M., Mantooth, H., Goodson, K. E. 2024; 146 (1)

  View details for DOI 10.1115/1.4062384

  View details for Web of Science ID 001154980300001

• Boiling-induced thermal degradation of copper inverse opals and its mitigation INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER Kong, D., Kim, K., Jung, E., Jiang, K., Wu, Q., Jang, B., Kwon, H., Asheghi, M., Goodson, K. E., Lee, H. 2024; 151

  View details for DOI 10.1016/j.icheatmasstransfer.2024.107250

  View details for Web of Science ID 001163361600001

• Cooling future system-on-chips with diamond inter-tiers CELL REPORTS PHYSICAL SCIENCE Malakoutian, M., Kasperovich, A., Rich, D., Woo, K., Perez, C., Soman, R., Saraswat, D., Kim, J., Noshin, M., Chen, M., Vaziri, S., Bao, X., Shih, C., Woon, W., Asheghi, M., Goodson, K. E., Liao, S., Mitra, S., Chowdhury, S. 2023; 4 (12)

  View details for DOI 10.1016/j.xcrp.2023.101686

  View details for Web of Science ID 001144107300001

• High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature. ACS nano Perez, C., McLeod, A. J., Chen, M. E., Yi, S. I., Vaziri, S., Hood, R., Ueda, S. T., Bao, X., Asheghi, M., Park, W., Talin, A. A., Kumar, S., Pop, E., Kummel, A. C., Goodson, K. E. 2023

  Abstract

  Aluminum nitride (AlN) is one of the few electrically insulating materials with excellent thermal conductivity, but high-quality films typically require exceedingly hot deposition temperatures (>1000 °C). For thermal management applications in dense or high-power integrated circuits, it is important to deposit heat spreaders at low temperatures (<500 °C), without affecting the underlying electronics. Here we demonstrate 100 nm to 1.7 μm thick AlN films achieved by low-temperature (<100 °C) sputtering, correlating their thermal properties with their grain size and interfacial quality, which we analyze by X-ray diffraction, transmission X-ray microscopy, as well as Raman and Auger spectroscopy. Controlling the deposition conditions through the partial pressure of reactive N2, we achieve an ∼3× variation in thermal conductivity (∼36-104 W m-1 K-1) of ∼600 nm films, with the upper range representing one of the highest values for such film thicknesses at room temperature, especially at deposition temperatures below 100 °C. Defect densities are also estimated from the thermal conductivity measurements, providing insight into the thermal engineering of AlN that can be optimized for application-specific heat spreading or thermal confinement.

  View details for DOI 10.1021/acsnano.3c05485

  View details for PubMedID 37796248

• Permeability of Single-Layer-Free-Standing Meshes at Varying Capillary Pressure via a Novel Method ADVANCED MATERIALS INTERFACES Shattique, M. R., Giglio, R., Dede, E. M., Narumanchi, S., Asheghi, M., Goodson, K. E., Palko, J. W. 2023

  View details for DOI 10.1002/admi.202300326

  View details for Web of Science ID 001034349700001

• Non-volatile electrically programmable integrated photonics with a 5-bit operation. Nature communications Chen, R., Fang, Z., Perez, C., Miller, F., Kumari, K., Saxena, A., Zheng, J., Geiger, S. J., Goodson, K. E., Majumdar, A. 2023; 14 (1): 3465

  Abstract

  Scalable programmable photonic integrated circuits (PICs) can potentially transform the current state of classical and quantum optical information processing. However, traditional means of programming, including thermo-optic, free carrier dispersion, and Pockels effect result in either large device footprints or high static energy consumptions, significantly limiting their scalability. While chalcogenide-based non-volatile phase-change materials (PCMs) could mitigate these problems thanks to their strong index modulation and zero static power consumption, they often suffer from large absorptive loss, low cyclability, and lack of multilevel operation. Here, we report a wide-bandgap PCM antimony sulfide (Sb2S3)-clad silicon photonic platform simultaneously achieving low loss (<1.0 dB), high extinction ratio (>10 dB), high cyclability (>1600 switching events), and 5-bit operation. These Sb2S3-based devices are programmed via on-chip silicon PIN diode heaters within sub-ms timescale, with a programming energy density of [Formula: see text]. Remarkably, Sb2S3 is programmed into fine intermediate states by applying multiple identical pulses, providing controllable multilevel operations. Through dynamic pulse control, we achieve 5-bit (32 levels) operations, rendering 0.50 ± 0.16 dB per step. Using this multilevel behavior, we further trim random phase error in a balanced Mach-Zehnder interferometer.

  View details for DOI 10.1038/s41467-023-39180-3

  View details for PubMedID 37308496

  View details for PubMedCentralID 6972927

• Numerical Study of Large Footprint (24 x 24 mm(2)) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers JOURNAL OF ELECTRONIC PACKAGING Wei, T., Hazra, S., Lin, Y., Gupta, M., Degner, M., Asheghi, M., Goodson, K. E. 2023; 145 (2)

  View details for DOI 10.1115/1.4055468

  View details for Web of Science ID 000984438100006

• Linking Interfacial Bonding and Thermal Conductivity in Molecularly-Confined Polymer-Glass Nanocomposites with Ultra-High Interfacial Density. Small (Weinheim an der Bergstrasse, Germany) Wang, Y., Collinson, D. W., Kwon, H., Miller, R. D., Lionti, K., Goodson, K. E., Dauskardt, R. H. 2023: e2301383

  Abstract

  Thermal transport in polymer nanocomposites becomes dependent on the interfacial thermal conductance due to the ultra-high density of the internal interfaces when the polymer and filler domains are intimately mixed at the nanoscale. However, there is a lack of experimental measurements that can link the thermal conductance across the interfaces to the chemistry and bonding between the polymer molecules and the glass surface. Characterizing the thermal properties of amorphous composites are a particular challenge as their low intrinsic thermal conductivity leads to poor measurement sensitivity of the interfacial thermal conductance. To address this issue here, polymers are confined in porous organosilicates with high interfacial densities, stable composite structure, and varying surface chemistries. The thermal conductivities and fracture energies of the composites are measured with frequency dependent time-domain thermoreflectance (TDTR) and thin-film fracture testing, respectively. Effective medium theory (EMT) along with finite element analysis (FEA) is then used to uniquely extract the thermal boundary conductance (TBC) from the measured thermal conductivity of the composites. Changes in TBC are then linked to the hydrogen bonding between the polymer and organosilicate as quantified by Fourier-transform infrared (FTIR) and X-ray photoelectron (XPS) spectroscopy. This platform for analysis is a new paradigm in the experimental investigation of heat flow across constituent domains.

  View details for DOI 10.1002/smll.202301383

  View details for PubMedID 36971287

• Energy Efficient Neuro-inspired Phase Change Memory Based on Ge4 Sb6 Te7 as a Novel Epitaxial Nanocomposite. Advanced materials (Deerfield Beach, Fla.) Khan, A. I., Yu, H., Zhang, H., Goggin, J. R., Kwon, H., Wu, X., Perez, C., Neilson, K. M., Asheghi, M., Goodson, K. E., Vora, P. M., Davydov, A., Takeuchi, I., Pop, E. 2023: e2300107

  Abstract

  Phase change memory (PCM) is a promising candidate for neuro-inspired, data-intensive artificial intelligence applications, which relies on the physical attributes of PCM materials including gradual change of resistance states and multilevel operation with low resistance drift. However, achieving these attributes simultaneously remains a fundamental challenge for PCM materials such as Ge2 Sb2 Te5 , the most commonly used material. Here we demonstrate bi-directional gradual resistance changes with ∼10x resistance window using low energy pulses in nanoscale PCM devices based on Ge4 Sb6 Te7 , a new phase change nanocomposite material. These devices show 13 resistance levels with low resistance drift for the first 8 levels, resistance on/off ratio of ∼1000, and low variability. These attributes are enabled by the unique microstructural and electrothermal properties of Ge4 Sb6 Te7 , a nanocomposite consisting of epitaxial SbTe nanoclusters within the Ge-Sb-Te matrix, and a higher crystallization but lower melting temperature than Ge2 Sb2 Te5 . These results advance the pathway towards energy-efficient analog computing using PCM. This article is protected by copyright. All rights reserved.

  View details for DOI 10.1002/adma.202300107

  View details for PubMedID 36720651

• Techno-economic feasibility analysis of an extreme heat flux micro-cooler. iScience Dede, E. M., Zhang, C., Wu, Q., Seyedhassantehrani, N., Shattique, M., Roy, S., Palko, J. W., Narumanchi, S., Kekelia, B., Hazra, S., Goodson, K. E., Giglio, R., Asheghi, M. 2023; 26 (1): 105812

  Abstract

  An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.

  View details for DOI 10.1016/j.isci.2022.105812

  View details for PubMedID 36624838

• Parametric design analysis of a multi-level 3D manifolded microchannel cooler via re duce d order numerical modeling INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Hazra, S., Wei, T., Lin, Y., Asheghi, M., Goodson, K., Gupta, M., Degner, M. 2022; 197

  View details for DOI 10.1016/j.ijheatmasstransfer.2022.123356

  View details for Web of Science ID 000859718300008

• Understanding Interface-Controlled Resistance Drift in Superlattice Phase Change Memory IEEE ELECTRON DEVICE LETTERS Wu, X., Khan, A., Ramesh, P., Perez, C., Kim, K., Lee, Z., Saraswat, K., Goodson, K. E., Wong, H., Pop, E. 2022; 43 (10): 1669-1672

  View details for DOI 10.1109/LED.2022.3203971

  View details for Web of Science ID 000861441600023

• A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Kim, K., Lee, H., Kang, M., Lee, G., Jung, K., Kharangate, C. R., Asheghi, M., Goodson, K. E., Lee, H. 2022; 194

  View details for DOI 10.1016/j.ijheatmasstransfer.2022.123087

  View details for Web of Science ID 000820165400001

• Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance. Nano letters Khan, A. I., Wu, X., Perez, C., Won, B., Kim, K., Ramesh, P., Kwon, H., Tung, M. C., Lee, Z., Oh, I., Saraswat, K., Asheghi, M., Goodson, K. E., Wong, H. P., Pop, E. 2022

  Abstract

  Superlattice (SL) phase change materials have shown promise to reduce the switching current and resistance drift of phase change memory (PCM). However, the effects of internal SL interfaces and intermixing on PCM performance remain unexplored, although these are essential to understand and ensure reliable memory operation. Here, using nanometer-thin layers of Ge2Sb2Te5 and Sb2Te3 in SL-PCM, we uncover that both switching current density (Jreset) and resistance drift coefficient (v) decrease as the SL period thickness is reduced (i.e., higher interface density); however, interface intermixing within the SL increases both. The signatures of distinct versus intermixed interfaces also show up in transmission electron microscopy, X-ray diffraction, and thermal conductivity measurements of our SL films. Combining the lessons learned, we simultaneously achieve low Jreset 3-4 MA/cm2 and ultralow v 0.002 in mushroom-cell SL-PCM with 110 nm bottom contact diameter, thus advancing SL-PCM technology for high-density storage and neuromorphic applications.

  View details for DOI 10.1021/acs.nanolett.2c01869

  View details for PubMedID 35876819

• A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies. Scientific reports Hazra, S., Zhang, C., Wu, Q., Asheghi, M., Goodson, K., Dede, E. M., Palko, J., Narumanchi, S. 2022; 12 (1): 12180

  Abstract

  This letter solves a major hurdle that mars photolithography-based fabrication of micro-mesoscale structures in silicon. Conventional photolithography is usually performed on smooth, flat wafer surfaces to lay a 2D design and subsequently etch it to create single-level features. It is, however, unable to process non-flat surfaces or already etched wafers and create more than one level in the structure. In this study, we have described a novel cleanroom-based process flow that allows for easy creation of such multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial silicon dioxide hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200-300 and transferred to the substrate underneath via a single shot deep etching step. The proposed method is also easily characterizable-using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures. Furthermore, this study comprehensively compares the novel pattern transfer technique to already existing methods of creating multi-level structures, like grayscale lithography and chip stacking. The proposed process was found to be cheaper, faster, and easier to standardize compared to other methods-this made the overall process more reliable and repeatable. We hope it will encourage more research into hybrid structures that hold the key to dramatic performance improvements in several micro-mesoscale devices.

  View details for DOI 10.1038/s41598-022-16281-5

  View details for PubMedID 35842450

• Heat Conductor-Insulator Transition in Electrochemically Controlled Hybrid Superlattices. Nano letters Zhou, J., Wu, Y., Kwon, H., Li, Y., Xiao, X., Ye, Y., Ma, Y., Goodson, K. E., Hwang, H. Y., Cui, Y. 2022

  Abstract

  Designing materials with ultralow thermal conductivity has broad technological impact, from thermal protection to energy harvesting. Low thermal conductivity is commonly observed in anharmonic and strongly disordered materials, yet a microscopic understanding of the correlation to atomic motion is often lacking. Here we report that molecular insertion into an existing two-dimensional layered lattice structure creates a hybrid superlattice with extremely low thermal conductivity. Vibrational characterization and ab initio molecular dynamics simulations reveal strong damping of transverse acoustic waves and significant softening of longitudinal vibrations. Together with spectral correlation analysis, we demonstrate that the molecular insertion creates liquid-like atomic motion in the existing lattice framework, causing a large suppression of heat conduction. The hybrid materials can be transformed into solution-processable coatings and used for thermal protection in wearable electronics. Our work provides a generic mechanism for the design of heat insulators and may further facilitate the engineering of heat conduction based on understanding atomic correlations.

  View details for DOI 10.1021/acs.nanolett.2c01407

  View details for PubMedID 35715219

• Electro-Thermal Confinement Enables Improved Superlattice Phase Change Memory IEEE ELECTRON DEVICE LETTERS Khan, A., Kwon, H., Chen, M. E., Asheghi, M., Wong, H., Goodson, K. E., Pop, E. 2022; 43 (2): 204-207

  View details for DOI 10.1109/LED.2021.3133906

  View details for Web of Science ID 000748371400013

• Nanoscale Phase Change Memory Arrays Patterned by Block Copolymer Directed Self-Assembly Tung, M. C., Khan, A., Kwon, H., Asheghi, M., Goodson, K. E., Pop, E., Wong, H., Panning, E. M., Liddle, J. A. SPIE-INT SOC OPTICAL ENGINEERING. 2022

  View details for DOI 10.1117/12.2611737

  View details for Web of Science ID 000839339400005

• Multiobjective Optimization of Graded, Hybrid Micropillar Wicks for Capillary-Fed Evaporation. Langmuir : the ACS journal of surfaces and colloids Liu, T., Asheghi, M., Goodson, K. E. 1800

  Abstract

  As electronic device power densities continue to increase, vapor chambers and heat pipes have emerged as effective thermal management solutions for hotspot mitigation. A crucial aspect of vapor chamber functionality depends on the properties of the microporous wick that drives heat and mass transport within the device. While many prior studies have focused on the optimization of these porous structures to increase the maximum capillary-limited dryout heat flux, an equally important aspect of porous wick design is the minimization of the thermal resistance above heated areas. Segmented wicks with geometries that vary along the length of the wick are attractive candidates that can potentially be used to fulfill these simultaneous design goals. Previous studies on bisegmented wicks with only two distinct adiabatic and heated region geometries, however, have shown mixed results regarding the degree of performance benefit over homogeneous wicks. In this work, we present a systematic modeling approach to investigate the optimal composition of segmented micropillar wicks comprising multiple, discrete regions of graded geometry. Using a genetic algorithm, we generate Pareto fronts of optimal segmented wick distributions that maximize the dryout heat flux and minimize the thermal resistance for a given heating configuration. We find that optimal, graded segmented wicks are capable of dissipating dryout heat fluxes more than 200% higher than baseline homogeneous wicks with significantly lower thermal resistance. The sensitivity of the wick performance to the total number of geometry segments is found to vary depending on the desired heat flux and thermal resistance operating regimes.

  View details for DOI 10.1021/acs.langmuir.1c02429

  View details for PubMedID 34967627

• Non-Contact Mass Density and Thermal Conductivity Measurements of Organic Thin Films Using Frequency-Domain Thermoreflectance ADVANCED MATERIALS INTERFACES Perez, C., Knepper, R., Marquez, M. P., Forrest, E. C., Tappan, A. S., Asheghi, M., Goodson, K. E., Ziade, E. O. 2021

  View details for DOI 10.1002/admi.202101404

  View details for Web of Science ID 000726321600001

• Thermal Characterization of Metal-Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers. ACS applied materials & interfaces Kwon, H., Perez, C., Park, W., Asheghi, M., Goodson, K. E. 2021

  Abstract

  Metal-oxide thermal boundary conductance (TBC) strongly influences the temperature rise in nanostructured systems, such as dense interconnects, when its value is comparable to the thermal conductance of the amorphous dielectric oxide. However, the thermal characterization of metal-amorphous oxide TBC is often hampered by the measurement insensitivity of techniques such as time-domain thermoreflectance (TDTR). Here, we use metal nanograting structures as opto-thermal transducers in TDTR to measure the TBC of metal-oxide interfaces. Combined with an ultrafast pump-probe laser measurement approach, the nanopatterned structures amplify the contribution of the thermal boundary resistance (TBR), the inverse of TBC, over the thermal resistance of the adjacent material, thereby enhancing measurement sensitivity. For demonstration purposes, we report the TBC between Al and SiO2 films. We then compare the impact of Al grating dimensions on the measured TBC values, sensitivities, and uncertainties. The grating periods L used in this study range from 150 to 300 nm, and the bridge widths w range from 72 to 205 nm. With the narrowest grating transducers (72 nm), the TBC of Al-SiO2 interfaces is measured to be 159-48+61 MW m-2 K-1, with the experimental sensitivity being 5* higher than that of a blanket Al film. This improvement is attributed to the reduced contribution of the SiO2 film thermal resistance to the temperature signal from TDTR response. The nanograting measurement approach described here is promising for the thermal characterization of a variety of nanostructured metal-amorphous passivation systems and interfaces common in semiconductor technology.

  View details for DOI 10.1021/acsami.1c12422

  View details for PubMedID 34797056

• Integrated cooling (i-Cool) textile of heat conduction and sweat transportation for personal perspiration management. Nature communications Peng, Y., Li, W., Liu, B., Jin, W., Schaadt, J., Tang, J., Zhou, G., Wang, G., Zhou, J., Zhang, C., Zhu, Y., Huang, W., Wu, T., Goodson, K. E., Dames, C., Prasher, R., Fan, S., Cui, Y. 2021; 12 (1): 6122

  Abstract

  Perspiration evaporation plays an indispensable role in human body heat dissipation. However, conventional textiles tend to focus on sweat removal and pay little attention to the basic thermoregulation function of sweat, showing limited evaporation ability and cooling efficiency in moderate/profuse perspiration scenarios. Here, we propose an integrated cooling (i-Cool) textile with unique functional structure design for personal perspiration management. By integrating heat conductive pathways and water transport channels decently, i-Cool exhibits enhanced evaporation ability and high sweat evaporative cooling efficiency, not merely liquid sweat wicking function. In the steady-state evaporation test, compared to cotton, up to over 100% reduction in water mass gain ratio, and 3 times higher skin power density increment for every unit of sweat evaporation are demonstrated. Besides, i-Cool shows about 3°C cooling effect with greatly reduced sweat consumption than cotton in the artificial sweating skin test. The practical application feasibility of i-Cool design principles is well validated based on commercial fabrics. Owing to its exceptional personal perspiration management performance, we expect the i-Cool concept can provide promising design guidelines for next-generation perspiration management textiles.

  View details for DOI 10.1038/s41467-021-26384-8

  View details for PubMedID 34675199

• The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Bar-Cohen, A., Asheghi, M., Chainer, T. J., Garimella, S., Goodson, K., Gorle, C., Mandel, R., Maurer, J. J., Ohadi, M., Palko, J. W., Parida, P. R., Peles, Y., Plawsky, J. L., Schultz, M. D., Weibel, J. A., Joshi, Y. 2021; 11 (10): 1546-1564

  View details for DOI 10.1109/TCPMT.2021.3111114

  View details for Web of Science ID 000712564200007

• Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Jung, D., Lee, H., Kong, D., Cho, E., Jung, K., Kharangate, C. R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K. E., Lee, H. 2021; 175

  View details for DOI 10.1016/j.ijheatmasstransfer.2021.121192

  View details for Web of Science ID 000655080900012

• An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink APPLIED THERMAL ENGINEERING Lee, H., Kang, M., Jung, K., Kharangate, C. R., Lee, S., Iyengar, M., Malone, C., Asheghi, M., Goodson, K. E., Lee, H. 2021; 194

  View details for DOI 10.1016/j.applthermaleng.2021.117012

  View details for Web of Science ID 000660532500008

• Graphene-based electromechanical thermal switches 2D MATERIALS Chen, M. E., Rojo, M., Lian, F., Koeln, J., Sood, A., Bohaichuk, S. M., Neumann, C. M., Garrow, S. G., Goodson, K. E., Alleyne, A. G., Pop, E. 2021; 8 (3)

  View details for DOI 10.1088/2053-1583/abf08e

  View details for Web of Science ID 000664728700001

• Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Goodson, K. E. 2021; 173

  View details for DOI 10.1016/j.ijheatmasstransfer.2021.121241

  View details for Web of Science ID 000646196300039

• Simultaneous thickness and thermal conductivity measurements of thinned silicon from 100nm to 17 mu m APPLIED PHYSICS LETTERS Scott, E. A., Perez, C., Saltonstall, C., Adams, D. P., Hodges, V., Asheghi, M., Goodson, K. E., Hopkins, P. E., Leonhardt, D., Ziade, E. 2021; 118 (20)

  View details for DOI 10.1063/5.0050888

  View details for Web of Science ID 000687572500001

• Thermal expansion characterization of thin films using harmonic Joule heating combined with atomic force microscopy APPLIED PHYSICS LETTERS Chaikasetsin, S., Kodama, T., Bae, K., Jung, J., Shin, J., Lee, B., Kim, B. Y., Seo, J., Sim, U., Prinz, F. B., Goodson, K. E., Park, W. 2021; 118 (19)

  View details for DOI 10.1063/5.0049160

  View details for Web of Science ID 000649073600015

• Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. ACS applied materials & interfaces Kwon, H., Perez, C., Kim, H. K., Asheghi, M., Park, W., Goodson, K. E. 2021

  Abstract

  Interfaces govern thermal transport in a variety of nanostructured systems such as FinFETs, interconnects, and vias. Thermal boundary resistances, however, critically depend on the choice of materials, nanomanufacturing processes and conditions, and the planarity of interfaces. In this work, we study the interfacial thermal transport between a nonreactive metal (Pt) and a dielectric by engineering two differing bonding characters: (i) the mechanical adhesion/van der Waals bonding offered by the physical vapor deposition (PVD) and (ii) the chemical bonding generated by plasma-enhanced atomic layer deposition (PEALD). We introduce 40-cycle (2 nm thick), nearly continuous PEALD Pt films between 98 nm PVD Pt and dielectric materials (8.0 nm TiO2/Si and 11.0 nm Al2O3/Si) treated with either O2 or O2 + H2 plasma to modulate their bonding strengths. By correlating the treatments through thermal transport measurements using time-domain thermoreflectance (TDTR), we find that the thermal boundary resistances are consistently reduced with the same increased treatment complexity that has been demonstrated in the literature to enhance mechanical adhesion. For samples on TiO2 (Al2O3), reductions in thermal resistance are at least 4% (10%) compared to those with no PEALD Pt at all, but could be as large as 34% (42%) given measurement uncertainties that could be improved with thinner nucleation layers. We suspect the O2 plasma generates stronger covalent bonds to the substrate, while the H2 plasma strips the PEALD Pt of contaminants such as carbon that gives rise to a less thermally resistive heat conduction pathway.

  View details for DOI 10.1021/acsami.0c19197

  View details for PubMedID 33914509

• Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter. Advanced science (Weinheim, Baden-Wurttemberg, Germany) Park, J., Bae, K., Kim, T. R., Perez, C., Sood, A., Asheghi, M., Goodson, K. E., Park, W. 2021; 8 (3): 2002876

  Abstract

  Transmission electron microscopy (TEM) is arguably the most important tool for atomic-scale material characterization. A significant portion of the energy of transmitted electrons is transferred to the material under study through inelastic scattering, causing inadvertent damage via ionization, radiolysis, and heating. In particular, heat generation complicates TEM observations as the local temperature can affect material properties. Here, the heat generation due to electron irradiation is quantified using both top-down and bottom-up approaches: direct temperature measurements using nanowatt calorimeters as well as the quantification of energy loss due to inelastic scattering events using electron energy loss spectroscopy. Combining both techniques, a microscopic model is developed for beam-induced heating and to identify the primary electron-to-heat conversion mechanism to be associated with valence electrons. Building on these results, the model provides guidelines to estimate temperature rise for general materials with reasonable accuracy. This study extends the ability to quantify thermal impact on materials down to the atomic scale.

  View details for DOI 10.1002/advs.202002876

  View details for PubMedID 33552867

  View details for PubMedCentralID PMC7856892

• Achieving High Thermoelectric Performance and Metallic Transport in Solvent-Sheared PEDOT:PSS ADVANCED ELECTRONIC MATERIALS Hinckley, A. C., Andrews, S. C., Dunham, M. T., Sood, A., Barako, M. T., Schneider, S., Toney, M. F., Goodson, K. E., Bao, Z. 2021

  View details for DOI 10.1002/aelm.202001190

  View details for Web of Science ID 000612298700001

• Deposition and Fabrication of Sputtered Bismuth Telluride and Antimony Telluride for Microscale Thermoelectric Energy Harvesters THIN SOLID FILMS Haidar, S. A., Gao, Y., He, Y., Cornett, J. E., Chen, B., Coburn, N. J., Glynn, C., Dunham, M. T., Goodson, K. E., Sun, N. 2021; 717

  View details for DOI 10.1016/j.tsf.2020.138444

  View details for Web of Science ID 000604796900006

• Engineering Thermal Transport across Layered Graphene-MoS2 Superlattices. ACS nano Sood, A., Sievers, C., Shin, Y. C., Chen, V., Chen, S., Smithe, K. K., Chatterjee, S., Donadio, D., Goodson, K. E., Pop, E. 2021

  Abstract

  Layering two-dimensional van der Waals materials provides a high degree of control over atomic placement, which could enable tailoring of vibrational spectra and heat flow at the sub-nanometer scale. Here, using spatially resolved ultrafast thermoreflectance and spectroscopy, we uncover the design rules governing cross-plane heat transport in superlattices assembled from monolayers of graphene (G) and MoS2 (M). Using a combinatorial experimental approach, we probe nine different stacking sequences, G, GG, MG, GGG, GMG, GGMG, GMGG, GMMG, and GMGMG, and identify the effects of vibrational mismatch, interlayer adhesion, and junction asymmetry on thermal transport. Pure G sequences display evidence of quasi-ballistic transport, whereas adding even a single M layer strongly disrupts heat conduction. The experimental data are described well by molecular dynamics simulations, which include thermal expansion, accounting for the effect of finite temperature on the interlayer spacing. The simulations show that an increase of ∼2.4% in the layer separation of GMGMG, relative to its value at 300 K, can lead to a doubling of the thermal resistance. Using these design rules, we experimentally demonstrate a five-layer GMGMG superlattice "thermal metamaterial" with an ultralow effective cross-plane thermal conductivity comparable to that of air.

  View details for DOI 10.1021/acsnano.1c06299

  View details for PubMedID 34813267

• A HYBRID MICROPOROUS COPPER STRUCTURE FOR HIGH PEROFMRANCE CAPILLARY-DRIVEN Soroush, F., Liu, T., Wu, Q., Zhang, C., Asheghi, M., Goodson, K. E., Marco, L., Christian, E., Martin, R., Amer Soc Mech Engineers AMER SOC MECHANICAL ENGINEERS. 2021

  View details for Web of Science ID 000884335000040

• CONTACT ANGLE TUNING OF COPPER MICROPOROUS STRUCTURES Soroush, F., Liu, T., Wu, Q., Asheghi, M., Goodson, K. E., Marco, L., Christian, E., Martin, R., Amer Soc Mech Engineers AMER SOC MECHANICAL ENGINEERS. 2021

  View details for Web of Science ID 000884335000055

• Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films. Nano letters Kwon, H., Khan, A. I., Perez, C., Asheghi, M., Pop, E., Goodson, K. E. 2021

  Abstract

  Superlattice-like phase change memory (SL-PCM) promises lower switching current than conventional PCM based on Ge2Sb2Te5 (GST); however, a fundamental understanding of SL-PCM requires detailed characterization of the interfaces within such an SL. Here we explore the electrical and thermal transport of SLs with deposited Sb2Te3 and GeTe alternating layers of various thicknesses. We find up to an approximately four-fold reduction of the effective cross-plane thermal conductivity of the SL stack (as-deposited polycrystalline) compared with polycrystalline GST (as-deposited amorphous and later annealed) due to the thermal interface resistances within the SL. Thermal measurements with varying periods of our SLs show a signature of phonon coherence with a transition from wave-like to particle-like phonon transport, further described by our modeling. Electrical resistivity measurements of such SLs reveal strong anisotropy (∼2000×) between the in-plane and cross-plane directions due to the weakly interacting van der Waals-like gaps. This work uncovers electrothermal transport in SLs based on Sb2Te3 and GeTe for the improved design of low-power PCM.

  View details for DOI 10.1021/acs.nanolett.1c00947

  View details for PubMedID 34270270

• Performance and Manufacturing of Silicon-Based Vapor Chambers APPLIED MECHANICS REVIEWS Liu, T., Asheghi, M., Goodson, K. E. 2021; 73 (1)

  View details for DOI 10.1115/1.4049801

  View details for Web of Science ID 000636310000002

• Tuning electrical and interfacial thermal properties of bilayer MoS2 via electrochemical intercalation. Nanotechnology Xiong, F. n., Yalon, E. n., McClellan, C. n., Zhang, J. n., Aslan, O. B., Sood, A. n., Sun, J. n., Andolina, C. M., Al-Saidi, W. A., Goodson, K. E., Heinz, T. n., Cui, Y. n., Pop, E. n. 2021

  Abstract

  Layered two-dimensional (2D) materials such as MoS2 have attracted much attention for nano- and opto-electronics. Recently, intercalation (e.g. of ions, atoms, or molecules) has emerged as an effective technique to reversibly modulate material properties of such layered 2D films. Here we probe both electrical and thermal properties of Li-intercalated bilayer MoS2 nanosheets by combined electrical measurements and Raman spectroscopy. We demonstrate reversible modulation of carrier density over more than two orders of magnitude (from 0.8×1012 cm 2 to 1.5×1014 cm-2), and we simultaneously obtain the thermal boundary conduct-ance (TBC) between the bilayer and its supporting SiO2 substrate for an intercalated system for the first time. This thermal coupling can be reversibly modulated by nearly a factor of eight, from 14 ± 4.0 MWm-2K-1 before intercalation to 1.8 ± 0.9 MWm 2K-1 when the MoS2 is fully lithiated. These results reveal electrochemical intercalation as a reversible tool to modulate and control both electrical and thermal properties of 2D layers.

  View details for DOI 10.1088/1361-6528/abe78a

  View details for PubMedID 33601363

• Bicontinuous Mesoporous Metal Foams with Enhanced Conductivity and Tunable Pore Size and Porosity via Electrodeposition for Electrochemical and Thermal Systems ACS APPLIED NANO MATERIALS Katz, J. S., Zhang, C., Barako, M. T., Kim, H. K., Asheghi, M., Kenny, T. W., Goodson, K. E. 2020; 3 (12): 12408–15

  View details for DOI 10.1021/acsanm.0c02970

  View details for Web of Science ID 000603402500078

• Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter ADVANCED SCIENCE Park, J., Bae, K., Kim, T., Perez, C., Sood, A., Asheghi, M., Goodson, K. E., Park, W. 2020

  View details for DOI 10.1002/advs.202002876

  View details for Web of Science ID 000600363000001

• Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation With Binary Diffusion IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Liu, T., Palko, J. W., Katz, J. S., Zhou, F., Dede, E. M., Asheghi, M., Goodson, K. E. 2020; 10 (12): 1996–2007

  View details for DOI 10.1109/TCPMT.2020.3005880

  View details for Web of Science ID 000602708500007

• Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi2Te3 Thermoelectric Interfacial Layer IEEE ELECTRON DEVICE LETTERS Khan, A., Kwon, H., Islam, R., Perez, C., Chen, M. E., Asheghi, M., Goodson, K. E., Wong, H., Pop, E. 2020; 41 (11): 1657–60

  View details for DOI 10.1109/LED.2020.3028271

  View details for Web of Science ID 000584248800011

• Low Offset and Noise in High Biased GaN 2DEG Hall-Effect Plates Investigated With Infrared Microscopy JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Dowling, K. M., Liu, T., Alpert, H. S., Chapin, C. A., Eisner, S. R., Yalamarthy, A., Satterthwaite, P. F., Kock, H., Ausserlechner, U., Asheghi, M., Goodson, K. E., Senesky, D. G. 2020; 29 (5): 669–76

  View details for DOI 10.1109/JMEMS.2020.3013187

  View details for Web of Science ID 000576466500008

• Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1-Experimental Study of Single-Phase Cooling Performance With R-245fa Jung, K., Cho, E., Lee, H., Kharangate, C., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E. ASME. 2020

  View details for DOI 10.1115/1.4047846

  View details for Web of Science ID 000576282500018

• Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers-Part 2: Parametric Study of EMMCs for High Heat Flux (similar to 1kW/cm(2)) Power Electronics Cooling Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K. E. ASME. 2020

  View details for DOI 10.1115/1.4047883

  View details for Web of Science ID 000576282500019

• Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)-Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Hazra, S., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K. E. ASME. 2020

  View details for DOI 10.1115/1.4047847

  View details for Web of Science ID 000576282500020

• Effect of Adventitious Carbon on Pit Formation of Monolayer MoS2. Advanced materials (Deerfield Beach, Fla.) Park, S., Siahrostami, S., Park, J., Mostaghimi, A. H., Kim, T. R., Vallez, L., Gill, T. M., Park, W., Goodson, K. E., Sinclair, R., Zheng, X. 2020: e2003020

  Abstract

  Forming pits on molybdenum disulfide (MoS2 ) monolayers is desirable for (opto)electrical, catalytic, and biological applications. Thermal oxidation is a potentially scalable method to generate pits on monolayer MoS2 , and pits are assumed to preferentially form around undercoordinated sites, such as sulfur vacancies. However, studies on thermal oxidation of MoS2 monolayers have not considered the effect of adventitious carbon (C) that is ubiquitous and interacts with oxygen at elevated temperatures. Herein, the effect of adventitious C on the pit formation on MoS2 monolayers during thermal oxidation is studied. The in situ environmental transmission electron microscopy measurements herein show that pit formation is preferentially initiated at the interface between adventitious C nanoparticles and MoS2 , rather than only sulfur vacancies. Density functional theory (DFT) calculations reveal that the C/MoS2 interface favors the sequential adsorption of oxygen atoms with facile kinetics. These results illustrate the important role of adventitious C on pit formation on monolayer MoS2 .

  View details for DOI 10.1002/adma.202003020

  View details for PubMedID 32743836

• Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Liu, T., Dunham, M. T., Jung, K., Chen, B., Asheghi, M., Goodson, K. E. 2020; 152

  View details for DOI 10.1016/j.ijheatmasstransfer.2020.119569

  View details for Web of Science ID 000528005400060

• Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices APPLIED PHYSICS LETTERS Guo, P., Burrow, J. A., Sevison, G. A., Kwon, H., Perez, C., Hendrickson, J. R., Smith, E. M., Asheghi, M., Goodson, K. E., Agha, I., Sarangan, A. M. 2020; 116 (13)

  View details for DOI 10.1063/1.5142552

  View details for Web of Science ID 000524534800001

• Investigation of 3D manifold architecture heat sinks in air-cooled condensers APPLIED THERMAL ENGINEERING Kharangate, C. R., Libeer, W., Palko, J., Lee, H., Shi, J., Asheghi, M., Goodson, K. E. 2020; 167

  View details for DOI 10.1016/j.applthermaleng.2019.114700

  View details for Web of Science ID 000513289700060

• Lithography and Etching-Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation ADVANCED ENGINEERING MATERIALS Tuan-Khoa Nguyen, Hoang-Phuong Phan, Dowling, K. M., Yalamarthy, A., Toan Dinh, Balakrishnan, V., Liu, T., Chapin, C. A., Quoc-Dung Truong, Van Thanh Dau, Goodson, K. E., Senesky, D. G., Dzung Viet Dao, Nam-Trung Nguyen 2020

  View details for DOI 10.1002/adem.201901173

  View details for Web of Science ID 000511390300001

• Phase Change Dynamics and Two-Dimensional 4-Bit Memory in Ge2Sb2Te5 via Telecom-Band Encoding ACS PHOTONICS Sevison, G. A., Farzinazar, S., Burrow, J. A., Perez, C., Kwon, H., Lee, J., Asheghi, M., Goodson, K. E., Sarangan, A., Hendrickson, J. R., Agha, I. 2020; 7 (2): 480–87

  View details for DOI 10.1021/acsphotonics.9b01456

  View details for Web of Science ID 000515214200021

• Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma-Enhanced Atomic Layer Deposition. ACS applied materials & interfaces Kim, Y. n., Kwon, H. n., Han, H. S., Kim, H. J., Kim, B. S., Lee, B. C., Lee, J. n., Asheghi, M. n., Prinz, F. B., Goodson, K. E., Lim, J. n., Sim, U. n., Park, W. n. 2020

  Abstract

  The ability to control the properties of dielectric thin films on demand is of fundamental interest in nanoscale devices. Here, we modulate plasma characteristics at the surface of a substrate to tune both dielectric constant and thermal conductivity of amorphous thin films grown using plasma-enhanced atomic layer deposition. Specifically, we apply a substrate bias ranging from 0 to ∼117 V and demonstrate the systematic tunability of various material parameters of Al2O3. As a function of the substrate bias, we find a nonmonotonical evolution of intrinsic properties, including density, dielectric constant, and thermal conductivity. A key observation is that the maximum values in dielectric constant and effective thermal conductivity emerge at different substrate biases. The impact of density on both thermal conductivity and dielectric constant is further examined using a differential effective medium theory and the Clausius-Mossotti model, respectively. We find that the peak value in the dielectric constant deviates from the Clausius-Mossotti model, indicating the change of oxygen fraction in our thin films as a function of substrate bias. This finding suggests that the increased local strength of plasma sheath not only enhances material density but also controls the dynamics of microstructural defect formation beyond what is possible with conventional approaches. Based on our experimental observations and modeling, we further build a phenomenological relation between dielectric constant and thermal conductivity. Our results pave invaluable avenues for optimizing dielectric thin films at the atomic scale for a wide range of applications in nanoelectronics and energy devices.

  View details for DOI 10.1021/acsami.0c11086

  View details for PubMedID 32915545

• Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silicon-based Thermal Management Devices Soroush, F., Jung, K., Iyengar, M., Malone, C., Asheghi, M., Goodson, K., IEEE IEEE. 2020: 957-962

  View details for Web of Science ID 000701365300129

• Microfabrication Challenges for Silicon-based Large Area (> 500 mm(2)) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal Hazra, S., Piazza, A., Jung, K., Asheghi, M., Gupta, M., Jih, E., Degner, M., Goodson, K. E., IEEE IEEE. 2020: 83-90

  View details for Web of Science ID 000701365300012

• Considerations and Challenges for Large Area Embedded Micro-channels with 3D Manifold in High Heat Flux Power Electronics Applications Piazza, A., Hazra, S., Jung, K., Degner, M., Gupta, M., Jih, E., Asheghi, M., Goodson, K. E., IEEE IEEE. 2020: 77-82

  View details for Web of Science ID 000701365300011

• ADDRESSING THE CHALLENGES IN LASER MICRO-MACHINING AND BONDING OF SILICON MICROCHANNEL COLD-PLATE AND 3D-MANIFOLD FOR EMBEDDED COOLING APPLICATIONS: PERFECT DEBRIS REMOVAL Hazra, S., Jung, K., Lyengar, M., Malone, C., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2020

  View details for Web of Science ID 000518236000010

• PARAMETRIC STUDY OF SILICON -BASED EMBEDDED MICROCHANNELS WITH 3D MANIFOLD COOLERS (EMMC) FOR HIGH HEAT FLUX (-1 kW/cm2) POWER ELECTRONICS COOLING Jung, K., Hazra, S., Kwon, H., Piazza, A., Jih, E., Asheghi, M., Gupta, M., Degner, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2020

  View details for Web of Science ID 000518236000064

• Pixel level demonstration of phase change material based spatial light modulation Burrow, J. A., Sevison, G. A., Asheghi, M., Hendrickson, J. R., Sarangan, A., Goodson, K. E., Agha, I., IEEE IEEE. 2020

  View details for Web of Science ID 000612090000285

• Experimental Investigation of Single-phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger with R-245fa Jung, K., Lee, H., Kharangate, C., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2020

  View details for Web of Science ID 000518236000050

• Tunable, passive thermal regulation through liquid to vapor phase change APPLIED PHYSICS LETTERS Liu, T., Palko, J. W., Katz, J. S., Dede, E., Zhou, F., Asheghi, M., Goodson, K. E. 2019; 115 (25)

  View details for DOI 10.1063/1.5133795

  View details for Web of Science ID 000505535900013

• Thermal conductivity of crystalline AlN and the influence of atomic-scale defects JOURNAL OF APPLIED PHYSICS Xu, R., Rojo, M., Islam, S. M., Sood, A., Vareskic, B., Katre, A., Mingo, N., Goodson, K. E., Xing, H., Jena, D., Pop, E. 2019; 126 (18)

  View details for DOI 10.1063/1.5097172

  View details for Web of Science ID 000504002600023

• Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Kong, D., Jung, K., Jung, S., Jung, D., Schaadt, J., Lyengar, M., Malone, C., Kharangate, C. R., Asheghi, M., Goodson, K. E., Lee, H. 2019; 141: 145–55

  View details for DOI 10.1016/j.ijheatmasstransfer.2019.05.073

  View details for Web of Science ID 000480665000013

• Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Flader, I. B., Chen, Y., Yang, Y., Ng, E. J., Shin, D. D., Heinz, D. B., Ortiz, L., Alter, A. L., Park, W., Goodson, K. E., Kenny, T. W. 2019; 28 (3): 372–81

  View details for DOI 10.1109/JMEMS.2019.2900761

  View details for Web of Science ID 000470838300007

• Understanding the switching mechanism of interfacial phase change memory JOURNAL OF APPLIED PHYSICS Okabe, K. L., Sood, A., Yalon, E., Neumann, C. M., Asheghi, M., Pop, E., Goodson, K. E., Wong, H. 2019; 125 (18)

  View details for DOI 10.1063/1.5093907

  View details for Web of Science ID 000470151800040

• Quasi-Ballistic Thermal Transport Across MoS2 Thin Films NANO LETTERS Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K. E., Pop, E. 2019; 19 (4): 2434–42

  View details for DOI 10.1021/acs.nanolett.8b05174

  View details for Web of Science ID 000464769100032

• Strongly tunable anisotropic thermal transport in MoS2 by strain and lithium intercalation: first-principles calculations 2D MATERIALS Chen, S., Sood, A., Pop, E., Goodson, K. E., Donadio, D. 2019; 6 (2)

  View details for DOI 10.1088/2053-1583/ab0715

  View details for Web of Science ID 000461519800001

• Quasi-Ballistic Thermal Transport Across MoS2 Thin Films. Nano letters Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K. E., Pop, E. 2019

  Abstract

  Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. Conventionally, it is thought that cross-plane thermal conductivities (kappa z) are low, and therefore c-axis phonon mean free paths (MFPs) are small. Here, we measure kappa z across MoS2 films of varying thickness (20-240 nm) and uncover evidence of very long c-axis phonon MFPs at room temperature in these layered semiconductors. Experimental data obtained using time-domain thermoreflectance (TDTR) are in good agreement with first-principles density functional theory (DFT). These calculations suggest that 50% of the heat is carried by phonons with MFP > 200 nm, exceeding kinetic theory estimates by nearly 2 orders of magnitude. Because of quasi-ballistic effects, the kappa z of nanometer-thin films of MoS2 scales with theirthickness and the volumetric thermal resistance asymptotes to a nonzero value, 10 m2 K GW-1. This contributes as much as 30% to the total thermal resistance of a 20 nm thick film, the rest being limited by thermal interface resistance with the SiO2 substrate and top-side aluminum transducer. These findings are essential for understanding heat flow across nanometer-thin films of MoS2 for optoelectronic and thermoelectric applications.

  View details for PubMedID 30808167

• Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Jung, K., Kharangate, C. R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E. 2019; 130: 1108–19

  View details for DOI 10.1016/j.ijheatmasstransfer.2018.10.108

  View details for Web of Science ID 000456226400094

• A Compact 50-kW Traction Inverter Design Using Off-the-Shelf Components Alizadeh, R., Adamson, T., Balda, J., Zhao, Y., Asheghi, M., Goodson, K. E., IEEE IEEE. 2019: 2614–19

  View details for Web of Science ID 000475931102123

• Experimental Study of Single-Phase Cooling with DI Water in An Embedded Microchannels-3D Manifold Cooler Jung, K., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E., IEEE IEEE. 2019: 164–66

  View details for Web of Science ID 000556657800038

• Optical and electrical properties of phase change materials for high-speed optoelectronics Burrow, J. A., Guo, P., Sevison, G. A., Kwon, H., Perez, C., Asheghi, M., Hendrickson, J. R., Sarangan, A., Goodson, K. E., Agha, I., IEEE IEEE. 2019

  View details for Web of Science ID 000482226302008

• Publisher Correction: An electrochemical thermal transistor. Nature communications Sood, A. n., Xiong, F. n., Chen, S. n., Wang, H. n., Selli, D. n., Zhang, J. n., McClellan, C. J., Sun, J. n., Donadio, D. n., Cui, Y. n., Pop, E. n., Goodson, K. E. 2019; 10 (1): 4465

  Abstract

  An amendment to this paper has been published and can be accessed via a link at the top of the paper.

  View details for DOI 10.1038/s41467-019-12471-4

  View details for PubMedID 31562331

• A method for quantifying in plane permeability of porous thin films JOURNAL OF COLLOID AND INTERFACE SCIENCE Rong, G., Palko, J. W., Oyarzun, D. I., Zhang, C., Hammerle, J., Asheghi, M., Goodson, K. E., Santiago, J. G. 2018; 530: 667–74

  View details for DOI 10.1016/j.jcis.2018.05.062

  View details for Web of Science ID 000442700000072

• An electrochemical thermal transistor. Nature communications Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C. J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K. E. 2018; 9 (1): 4510

  Abstract

  The ability to actively regulate heat flow at the nanoscale could be a game changer for applications in thermal management and energy harvesting. Such a breakthrough could also enable the control of heat flow using thermal circuits, in a manner analogous to electronic circuits. Here we demonstrate switchable thermal transistors with an order of magnitude thermal on/off ratio, based on reversible electrochemical lithium intercalation in MoS2 thin films. We use spatially-resolved time-domain thermoreflectance to map the lithium ion distribution during device operation, and atomic force microscopy to show that the lithiated state correlates with increased thickness and surface roughness. First principles calculations reveal that the thermal conductance modulation is due to phonon scattering by lithium rattler modes, c-axis strain, and stacking disorder. This study lays the foundation for electrochemically-driven nanoscale thermal regulators, and establishes thermal metrology as a useful probe of spatio-temporal intercalant dynamics in nanomaterials.

  View details for PubMedID 30375375

• Improving the performance of Ge2Sb2Te5 materials via nickel doping: Towards RF-compatible phase-change devices APPLIED PHYSICS LETTERS Guo, P., Burrow, J. A., Sevison, G. A., Sood, A., Asheghi, M., Hendrickson, J. R., Goodson, K. E., Agha, I., Sarangan, A. 2018; 113 (17)

  View details for DOI 10.1063/1.5053713

  View details for Web of Science ID 000449145700019

• Optimizing the design of composite phase change materials for high thermal power density JOURNAL OF APPLIED PHYSICS Barako, M. T., Lingamneni, S., Katz, J. S., Liu, T., Goodson, K. E., Tice, J. 2018; 124 (14)

  View details for DOI 10.1063/1.5031914

  View details for Web of Science ID 000447148100020

• Tailoring Permeability of Microporous Copper Structures through Template Sintering ACS APPLIED MATERIALS & INTERFACES Zhang, C., Palko, J. W., Rong, G., Pringle, K. S., Barako, M. T., Dusseault, T. J., Asheghi, M., Santiago, J. G., Goodson, K. E. 2018; 10 (36): 30487–94

  View details for DOI 10.1021/acsami.8b03774

  View details for Web of Science ID 000444793000053

• Phonon Scattering in Silicon by Multiple Morphological Defects: A Multiscale Analysis JOURNAL OF ELECTRONIC MATERIALS Lorenzi, B., Dettori, R., Dunham, M. T., Melis, C., Tonini, R., Colombo, L., Sood, A., Goodson, K. E., Narducci, D. 2018; 47 (9): 5148–57

  View details for DOI 10.1007/s11664-018-6337-z

  View details for Web of Science ID 000440111200038

• Tailoring Permeability of Microporous Copper Structures through Template Sintering. ACS applied materials & interfaces Zhang, C., Palko, J. W., Rong, G., Pringle, K. S., Barako, M. T., Dusseault, T. J., Asheghi, M., Santiago, J. G., Goodson, K. E. 2018

  Abstract

  Microporous metals are used extensively for applications that combine convective and conductive transport and benefit from low resistance to both modes of transport. Conventional fabrication methods, such as direct sintering of metallic particles, however, often produce structures with limited fluid transport properties due to the lack of control over pore morphologies such as the pore size and porosity. Here, we demonstrate control and improvement of hydraulic permeability of microporous copper structures fabricated using template-assisted electrodeposition. Template sintering is shown to modify the fluid transport network in a manner that increases permeability by nearly an order of magnitude with a less significant decrease (38%) in thermal conductivity. The measured permeabilities range from 4.8 * 10-14 to 1.3 * 10-12 m2 with 5 mum pores, with the peak value being roughly 5 times larger than the published values for sintered copper particles of comparable feature sizes. Analysis indicates that the enhancement of permeability is limited by constrictions, i.e., bottlenecks between connecting pores, whose dimensions are highly sensitive to the sintering conditions. We further show contrasting trends in permeability versus conductivity of the electrodeposited microporous copper and conventional sintered copper particles and suggest these differing trends to be the result of their inverse structural relationship.

  View details for PubMedID 30096232

• Impact of thermally dead volume on phonon conduction along silicon nanoladders NANOSCALE Park, W., Sohn, J., Romano, G., Kodama, T., Sood, A., Katz, J. S., Kim, B. Y., So, H., Ahn, E. C., Asheghi, M., Kolpak, A. M., Goodson, K. E. 2018; 10 (23): 11117–22

  View details for DOI 10.1039/c8nr01788c

  View details for Web of Science ID 000435358600035

• Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale Park, W., Sohn, J., Romano, G., Kodama, T., Sood, A., Katz, J. S., Kim, B. S., So, H., Ahn, E. C., Asheghi, M., Kolpak, A. M., Goodson, K. E. 2018

  Abstract

  Thermal conduction in complex periodic nanostructures remains a key area of open questions and research, and a particularly provocative and challenging detail is the impact of nanoscale material volumes that do not lie along the optimal line of sight for conduction. Here, we experimentally study thermal transport in silicon nanoladders, which feature two orthogonal heat conduction paths: unobstructed line-of-sight channels in the axial direction and interconnecting bridges between them. The nanoladders feature an array of rectangular holes in a 10 mum long straight beam with a 970 nm wide and 75 nm thick cross-section. We vary the pitch of these holes from 200 nm to 1100 nm to modulate the contribution of bridges to the net transport of heat in the axial direction. The effective thermal conductivity, corresponding to reduced heat flux, decreases from 45 W m-1 K-1 to 31 W m-1 K-1 with decreasing pitch. By solving the Boltzmann transport equation using phonon mean free paths taken from ab initio calculations, we model thermal transport in the nanoladders, and experimental results show excellent agreement with the predictions to within 11%. A combination of experiments and calculations shows that with decreasing pitch, thermal transport in nanoladders approaches the counterpart in a straight beam equivalent to the line-of-sight channels, indicating that the bridges constitute a thermally dead volume. This study suggests that ballistic effects are dictated by the line-of-sight channels, providing key insights into thermal conduction in nanostructured metamaterials.

  View details for PubMedID 29873370

• Experimental Characterization of Microfabricated Thermoelectric Energy Harvesters for Smart Sensor and Wearable Applications ADVANCED MATERIALS TECHNOLOGIES Dunham, M. T., Barako, M. T., Cornett, J. E., Gao, Y., Haidar, S., Sun, N., Asheghi, M., Chen, B., Goodson, K. E. 2018; 3 (6)

  View details for DOI 10.1002/admt.201700383

  View details for Web of Science ID 000434947600004

• Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries NANO LETTERS Sood, A., Cheaito, R., Bai, T., Kwon, H., Wang, Y., Li, C., Yates, L., Bougher, T., Graham, S., Asheghi, M., Goorsky, M., Goodson, K. E. 2018; 18 (6): 3466–72

  View details for DOI 10.1021/acs.nanolett.8b00534

  View details for Web of Science ID 000435524300022

• Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop JOURNAL OF ELECTRONIC PACKAGING Kharangate, C. R., Jung, K., Jung, S., Kong, D., Schaadt, J., Iyengar, M., Malone, C., Lee, H., Asheghi, M., Goodson, K. E. 2018; 140 (2)

  View details for DOI 10.1115/1.4039475

  View details for Web of Science ID 000432367100009

• Enhanced Heat Transfer Using Microporous Copper Inverse Opals Lee, H., Maitra, T., Palko, J., Kong, D., Zhang, C., Barako, M. T., Won, Y., Asheghi, M., Goodson, K. E. ASME. 2018

  View details for DOI 10.1115/1.4040088

  View details for Web of Science ID 000432367100007

• A method for quantifying in plane permeability of porous thin films. Journal of colloid and interface science Rong, G., Palko, J. W., Oyarzun, D. I., Zhang, C., Hammerle, J., Asheghi, M., Goodson, K. E., Santiago, J. G. 2018; 530: 667–74

  Abstract

  The in-plane permeability of porous thin films is an important fluid mechanical property that determines wicking and pressure-driven flow behavior in such materials. This property has so far been challenging to measure directly due to the small sidewall cross-sectional area of thin films available for flow. In this work, we propose and experimentally demonstrate a novel technique for directly measuring in-plane permeability of porous thin films of arbitrary thicknesses, in situ, using a manifold pressed to the top surface of the film. We both measure and simulate the influence of the two dimensional flow field produced in a film by the manifold and extract the permeability from measurements of pressure drop at fixed flow rates. Permeability values measured using the technique for a periodic array of channels are comparable to theoretical predictions. We also determine in-plane permeability of arrays of pillars and electrodeposited porous copper films. This technique is a robust tool to characterize permeability of thin films of arbitrary thicknesses on a variety of substrates. In Supplementary material, we provide a solid model, which is useful in three-dimensional printer reproductions of our device.

  View details for PubMedID 30007196

• Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano letters Sood, A., Cheaito, R., Bai, T., Kwon, H., Wang, Y., Li, C., Yates, L., Bougher, T., Graham, S., Asheghi, M., Goorsky, M., Goodson, K. E. 2018

  Abstract

  Understanding the impact of lattice imperfections on nanoscale thermal transport is crucial for diverse applications ranging from thermal management to energy conversion. Grain boundaries (GBs) are ubiquitous defects in polycrystalline materials, which scatter phonons and reduce thermal conductivity (kappa). Historically, their impact on heat conduction has been studied indirectly through spatially averaged measurements, that provide little information about phonon transport near a single GB. Here, using spatially resolved time-domain thermoreflectance (TDTR) measurements in combination with electron backscatter diffraction (EBSD), we make localized measurements of kappa within few mum of individual GBs in boron-doped polycrystalline diamond. We observe strongly suppressed thermal transport near GBs, a reduction in kappa from 1000 W m-1 K-1 at the center of large grains to 400 W m-1 K-1 in the immediate vicinity of GBs. Furthermore, we show that this reduction in kappa is measured up to 10 mum away from a GB. A theoretical model is proposed that captures the local reduction in phonon mean-free-paths due to strongly diffuse phonon scattering at the disordered grain boundaries. Our results provide a new framework for understanding phonon-defect interactions in nanomaterials, with implications for the use of high-kappa polycrystalline materials as heat sinks in electronics thermal management.

  View details for PubMedID 29631399

• Porous micropillar structures for retaining low surface tension liquids JOURNAL OF COLLOID AND INTERFACE SCIENCE Agonafer, D. D., Lee, H., Vasquez, P. A., Won, Y., Jung, K., Lingamneni, S., Ma, B., Shan, L., Shuai, S., Du, Z., Maitra, T., Palko, J. W., Goodson, K. E. 2018; 514: 316–27

  Abstract

  The ability to manipulate fluid interfaces, e.g., to retain liquid behind or within porous structures, can be beneficial in multiple applications, including microfluidics, biochemical analysis, and the thermal management of electronic systems. While there are a variety of strategies for controlling the disposition of liquid water via capillarity, such as the use of chemically modified porous adhesive structures and capillary stop valves or surface geometric features, methods that work well for low surface tension liquids are far more difficult to implement. This study demonstrates the microfabrication of a silicon membrane that can retain exceptionally low surface tension fluorinated liquids against a significant pressure difference across the membrane via an array of porous micropillar structures. The membrane uses capillary forces along the triple phase contact line to maintain stable liquid menisci that yield positive working Laplace pressures. The micropillars have inner diameters and thicknesses of 1.5-3 μm and ∼1 μm, respectively, sustaining Laplace pressures up to 39 kPa for water and 9 kPa for Fluorinert™ (FC-40). A theoretical model for predicting the change in pressure as the liquid advances along the porous micropillar structure is derived based on a free energy analysis of the liquid meniscus with capped spherical geometry. The theoretical prediction was found to overestimate the burst pressure compared with the experimental measurements. To elucidate this deviation, transient numerical simulations based on the Volume of Fluid (VOF) were performed to explore the liquid pressure and evolution of meniscus shape under different flow rates (i.e., Capillary numbers). The results from VOF simulations reveal strong dynamic effects where the anisotropic expansion of liquid along the outer micropillar edge leads to an irregular meniscus shape before the liquid spills along the micropillar edge. These findings suggest that the analytical prediction of burst Laplace pressure obtained under quasi-static condition (i.e., equilibrium thermodynamic analysis under low capillary number) is not applicable to highly dynamic flow conditions, where the liquid meniscus shape deformation by flow perturbation cannot be restored by surface tension force instantaneously. Therefore, the critical burst pressure is dependent on the liquid velocity and viscosity under dynamic flow conditions. A numerical simulation using Surface Evolver also predicts that surface defects along the outer micropillar edge can yield up to 50% lower Laplace pressures than those predicted with ideal feature geometries. The liquid retention strategy developed here can facilitate the routing and phase management of dielectric working fluids for application in heat exchangers. Further improvements in the retention performance can be realized by optimizing the fabrication process to reduce surface defects.

  View details for PubMedID 29275250

• Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide THIN SOLID FILMS Barako, M. T., English, T. S., Roy-Panzer, S., Kenny, T. W., Goodson, K. E. 2018; 649: 24–29

  View details for DOI 10.1016/j.tsf.2018.01.019

  View details for Web of Science ID 000427524100005

• Anti-Hermitian photodetector facilitating efficient subwavelength photon sorting NATURE COMMUNICATIONS Kim, S., Kang, J., Mutlu, M., Park, J., Park, W., Goodson, K. E., Sinclair, R., Fan, S., Kik, P. G., Brongersma, M. L. 2018; 9: 316

  Abstract

  The ability to split an incident light beam into separate wavelength bands is central to a diverse set of optical applications, including imaging, biosensing, communication, photocatalysis, and photovoltaics. Entirely new opportunities are currently emerging with the recently demonstrated possibility to spectrally split light at a subwavelength scale with optical antennas. Unfortunately, such small structures offer limited spectral control and are hard to exploit in optoelectronic devices. Here, we overcome both challenges and demonstrate how within a single-layer metafilm one can laterally sort photons of different wavelengths below the free-space diffraction limit and extract a useful photocurrent. This chipscale demonstration of anti-Hermitian coupling between resonant photodetector elements also facilitates near-unity photon-sorting efficiencies, near-unity absorption, and a narrow spectral response (∼ 30 nm) for the different wavelength channels. This work opens up entirely new design paradigms for image sensors and energy harvesting systems in which the active elements both sort and detect photons.

  View details for PubMedID 29358626

• HIGH STABILITY THERMAL ACCELEROMETER BASED ON ULTRATHIN PLATINUM ALD NANOSTRUCTURES Everhart, C. M., Kaplan, K. E., Winterkorn, M. M., Kwon, H., Provine, J., Asheghi, M., Goodson, K. E., Prinz, F. B., Kenny, T. W., IEEE IEEE. 2018: 976–79

  View details for Web of Science ID 000434960900256

• Busbar Design for Distributed DC-Link Capacitor Banks for Traction Applications Alizadeh, R., Schupbach, M., Adamson, T., Balda, J., Zhao, Y., Long, S., Jung, K. W., Kharangate, C., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 4810–15

  View details for Web of Science ID 000455187605032

• Highly Anisotropic Thermal Conductivity in Spin-Cast Polystyrene Nano-Films Katz, J. S., Barako, M. T., Park, W., Sood, A., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 477–81

  View details for Web of Science ID 000467263000067

• The Heat Conduction Renaissance Sood, A., Pop, E., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 1396–1402

  View details for Web of Science ID 000467263000180

• Thermal Management Research - from Power Electronics to Portables Jung, K., Zhang, C., Liu, T., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 17–18

  View details for Web of Science ID 000465075200004

• Modular Heat Sink for Chip-Scale GaN Transistors in Multilevel Converters Pallo, N., Kharangate, C., Modeer, T., Schaadt, J., Asheghi, M., Goodson, K., Pilawa-Podgurski, R., IEEE IEEE. 2018: 2798–2805

  View details for Web of Science ID 000434981902147

• THERMAL EFFECTS OF OVENIZED CLOCKS ON EPISEAL ENCAPSULATED INERTIAL MEASUREMENT UNITS Ortiz, L., Flader, I. B., Vukasin, G. D., Gerrard, D. D., Chandorkar, S. A., Rodriguez, J., Shin, D. D., Kwon, R., Heinz, D. B., Chen, Y., Park, W., Goodson, K. E., Kenny, T. W., IEEE IEEE. 2018: 980–83

  View details for Web of Science ID 000434960900257

• Temperature-Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry ACS APPLIED MATERIALS & INTERFACES Yalon, E., Aslan, O., Smithe, K. H., McClellan, C. J., Suryavanshi, S. V., Xiong, F., Sood, A., Neumann, C. M., Xu, X., Goodson, K. E., Heinz, T. F., Pop, E. 2017; 9 (49): 43013–20

  View details for DOI 10.1021/acsami.7b11641

  View details for Web of Science ID 000418204300066

• Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials ACS APPLIED MATERIALS & INTERFACES Barako, M. T., Isaacson, S. G., Lian, F., Pop, E., Dauskardt, R. H., Goodson, K. E., Tice, J. 2017; 9 (48): 42067–74

  View details for DOI 10.1021/acsami.7b12313

  View details for Web of Science ID 000417669300047

• Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials. ACS applied materials & interfaces Barako, M. T., Isaacson, S. G., Lian, F., Pop, E., Dauskardt, R. H., Goodson, K. E., Tice, J. 2017; 9 (48): 42067-42074

  Abstract

  Thermal interface materials (TIMs) are essential for managing heat in modern electronics, and nanocomposite TIMs can offer critical improvements. Here, we demonstrate thermally conductive, mechanically compliant TIMs based on dense, vertically aligned copper nanowires (CuNWs) embedded into polymer matrices. We evaluate the thermal and mechanical characteristics of 20-25% dense CuNW arrays with and without polydimethylsiloxane infiltration. The thermal resistance achieved is below 5 mm2 K W-1, over an order of magnitude lower than commercial heat sink compounds. Nanoindentation reveals that the nonlinear deformation mechanics of this TIM are influenced by both the CuNW morphology and the polymer matrix. We also implement a flip-chip bonding protocol to directly attach CuNW composites to copper surfaces, as required in many thermal architectures. Thus, we demonstrate a rational design strategy for nanocomposite TIMs that simultaneously retain the high thermal conductivity of aligned CuNWs and the mechanical compliance of a polymer.

  View details for DOI 10.1021/acsami.7b12313

  View details for PubMedID 29119783

• Thermal Conduction across Metal-Dielectric Sidewall Interfaces ACS APPLIED MATERIALS & INTERFACES Park, W., Kodama, T., Park, J., Cho, J., Sood, A., Barako, M. T., Asheghi, M., Goodson, K. E. 2017; 9 (35): 30100–30106

  Abstract

  The heat flow at the interfaces of complex nanostructures is three-dimensional in part due to the nonplanarity of interfaces. One example common in nanosystems is the situation when a significant fraction of the interfacial area is composed of sidewalls that are perpendicular to the principal plane, for example, in metallization structures for complementary metal-oxide semiconductor transistors. It is often observed that such sidewall interfaces contain significantly higher levels of microstructural disorder, which impedes energy carrier transport and leads to effective increases in interfacial resistance. The impact of these sidewall interfaces needs to be explored in greater depth for practical device engineering, and a related problem is that appropriate characterization techniques are not available. Here, we develop a novel electrothermal method and an intricate microfabricated structure to extract the thermal resistance of a sidewall interface between aluminum and silicon dioxide using suspended nanograting structures. The thermal resistance of the sidewall interface is measured to be ∼16 ± 5 m2 K GW-1, which is twice as large as the equivalent horizontal planar interface comprising the same materials in the experimental sample. The rough sidewall interfaces are observed using transmission electron micrographs, which may be more extensive than at interfaces in the substrate plan in the same nanostructure. A model based on a two-dimensional sinusoidal surface estimates the impact of the roughness on thermal resistance to be ∼2 m2 K GW-1. The large disparity between the model predictions and the experiments is attributed to the incomplete contact at the Al-SiO2 sidewall interfaces, inferred by observation of underetching of the silicon substrate below the sidewall opening. This study suggests that sidewall interfaces must be considered separately from planar interfaces in thermal analysis for nanostructured systems.

  View details for DOI 10.1021/acsami.7b06567

  View details for Web of Science ID 000410597500076

  View details for PubMedID 28786284

• Phonon conduction in silicon nanobeams APPLIED PHYSICS LETTERS Park, W., Shin, D. D., Kim, S., Katz, J. S., Park, J., Ahn, C., Kodama, T., Asheghi, M., Kenny, T. W., Goodson, K. E. 2017; 110 (21)

  View details for DOI 10.1063/1.4983790

  View details for Web of Science ID 000402320000033

• Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices JOURNAL OF ELECTRONIC MATERIALS Cornett, J., Chen, B., Haidar, S., Berney, H., McGuinness, P., Lane, B., Gao, Y., He, Y., Sun, N., Dunham, M., Asheghi, M., Goodson, K., Yuan, Y., Najafi, K. 2017; 46 (5): 2844-2846

  View details for DOI 10.1007/s11664-016-4992-5

  View details for Web of Science ID 000398937900041

• Phonon conduction in GaN-diamond composite substrates JOURNAL OF APPLIED PHYSICS Cho, J., Francis, D., Altman, D. H., Asheghi, M., Goodson, K. E. 2017; 121 (5)

  View details for DOI 10.1063/1.4975468

  View details for Web of Science ID 000394345700039

• COPPER INVERSE OPAL SURFACES FOR ENHANCED BOILING HEAT TRANSFER Lee, H., Maitra, T., Palko, J., Zhang, C., Barako, M., Won, Y., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2017

  View details for Web of Science ID 000418396400006

• Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific reports Park, W. n., Romano, G. n., Ahn, E. C., Kodama, T. n., Park, J. n., Barako, M. T., Sohn, J. n., Kim, S. J., Cho, J. n., Marconnet, A. M., Asheghi, M. n., Kolpak, A. M., Goodson, K. E. 2017; 7 (1): 6233

  Abstract

  Here we study single-crystalline silicon nanobeams having 470 nm width and 80 nm thickness cross section, where we produce tortuous thermal paths (i.e. labyrinths) by introducing slits to control the impact of the unobstructed "line-of-sight" (LOS) between the heat source and heat sink. The labyrinths range from straight nanobeams with a complete LOS along the entire length to nanobeams in which the LOS ranges from partially to entirely blocked by introducing slits, s = 95, 195, 245, 295 and 395 nm. The measured thermal conductivity of the samples decreases monotonically from ~47 W m-1 K-1 for straight beam to ~31 W m-1 K-1 for slit width of 395 nm. A model prediction through a combination of the Boltzmann transport equation and ab initio calculations shows an excellent agreement with the experimental data to within ~8%. The model prediction for the most tortuous path (s = 395 nm) is reduced by ~14% compared to a straight beam of equivalent cross section. This study suggests that LOS is an important metric for characterizing and interpreting phonon propagation in nanostructures.

  View details for PubMedID 28740212

• Enhanced Thermal Conduction Through Nanostructured Interfaces NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Park, W., Sood, A., Park, J., Asheghi, M., Sinclair, R., Goodson, K. E. 2017; 21 (3): 134–44

  View details for DOI 10.1080/15567265.2017.1296910

  View details for Web of Science ID 000406716900002

• MICRO-TETHERING FOR IN-PROCESS STICTION MITIGATION OF HIGHLY COMPLIANT STRUCTURES Flader, I. B., Chen, Y., Shin, D. D., Heinz, D. B., Ortiz, L., Alter, A. L., Park, W., Goodson, K. E., Kenny, T. W., IEEE IEEE. 2017: 675–78

  View details for Web of Science ID 000402552000175

• Thermal Conductivity Measurements on Suspended Diamond Membranes Using Picosecond and Femtosecond Time-Domain Thermoreflectance Cheaito, R., Sood, A., Yates, L., Bougher, T. L., Cheng, Z., Asheghi, M., Graham, S., Goodson, K., IEEE IEEE. 2017: 706–10

  View details for Web of Science ID 000426688100107

• INVESTIGATION OF THE HETEROGENEOUS THERMAL CONDUCTIVITY IN BULK CVD DIAMOND FOR USE IN ELECTRONICS THERMAL MANAGEMENT Yates, L., Cheaito, R., Sood, A., Cheng, Z., Bougher, T., Asheghi, M., Goodson, K., Goorsky, M., Faili, F., Twitchen, D., Graham, S., ASME AMER SOC MECHANICAL ENGINEERS. 2017

  View details for Web of Science ID 000418396400076

• Experimental Considerations of CVD Diamond Film Measurements using Time Domain Thermoreflectance Bougher, T. L., Yates, L., Cheng, Z., Cola, B. A., Graham, S., Chaeito, R., Sood, A., Ashegi, M., Goodson, K. E., IEEE IEEE. 2017: 30–38

  View details for Web of Science ID 000426688100006

• THERMAL CONDUCTIVITY MEASUREMENT OF IN(0.10)GA(0.90)AS(0.96)N(0.04) THIN FILM Jan, A., Cheaito, R., Goodson, K. E., Clemens, B. M., ASME AMER SOC MECHANICAL ENGINEERS. 2017

  View details for DOI 10.1115/HT2017-5089

  View details for Web of Science ID 000422809800067

• Thermal Modeling of Single-phase and Two-phase 2D-chip Cooling using Microchannels Kharangate, C. R., Lee, H., Liu, T., Jung, K., Iyengar, M. K., Malone, C., Asheghi, M., Goodson, K. E., IEEE IEEE. 2017: 300–306

  View details for Web of Science ID 000426688100038

• Microchannel Cooling Strategies for High Heat Flux (1 kW/cm(2)) Power Electronic Applications Jung, K., Kharangate, C. R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E., IEEE IEEE. 2017: 98–104

  View details for Web of Science ID 000426688100010

• Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films APPLIED PHYSICS LETTERS Dunham, M. T., Lorenzi, B., Andrews, S. C., Sood, A., Asheghi, M., Narducci, D., Goodson, K. E. 2016; 109 (25)

  View details for DOI 10.1063/1.4972483

  View details for Web of Science ID 000391857200028

• Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction JOURNAL OF APPLIED PHYSICS Fong, S. W., Sood, A., Chen, L., Kumari, N., Asheghi, M., Goodson, K. E., Gibson, G. A., Wong, H. P. 2016; 120 (1)

  View details for DOI 10.1063/1.4955165

  View details for Web of Science ID 000379583900022

• Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond JOURNAL OF APPLIED PHYSICS Sood, A., Cho, J., Hobart, K. D., Feygelson, T. I., Pate, B. B., Asheghi, M., Cahill, D. G., Goodson, K. E. 2016; 119 (17)

  View details for DOI 10.1063/1.4948335

  View details for Web of Science ID 000377716500028

• Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance (vol 102, 111907, 2013) APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T. I., Pate, B. B., Hobart, K. D., Goodson, K. E. 2016; 108 (17)

  View details for DOI 10.1063/1.4948382

  View details for Web of Science ID 000375846600056

• Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano letters Barako, M. T., Sood, A., Zhang, C., Wang, J., Kodama, T., Asheghi, M., Zheng, X., Braun, P. V., Goodson, K. E. 2016; 16 (4): 2754-2761

  Abstract

  Porous metals are used in interfacial transport applications that leverage the combination of electrical and/or thermal conductivity and the large available surface area. As nanomaterials push toward smaller pore sizes to increase the total surface area and reduce diffusion length scales, electron conduction within the metal scaffold becomes suppressed due to increased surface scattering. Here we observe the transition from diffusive to quasi-ballistic thermal conduction using metal inverse opals (IOs), which are metal films that contain a periodic arrangement of interconnected spherical pores. As the material dimensions are reduced from ∼230 nm to ∼23 nm, the thermal conductivity of copper IOs is reduced by more than 57% due to the increase in surface scattering. In contrast, nickel IOs exhibit diffusive-like conduction and have a constant thermal conductivity over this size regime. The quasi-ballistic nature of electron transport at these length scales is modeled considering the inverse opal geometry, surface scattering, and grain boundaries. Understanding the characteristics of electron conduction at the nanoscale is essential to minimizing the total resistance of porous metals for interfacial transport applications, such as the total electrical resistance of battery electrodes and the total thermal resistance of microscale heat exchangers.

  View details for DOI 10.1021/acs.nanolett.6b00468

  View details for PubMedID 26986050

• Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices JOURNAL OF ELECTRONIC PACKAGING Lee, H., Agonafer, D. D., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K. E. 2016; 138 (1)

  View details for DOI 10.1115/1.4032655

  View details for Web of Science ID 000372735400008

• A Figure of Merit for Mobile Device Thermal Management Chiriac, V., Molloy, S., Anderson, J., Goodson, K., IEEE IEEE. 2016: 1393–97

  View details for Web of Science ID 000390436000192

• Characterization of the Capillary Performance of Copper Inverse Opals Zhang, C., Lingamneni, S., Barako, M. T., Palko, J. W., Asheghi, M., Goodson, K. E., IEEE IEEE. 2016: 1035–39

  View details for Web of Science ID 000390436000142

• Analytical Model of Graphene-Enabled Ultra-Low Power Phase Change Memory Alpert, A., Luo, R., Asheghi, M., Pop, E., Goodson, K., IEEE IEEE. 2016: 670–74

  View details for Web of Science ID 000390436000094

• Analytical Modeling for Prediction of Chip Package-level Thermal Performance Liu, T., Iyengar, M., Malone, C., Goodson, K. E., IEEE IEEE. 2016: 254–61

  View details for Web of Science ID 000390436000039

• Optimization of ybrid Wick Structures for Extreme Spreading in High Performance Vapor Chambers Liu, T., Lingamneni, S., Palko, J., Asheghi, M., Goodson, K. E., IEEE IEEE. 2016: 30–36

  View details for Web of Science ID 000390436000005

• Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices Yates, L., Sood, A., Cheng, Z., Bougher, T., Malcom, K., Cho, J., Asheghi, M., Goodson, K., Goorsky, M., Faili, F., Twitchen, D. J., Graham, S., IEEE IEEE. 2016: 106–9

  View details for Web of Science ID 000391432400025

• High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply Palko, J. W., Lee, H., Agonafer, D. D., Zhang, C., Jung, K., Moss, J., Wilbur, J. D., Dusseault, T. J., Barako, M. T., Houshmand, F., Rong, G., Maitra, T., Gorle, C., Won, Y., Rockosi, D., Mykyta, I., Resler, D., Altman, D., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2016: 1511–17

  View details for Web of Science ID 000390436000208

• Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat APPLIED PHYSICS LETTERS Palko, J. W., Zhang, C., Wilbur, J. D., Dusseault, T. J., Asheghi, M., Goodson, K. E., Santiago, J. G. 2015; 107 (25)

  View details for DOI 10.1063/1.4938202

  View details for Web of Science ID 000368442100048

• Power density optimization for micro thermoelectric generators ENERGY Dunham, M. T., Barako, M. T., LeBlanc, S., Asheghi, M., Chen, B., Goodson, K. E. 2015; 93: 2006-2017

  View details for DOI 10.1016/j.energy.2015.10.032

  View details for Web of Science ID 000367409500072

• Energy-Efficient Abundant-Data Computing: The N3XT 1,000x COMPUTER Aly, M. M., Gao, M., Hills, G., Lee, C., Pitner, G., Shulaker, M. M., Wu, T. F., Asheghi, M., Bokor, J., Franchetti, F., Goodson, K. E., Kozyrakis, C., Markov, I., Olukotun, K., Pileggi, L., Pop, E., Rabaey, J., Re, C., Wong, H. P., Mitra, S. 2015; 48 (12): 24-33

  View details for Web of Science ID 000367689400005

• Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films JOURNAL OF MICROMECHANICS AND MICROENGINEERING Won, Y., Gao, Y., Guzman de Villoria, R., Wardle, B. L., Xiang, R., Maruyama, S., Kenny, T. W., Goodson, K. E. 2015; 25 (11)

  View details for DOI 10.1088/0960-1317/25/11/115023

  View details for Web of Science ID 000366862100026

• Burst behavior at a capillary tip: Effect of low and high surface tension JOURNAL OF COLLOID AND INTERFACE SCIENCE Agonafer, D. D., Lopez, K., Palko, J. W., Won, Y., Santiago, J. G., Goodson, K. E. 2015; 455: 1-5

  Abstract

  Liquid retention in micron and millimeter scale devices is important for maintaining stable interfaces in various processes including bimolecular separation, phase change heat transfer, and water desalination. There have been several studies of re-entrant geometries, and very few studies on retaining low surface tension liquids such as fluorocarbon-based dielectric liquids. Here, we study retention of a liquid with very low contact angles using borosilicate glass capillary tips. We analyzed capillary tips with outer diameters ranging from 250 to 840μm and measured Laplace pressures up to 2.9kPa. Experimental results agree well with a numerical model that predicts burst pressure (the maximum Laplace pressure for liquid retention), which is a function of the outer diameter (D) and capillary exit edge radius of curvature (r).

  View details for DOI 10.1016/j.jcis.2015.05.033

  View details for Web of Science ID 000357544700001

  View details for PubMedID 26046980

• Professor Issam Mudawar on his 60th birthday INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Bernardin, J., Chiaramonte, F., Dhir, V., Galloway, J., Goodson, K., Incropera, F., Kabov, O., Kaviany, M., Kazimi, M., Khusid, B., Kim, J., Kim, S., Lee, J., Minkowycz, W. J., Qu, W., Rose, J., Sammakia, B., Stephan, P., Vafai, K., Wen, C. 2015; 89: A1–A3

  View details for DOI 10.1016/j.ijheatmasstransfer.2015.05.059

  View details for Web of Science ID 000359029600001

• Energy-Efficient Phase-Change Memory with Graphene as a Thermal Barrier NANO LETTERS Ahn, C., Fong, S. W., Kim, Y., Lee, S., Sood, A., Neumann, C. M., Ashegh, M., Goodson, K. E., Pop, E., Wong, H. P. 2015; 15 (10): 6809-6814

  View details for DOI 10.1021/acs.nanolett.5b02661

  View details for Web of Science ID 000363003100079

• Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. ACS applied materials & interfaces Barako, M. T., Roy-Panzer, S., English, T. S., Kodama, T., Asheghi, M., Kenny, T. W., Goodson, K. E. 2015; 7 (34): 19251-19259

  Abstract

  The ability to efficiently and reliably transfer heat between sources and sinks is often a bottleneck in the thermal management of modern energy conversion technologies ranging from microelectronics to thermoelectric power generation. These interfaces contribute parasitic thermal resistances that reduce device performance and are subjected to thermomechanical stresses that degrade device lifetime. Dense arrays of vertically aligned metal nanowires (NWs) offer the unique combination of thermal conductance from the constituent metal and mechanical compliance from the high aspect ratio geometry to increase interfacial heat transfer and device reliability. In the present work, we synthesize copper NW arrays directly onto substrates via templated electrodeposition and extend this technique through the use of a sacrificial overplating layer to achieve improved uniformity. Furthermore, we infiltrate the array with an organic phase change material and demonstrate the preservation of thermal properties. We use the 3ω method to measure the axial thermal conductivity of freestanding copper NW arrays to be as high as 70 W m(-1) K(-1), which is more than an order of magnitude larger than most commercial interface materials and enhanced-conductivity nanocomposites reported in the literature. These arrays are highly anisotropic, and the lateral thermal conductivity is found to be only 1-2 W m(-1) K(-1). We use these measured properties to elucidate the governing array-scale transport mechanisms, which include the effects of morphology and energy carrier scattering from size effects and grain boundaries.

  View details for DOI 10.1021/acsami.5b05147

  View details for PubMedID 26284489

• Cross-Plane Phonon Conduction in Polycrystalline Silicon Films JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cho, J., Francis, D., Chao, P. C., Asheghi, M., Goodson, K. E. 2015; 137 (7)

  View details for DOI 10.1115/1.4029820

  View details for Web of Science ID 000357585200003

• Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K. E. 2015; 5 (6): 737-744

  View details for DOI 10.1109/TCPMT.2015.2433132

  View details for Web of Science ID 000356699700004

• Evaluating Broader Impacts of Nanoscale Thermal Transport Research NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Shi, L., Dames, C., Lukes, J. R., Reddy, P., Duda, J., Cahill, D. G., Lee, J., Marconnet, A., Goodson, K. E., Bahk, J., Shakouri, A., Prasher, R. S., Felts, J., King, W. P., Han, B., Bischof, J. C. 2015; 19 (2): 127-165

  View details for DOI 10.1080/15567265.2015.1031857

  View details for Web of Science ID 000355741500003

• Thermal characterization and analysis of microliter liquid volumes using the three-omega method. Review of scientific instruments Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E. 2015; 86 (2): 024901-?

  Abstract

  Thermal phenomena in many biological systems offer an alternative detection opportunity for quantifying relevant sample properties. While there is substantial prior work on thermal characterization methods for fluids, the push in the biology and biomedical research communities towards analysis of reduced sample volumes drives a need to extend and scale these techniques to these volumes of interest, which can be below 100 pl. This work applies the 3ω technique to measure the temperature-dependent thermal conductivity and heat capacity of de-ionized water, silicone oil, and salt buffer solution droplets from 24 to 80 °C. Heater geometries range in length from 200 to 700 μm and in width from 2 to 5 μm to accommodate the size restrictions imposed by small volume droplets. We use these devices to measure droplet volumes of 2 μl and demonstrate the potential to extend this technique down to pl droplet volumes based on an analysis of the thermally probed volume. Sensitivity and uncertainty analyses provide guidance for relevant design variables for characterizing properties of interest by investigating the tradeoffs between measurement frequency regime, device geometry, and substrate material. Experimental results show that we can extract thermal conductivity and heat capacity with these sample volumes to within less than 1% of thermal properties reported in the literature.

  View details for DOI 10.1063/1.4907353

  View details for PubMedID 25725871

• Thermal characterization and analysis of microliter liquid volumes using the three-omega method. Review of scientific instruments Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E. 2015; 86 (2): 024901-?

  Abstract

  Thermal phenomena in many biological systems offer an alternative detection opportunity for quantifying relevant sample properties. While there is substantial prior work on thermal characterization methods for fluids, the push in the biology and biomedical research communities towards analysis of reduced sample volumes drives a need to extend and scale these techniques to these volumes of interest, which can be below 100 pl. This work applies the 3ω technique to measure the temperature-dependent thermal conductivity and heat capacity of de-ionized water, silicone oil, and salt buffer solution droplets from 24 to 80 °C. Heater geometries range in length from 200 to 700 μm and in width from 2 to 5 μm to accommodate the size restrictions imposed by small volume droplets. We use these devices to measure droplet volumes of 2 μl and demonstrate the potential to extend this technique down to pl droplet volumes based on an analysis of the thermally probed volume. Sensitivity and uncertainty analyses provide guidance for relevant design variables for characterizing properties of interest by investigating the tradeoffs between measurement frequency regime, device geometry, and substrate material. Experimental results show that we can extract thermal conductivity and heat capacity with these sample volumes to within less than 1% of thermal properties reported in the literature.

  View details for DOI 10.1063/1.4907353

  View details for PubMedID 25725871

• NUMERICAL OPTIMIZATION OF ADVANCED MONOLITHIC MICROCOOLERS FOR HIGH HEAT FLUX MICROELECTRONICS Scholl, S., Gorlet, C., Houshmand, F., Asheghi, M., Goodson, K., Verstraete, T., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517400066

• Chip-Scale Thermal Energy Harvester Using Bi2Te3 Cornett, J., Lane, B., Dunham, M., Asheghi, M., Goodson, K., Gao, Y., Sun, N., Chen, B., IEEE IEEE. 2015: 3326–29

  View details for Web of Science ID 000382950703062

• Tailoring of permeability in copper inverse opal for electronic cooling applications Zhang, C., Rong, G., Palko, J. W., Dusseault, T. J., Asheghi, M., Santiago, J. G., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517300069

• FULL SCALE SIMULATION OF AN INTEGRATED MONOLITHIC HEAT SINK FOR THERMAL MANAGEMENT OF A HIGH POWER DENSITY GAN-SIC CHIP Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Asheghi, M., Goodson, K., Kazemi, H., Vanhille, K., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517200057

• NUMERICAL SIMULATION OF ADVANCED MONOLITHIC MICROCOOLER DESIGNS FOR HIGH HEAT FLUX MICROELECTRONICS Scholl, S., Gorle, C., Houshmand, F., Liu, T., Lee, H., Won, Y., Asheghi, M., Goodson, K., Kazemi, H., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517300074

• COMPUTATIONAL MODELING OF EXTREME HEAT FLUX MICROCOOLER FOR GaN-BASED HEMT Lee, H., Won, Y., Houshmand, F., Gorlel, C., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517300083

• INDUCTIVE COUPLED PLASMA ETCHING OF HIGH ASPECT RATIO SILICON CARBIDE MICROCHANNELS FOR LOCALIZED COOLING Dowling, K. M., Suria, A. J., Won, Y., Shankar, A., Lee, H., Asheghi, M., Goodson, K. E., Senesky, D. G., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517400040

• HIGH HEAT FLUX SUBCOOLED FLOW BOILING OF METHANOL IN MICROTUBES Houshmand, F., Lee, H., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517400058

• VALIDATION STUDY FOR VOF SIMULATIONS OF BOILING IN A MICROCHANNEL Gorle, C., Lee, H., Houshmand, F., Asheghi, M., Goodson, K., Parida, P. R., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517400070

• ON-CHIP OVENIZATION OF ENCAPSULATED DISK RESONATOR GYROSCOPE (DRG) Ahn, C. H., Hong, V. A., Park, W., Yang, Y., Chen, Y., Ng, E. J., Huynh, J., Challoner, A. D., Goodson, K. E., Kenny, T. W., IEEE IEEE. 2015: 39–42

  View details for Web of Science ID 000380461400011

• THERMAL DESIGN OF A HIERARCHICAL RADIALLY EXPANDING CAVITY FOR TWO-PHASE COOLING OF INTEGRATED CIRCUITS Sridhar, A., Ong, C., Paredes, S., Michel, B., Brunschwiler, T., Parida, P., Colgan, E., Chainer, T., Gorle, C., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015

  View details for Web of Science ID 000373517200039

• Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Barako, M. T., Gao, Y., Won, Y., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2014; 4 (12): 1906-1913

  View details for DOI 10.1109/TCPMT.2014.2369371

  View details for Web of Science ID 000348122800001

• Reply to the 'comment on "$ per W metrics for thermoelectric power generation: beyond ZT"' by G. Nunes, Jr, Energy Environ. Sci., 2014, 7, DOI: 10.1039/C3EE43700K ENERGY & ENVIRONMENTAL SCIENCE Yee, S. K., LeBlanc, S., Goodson, K. E., Dames, C. 2014; 7 (10): 3441–42

  View details for DOI 10.1039/c4ee01119h

  View details for Web of Science ID 000342884300029

• Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs APPLIED PHYSICS LETTERS Sood, A., Rowlette, J. A., Caneau, C. G., Bozorg-Grayeli, E., Asheghi, M., Goodson, K. E. 2014; 105 (5)

  View details for DOI 10.1063/1.4892575

  View details for Web of Science ID 000341153000028

• Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano letters Jeyasingh, R., Fong, S. W., Lee, J., Li, Z., Chang, K., Mantegazza, D., Asheghi, M., Goodson, K. E., Wong, H. P. 2014; 14 (6): 3419-3426

  Abstract

  Phase change materials are widely considered for application in nonvolatile memories because of their ability to achieve phase transformation in the nanosecond time scale. However, the knowledge of fast crystallization dynamics in these materials is limited because of the lack of fast and accurate temperature control methods. In this work, we have developed an experimental methodology that enables ultrafast characterization of phase-change dynamics on a more technologically relevant melt-quenched amorphous phase using practical device structures. We have extracted the crystallization growth velocity (U) in a functional capped phase change memory (PCM) device over 8 orders of magnitude (10(-10) < U < 10(-1) m/s) spanning a wide temperature range (415 < T < 580 K). We also observed direct evidence of non-Arrhenius crystallization behavior in programmed PCM devices at very high heating rates (>10(8) K/s), which reveals the extreme fragility of Ge2Sb2Te5 in its supercooled liquid phase. Furthermore, these crystallization properties were studied as a function of device programming cycles, and the results show degradation in the cell retention properties due to elemental segregation. The above experiments are enabled by the use of an on-chip fast heater and thermometer called as microthermal stage (MTS) integrated with a vertical phase change memory (PCM) cell. The temperature at the PCM layer can be controlled up to 600 K using MTS and with a thermal time constant of 800 ns, leading to heating rates ∼10(8) K/s that are close to the typical device operating conditions during PCM programming. The MTS allows us to independently control the electrical and thermal aspects of phase transformation (inseparable in a conventional PCM cell) and extract the temperature dependence of key material properties in real PCM devices.

  View details for DOI 10.1021/nl500940z

  View details for PubMedID 24798660

• Analysis of Oxide (Al2O3, CuO, and ZnO) and CNT Nanoparticles Disaggregation Effect on the Thermal Conductivity and the Viscosity of Nanofluids INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING Lee, J., Yoon, Y., Eaton, J. K., Goodson, K. E., Bai, S. J. 2014; 15 (4): 703-710

  View details for DOI 10.1007/s12541-014-0390-1

  View details for Web of Science ID 000333866300015

• Material and manufacturing cost considerations for thermoelectrics RENEWABLE & SUSTAINABLE ENERGY REVIEWS LeBlanc, S., Yee, S. K., Scullin, M. L., Dames, C., Goodson, K. E. 2014; 32: 313-327

  View details for DOI 10.1016/j.rser.2013.12.030

  View details for Web of Science ID 000333728700027

• Nanoscale thermal transport. II. 2003-2012 APPLIED PHYSICS REVIEWS Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., Maris, H. J., Phillpot, S. R., Pop, E., Shi, L. 2014; 1 (1)

  View details for DOI 10.1063/1.4832615

  View details for Web of Science ID 000334098500010

• Nanoscale Thermal Transport Applied Physics Reviews Cahill, D., G., Braun, P., V., Chen, G., Clarke, D., R., Goodson, K., E., Keblinski, P. 2014; 1: 011305
• Cross Plane Thermal Conductance of Graphene-Metal Interfaces Guzman, P., Sood, A., Mleczko, M. J., Wang, B., Wong, H., Nishi, Y., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 1385–89

  View details for Web of Science ID 000366567000184

• Characterization of Phase-Change Layer Thermal Properties Using a Micro-Thermal Stage Fong, S. W., Jeyasingh, R., Asheghi, M., Goodson, K. E., Wong, H. P., IEEE IEEE. 2014: 744–49

  View details for Web of Science ID 000366567000098

• Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates Cho, J., Won, Y., Francis, D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014

  View details for Web of Science ID 000369763800061

• Analysis and Characterization of Thermal Transport in GaN HEMTs on Diamond Substrates Altman, D., Tyhach, M., McClymonds, J., Kim, S., Graham, S., Cho, J., Goodson, K., Francis, D., Faili, F., Ejeckam, F., Bernstein, S., IEEE IEEE. 2014: 1199–1205

  View details for Web of Science ID 000366567000159

• Inverse Opals for Fluid Delivery in Electronics Cooling Systems Dusseault, T. J., Gires, J., Barako, M. T., Won, Y., Agonafer, D. D., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2014: 750–55

  View details for Web of Science ID 000366567000099

• Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-glass Capillaries Agonafer, D. D., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2014: 306–16

  View details for Web of Science ID 000366567000041

• Progress on Phase Separation Microfluidics Agonafer, D. D., Palko, J., Won, Y., Lopez, K., Dusseault, T., Gires, J., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2014

  View details for Web of Science ID 000369763800053

• Anisotropic and Nonhomogeneous Thermal Conduction in 1 mu m Thick CVD Diamond Sood, A., Cho, J., Hobart, K. D., Feygelson, T., Pate, B., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 1192–98

  View details for Web of Science ID 000366567000158

• TOWARDS THERMAL CHARACTERIZATION OF PICO-LITER VOLUMES USING THE 3OMEGA METHOD Roy, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2014

  View details for Web of Science ID 000360032600063

• MODELING AND OPTIMIZATION OF SMALL THERMOELECTRIC GENERATORS FOR LOW-POWER ELECTRONICS Dunham, M. T., Barako, M. T., LeBlanc, S., Asheghi-Roudheni, M., Chen, B., Goodson, K., ASME AMER SOC MECHANICAL ENGINEERS. 2014

  View details for Web of Science ID 000361499600016

• Mechanical and Thermal Properties of Copper Inverse Opals for Two-Phase Convection Enhancement Won, Y., Barako, M. T., Agonafer, D. D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 326–32

  View details for Web of Science ID 000366567000043

• Phonon Thermal Conduction in Periodically Porous Silicon Nanobeams Park, W., Marconnet, A. M., Kodama, T., Park, J., Sinclair, R., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 637–40

  View details for Web of Science ID 000366567000084

• Thermal Conduction in Nanoporous Copper Inverse Opal Films Barako, M. T., Weisse, J. M., Roy, S., Kodama, T., Dusseault, T. J., Motoyama, M., Asheghi, M., Prinz, F. B., Zheng, X., Goodson, K. E., IEEE IEEE. 2014: 736–43

  View details for Web of Science ID 000366567000097

• A Parametric Study of Microporous Metal Matrix-Phase Change Material Composite Heat Spreaders for Transient Thermal Applications Lingamneni, S., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 870–75

  View details for Web of Science ID 000366567000115

• Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN Cho, J., Chu, K. K., Chao, P. C., McGray, C., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 1186–91

  View details for Web of Science ID 000366567000157

• Next Generation Gallium Nitride HEMTs Enabled by Diamond Substrates Tyhach, M., Altman, D., Bernstein, S., Korenstein, R., Francis, D., Faili, F., Ejeckam, F., Cho, J., Goodson, K. E., Kim, S., Graham, S., IEEE IEEE. 2014

  View details for Web of Science ID 000369852800003

• Microfluidic Heat Exchangers for High Power Density GaN on SiC Won, Y., Houshmand, F., Agonafer, D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014

  View details for Web of Science ID 000369763800046

• PHONON CONDUCTION NORMAL TO POLYSILICON FILMS ON DIAMOND 4th ASME International Conference on Micro/Nanoscale Heat and Mass Transfer Cho, J., Chao, P. C., Asheghi, M., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2014

  View details for Web of Science ID 000349928000027

• Phonon Scattering in Strained Transition Layers for GaN Heteroepitaxy Physical Review B Cho, j., Li, Y., Hoke, W., Altman, D., Asheghi, M., Goodson, K. E. 2014; 89: 11

  View details for DOI 10.1103/PhysRevB.89.115301

• Thermal Characterization of Nanostructured Superlattices of TiN/TaN: Applications as Electrodes in Phase Change Memory Sood, A., Eryilmaz, S., Jeyasingh, R., Cho, J., Asheghi, M., Wong, H., Goodson, K. E., IEEE IEEE. 2014: 765–70

  View details for Web of Science ID 000366567000101

• 3D Packaging Materials based on Graphite Nanoplatelet and Aluminum Nitride Nanocomposites Lingamneni, S., Marconnet, A. M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2014

  View details for Web of Science ID 000360260400021

• Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA Won, Y., Gao, Y., Panzer, M. A., Xiang, R., Maruyama, S., Kenny, T. W., Cai, W., Goodson, K. E. 2013; 110 (51): 20426-20430

  Abstract

  Reliably routing heat to and from conversion materials is a daunting challenge for a variety of innovative energy technologies--from thermal solar to automotive waste heat recovery systems--whose efficiencies degrade due to massive thermomechanical stresses at interfaces. This problem may soon be addressed by adhesives based on vertically aligned carbon nanotubes, which promise the revolutionary combination of high through-plane thermal conductivity and vanishing in-plane mechanical stiffness. Here, we report the data for the in-plane modulus of aligned single-walled carbon nanotube films using a microfabricated resonator method. Molecular simulations and electron microscopy identify the nanoscale mechanisms responsible for this property. The zipping and unzipping of adjacent nanotubes and the degree of alignment and entanglement are shown to govern the spatially varying local modulus, thereby providing the route to engineered materials with outstanding combinations of mechanical and thermal properties.

  View details for DOI 10.1073/pnas.1312253110

  View details for Web of Science ID 000328548600031

  View details for PubMedID 24309375

  View details for PubMedCentralID PMC3870663

• $ per W metrics for thermoelectric power generation: beyond ZT ENERGY & ENVIRONMENTAL SCIENCE Yee, S. K., LeBlanc, S., Goodson, K. E., Dames, C. 2013; 6 (9): 2561-2571

  View details for DOI 10.1039/c3ee41504j

  View details for Web of Science ID 000323198100001

• High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices JOURNAL OF ELECTRONIC PACKAGING Touzelbaev, M. N., Miler, J., Yang, Y., Refai-Ahmed, G., Goodson, K. E. 2013; 135 (3)

  View details for DOI 10.1115/1.4024747

  View details for Web of Science ID 000326095800010

• Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Gao, Y., Marconnet, A. M., Xiang, R., Maruyama, S., Goodson, K. E. 2013; 3 (9): 1524-1532

  View details for DOI 10.1109/TCPMT.2013.2254175

  View details for Web of Science ID 000324384600010

• Thermal conduction phenomena in carbon nanotubes and related nanostructured materials REVIEWS OF MODERN PHYSICS Marconnet, A. M., Panzer, M. A., Goodson, K. E. 2013; 85 (3): 1295-1326

  View details for DOI 10.1103/RevModPhys.85.1295

  View details for Web of Science ID 000323334100001

• From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 135 (6)

  View details for DOI 10.1115/1.4023577

  View details for Web of Science ID 000326165000012

• Phonon and electron transport through Ge2Sb2Te5 films and interfaces bounded by metals APPLIED PHYSICS LETTERS Lee, J., Bozorg-Grayeli, E., Kim, S., Asheghi, M., Wong, H. P., Goodson, K. E. 2013; 102 (19)

  View details for DOI 10.1063/1.4807141

  View details for Web of Science ID 000320440800035

• Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T. I., Pate, B. B., Hobart, K., Goodson, K. E. 2013; 102 (11)

  View details for DOI 10.1063/1.4796168

  View details for Web of Science ID 000316544900032

• Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module JOURNAL OF ELECTRONIC MATERIALS Barako, M. T., Park, W., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 42 (3): 372-381

  View details for DOI 10.1007/s11664-012-2366-1

  View details for Web of Science ID 000314529300004

• Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E. 2013; 3 (1): 79-85

  View details for DOI 10.1109/TCPMT.2012.2223818

  View details for Web of Science ID 000313687100010

• Cooling Limits for GaN HEMT Technology Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2013

  View details for DOI 10.1109/CSICS.2013.6659222

  View details for Web of Science ID 000369740100041

• A S/W Metric for Thermoelectric Power Generation: Beyond ZT Energy & Environmental Science Yee, S., Leblanc, S., Goodson, K., E., Dames, C. 2013; 6: 2561-2571
• Electrothermal Modeling and Design Strategies for Multibit Phase-Change Memory IEEE TRANSACTIONS ON ELECTRON DEVICES Li, Z., Jeyasingh, R. G., Lee, J., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 59 (12): 3561-3567

  View details for DOI 10.1109/TED.2012.2219311

  View details for Web of Science ID 000311680400060

• Phonon Conduction in Periodically Porous Silicon Nanobridges NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Marconnet, A. M., Kodama, T., Asheghi, M., Goodson, K. E. 2012; 16 (4): 199-219

  View details for DOI 10.1080/15567265.2012.732195

  View details for Web of Science ID 000311949300001

• Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics JOURNAL OF APPLIED PHYSICS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2012; 112 (8)

  View details for DOI 10.1063/1.4759450

  View details for Web of Science ID 000310597500020

• Thermal conductivity in porous silicon nanowire arrays NANOSCALE RESEARCH LETTERS Weisse, J. M., Marconnet, A. M., Kim, D. R., Rao, P. M., Panzer, M. A., Goodson, K. E., Zheng, X. 2012; 7

  Abstract

  The nanoscale features in silicon nanowires (SiNWs) can suppress phonon propagation and strongly reduce their thermal conductivities compared to the bulk value. This work measures the thermal conductivity along the axial direction of SiNW arrays with varying nanowire diameters, doping concentrations, surface roughness, and internal porosities using nanosecond transient thermoreflectance. For SiNWs with diameters larger than the phonon mean free path, porosity substantially reduces the thermal conductivity, yielding thermal conductivities as low as 1 W/m/K in highly porous SiNWs. However, when the SiNW diameter is below the phonon mean free path, both the internal porosity and the diameter significantly contribute to phonon scattering and lead to reduced thermal conductivity of the SiNWs.

  View details for DOI 10.1186/1556-276X-7-554

  View details for Web of Science ID 000311320400001

  View details for PubMedID 23039084

  View details for PubMedCentralID PMC3494563

• Nanoscale Manipulation, Heating, and Welding of Nanowires JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME LeBlanc, S., Swartzentruber, B., Martinez, J., Christoforo, G., Kodama, T., Goodson, K. E. 2012; 134 (8)

  View details for Web of Science ID 000306143200010

• Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films CARBON Gao, Y., Kodama, T., Won, Y., Dogbe, S., Pan, L., Goodson, K. E. 2012; 50 (10): 3789-3798

  View details for DOI 10.1016/j.carbon.2012.04.004

  View details for Web of Science ID 000305851700050

• Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness JOURNAL OF APPLIED PHYSICS Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E. 2012; 112 (1)

  View details for DOI 10.1063/1.4731252

  View details for Web of Science ID 000306513400151

• Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm NANO LETTERS Li, Z., Tan, S., Bozorg-Grayeli, E., Kodama, T., Asheghi, M., Delgado, G., Panzer, M., Pokrovsky, A., Wack, D., Goodson, K. E. 2012; 12 (6): 3121-3126

  Abstract

  Thermal conduction in periodic multilayer composites can be strongly influenced by nonequilibrium electron-phonon scattering for periods shorter than the relevant free paths. Here we argue that two additional mechanisms-quasiballistic phonon transport normal to the metal film and inelastic electron-interface scattering-can also impact conduction in metal/dielectric multilayers with a period below 10 nm. Measurements use the 3ω method with six different bridge widths down to 50 nm to extract the in- and cross-plane effective conductivities of Mo/Si (2.8 nm/4.1 nm) multilayers, yielding 15.4 and 1.2 W/mK, respectively. The cross-plane thermal resistance is lower than can be predicted considering volume and interface scattering but is consistent with a new model built around a film-normal length scale for phonon-electron energy conversion in the metal. We introduce a criterion for the transition from electron to phonon dominated heat conduction in metal films bounded by dielectrics.

  View details for DOI 10.1021/nl300996r

  View details for Web of Science ID 000305106400078

  View details for PubMedID 22563928

• Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling NANOTECHNOLOGY Lee, J., Asheghi, M., Goodson, K. E. 2012; 23 (20)

  Abstract

  The coupled transport of heat and electrical current, or thermoelectric phenomena, can strongly influence the temperature distribution and figures of merit for phase-change memory (PCM). This paper simulates PCM devices with careful attention to thermoelectric transport and the resulting impact on programming current during the reset operation. The electrothermal simulations consider Thomson heating within the phase-change material and Peltier heating at the electrode interface. Using representative values for the Thomson and Seebeck coefficients extracted from our past measurements of these properties, we predict a cell temperature increase of 44% and a decrease in the programming current of 16%. Scaling arguments indicate that the impact of thermoelectric phenomena becomes greater with smaller dimensions due to enhanced thermal confinement. This work estimates the scaling of this reduction in programming current as electrode contact areas are reduced down to 10 nm × 10 nm. Precise understanding of thermoelectric phenomena and their impact on device performance is a critical part of PCM design strategies.

  View details for DOI 10.1088/0957-4484/23/20/205201

  View details for PubMedID 22543873

• Electrothermal phenomena in zinc oxide nanowires and contacts APPLIED PHYSICS LETTERS LeBlanc, S., Phadke, S., Kodama, T., Salleo, A., Goodson, K. E. 2012; 100 (16)

  View details for DOI 10.1063/1.4703935

  View details for Web of Science ID 000303128500048

• Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness APPLIED PHYSICS LETTERS Won, Y., Lee, J., Asheghi, M., Kenny, T. W., Goodson, K. E. 2012; 100 (16)

  View details for DOI 10.1063/1.3699227

  View details for Web of Science ID 000303128500018

• Low Thermal Resistances at GaN-SiC Interfaces for HEMT Technology IEEE ELECTRON DEVICE LETTERS Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., Goodson, K. E. 2012; 33 (3): 378-380

  View details for DOI 10.1109/LED.2011.2181481

  View details for Web of Science ID 000300580000026

• Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory JAPANESE JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, F., Goodson, K. E., Wong, H. P. 2012; 51 (2)

  View details for DOI 10.1143/JJAP.51.02BD06

  View details for Web of Science ID 000303481400028

• Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Lee, J., Kim, S., Marconnet, A., in't Zandt, M. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 21 (1): 4-6

  View details for DOI 10.1109/JMEMS.2011.2175704

  View details for Web of Science ID 000300104600001

• Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators CARBON Won, Y., Gao, Y., Panzer, M. A., Dogbe, S., Pan, L., Kenny, T. W., Goodson, K. E. 2012; 50 (2): 347-355

  View details for DOI 10.1016/j.carbon.2011.08.009

  View details for Web of Science ID 000297397700001

• Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness NANO LETTERS Yoneoka, S., Lee, J., Liger, M., Yama, G., Kodama, T., Gunji, M., Provine, J., Howe, R. T., Goodson, K. E., Kennyt, T. W. 2012; 12 (2): 683-686

  Abstract

  While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.

  View details for DOI 10.1021/nl203548w

  View details for PubMedID 22224582

• Thermal conductivity and photoluminescence of light-emitting silicon nitride films APPLIED PHYSICS LETTERS Marconnet, A., Panzer, M., Yerci, S., Minissale, S., Wang, X., Zhang, X., Dal Negro, L., Goodson, K. E. 2012; 100 (5)

  View details for DOI 10.1063/1.3682508

  View details for Web of Science ID 000300065300023

• Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness Journal of Applied Physics Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K., E. 2012; 112: 014902
• High temperature thermal properties of thin tantalum nitride films APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2011; 99 (26)

  View details for DOI 10.1063/1.3672098

  View details for Web of Science ID 000298638500022

• Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, G. A., Goodson, K. E., Wong, H. P. 2011; 110 (11)

  View details for DOI 10.1063/1.3667295

  View details for Web of Science ID 000298254800159

• Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER David, M. P., Miler, J., Steinbrenner, J. E., Yang, Y., Touzelbaev, M., Goodson, K. E. 2011; 54 (25-26): 5504-5516

  View details for DOI 10.1016/j.ijheatmasstransfer.2011.07.040

  View details for Web of Science ID 000296035300037

• Adiabatic and diabatic two-phase venting flow in a microchannel INTERNATIONAL JOURNAL OF MULTIPHASE FLOW David, M. P., Steinbrenner, J. E., Miler, J., Goodson, K. E. 2011; 37 (9): 1135-1146

  View details for DOI 10.1016/j.ijmultiphaseflow.2011.06.013

  View details for Web of Science ID 000295242200013

• Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials IEEE ELECTRON DEVICE LETTERS Bozorg-Grayeli, E., Reifenberg, J. P., Panzer, M. A., Rowlette, J. A., Goodson, K. E. 2011; 32 (9): 1281-1283

  View details for DOI 10.1109/LED.2011.2158796

  View details for Web of Science ID 000294171600039

• Microthermal Stage for Electrothermal Characterization of Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H. P., Goodson, K. E. 2011; 32 (7): 952-954

  View details for DOI 10.1109/LED.2011.2144952

  View details for Web of Science ID 000292165200040

• Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Li, Z., Lee, J., Reifenberg, J. P., Asheghi, M., Jeyasingh, R. G., Wong, H. P., Goodson, K. E. 2011; 32 (7): 961-963

  View details for DOI 10.1109/LED.2011.2150193

  View details for Web of Science ID 000292165200043

• Impact of channel geometry on two-phase flow in fuel cell microchannels JOURNAL OF POWER SOURCES Steinbrenner, J. E., Lee, E. S., Hidrovo, C. H., Eaton, J. K., Goodson, K. E. 2011; 196 (11): 5012-5020

  View details for DOI 10.1016/j.jpowsour.2011.02.032

  View details for Web of Science ID 000289599900018

• Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density ACS NANO Marconnett, A. M., Yamamoto, N., Panzer, M. A., Wardle, B. L., Goodson, K. E. 2011; 5 (6): 4818-4825

  Abstract

  Nanostructured composites containing aligned carbon nanotubes (CNTs) are very promising as interface materials for electronic systems and thermoelectric power generators. We report the first data for the thermal conductivity of densified, aligned multiwall CNT nanocomposite films for a range of CNT volume fractions. A 1 vol % CNT composite more than doubles the thermal conductivity of the base polymer. Denser arrays (17 vol % CNTs) enhance the thermal conductivity by as much as a factor of 18 and there is a nonlinear trend with CNT volume fraction. This article discusses the impact of CNT density on thermal conduction considering boundary resistances, increased defect concentrations, and the possibility of suppressed phonon modes in the CNTs.

  View details for DOI 10.1021/nn200847u

  View details for Web of Science ID 000292055200065

• Thermal microdevices for biological and biomedical applications JOURNAL OF THERMAL BIOLOGY Jain, A., Goodson, K. E. 2011; 36 (4): 209-218

  View details for DOI 10.1016/j.jtherbio.2011.02.006

  View details for Web of Science ID 000292174200001

• Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films JOURNAL OF APPLIED PHYSICS Lee, J., Li, Z., Reifenberg, J. P., Lee, S., Sinclair, R., Asheghi, M., Goodson, K. E. 2011; 109 (8)

  View details for DOI 10.1063/1.3573505

  View details for Web of Science ID 000290047000229

• Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage IEEE TRANSACTIONS ON ELECTRON DEVICES Kim, S., Lee, B., Asheghi, M., Hurkx, F., Reifenberg, J. P., Goodson, K. E., Wong, H. P. 2011; 58 (3): 584-592

  View details for DOI 10.1109/TED.2010.2095502

  View details for Web of Science ID 000287665700001

• 3-D visualization of flow in microscale jet impingement systems INTERNATIONAL JOURNAL OF THERMAL SCIENCES Won, Y., Wang, E. N., Goodson, K. E., Kenny, T. W. 2011; 50 (3): 325-331

  View details for DOI 10.1016/j.ijthermalsci.2010.08.005

  View details for Web of Science ID 000287285700012

• Thermal resistance between low-dimensional nanostructures and semi-infinite media (vol 103, 094301, 2008) JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2011; 109 (5)

  View details for DOI 10.1063/1.3558984

  View details for Web of Science ID 000288387900131

• Temperature-dependent aggregation and diffusion in nanofluids INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Gharagozloo, P. E., Goodson, K. E. 2011; 54 (4): 797-806

  View details for DOI 10.1016/j.ijheatmasstransfer.2010.06.058

  View details for Web of Science ID 000287054800007

• Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory IEEE Electron Device Letters Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H.S., P., Goodson, K., E. 2011; 32: 952-954
• Characterizing Responses to Open-ended Questions In Heat Transfer Based on Everyday Situations Parikh, S. E., Sheppard, S., Goodson, K. E., ASEE AMER SOC ENGINEERING EDUCATION. 2011

  View details for Web of Science ID 000378520704040

• Phase Change Memory PROCEEDINGS OF THE IEEE Wong, H. P., Raoux, S., Kim, S., Liang, J., Reifenberg, J. P., Rajendran, B., Asheghi, M., Goodson, K. E. 2010; 98 (12): 2201-2227

  View details for DOI 10.1109/JPROC.2010.2070050

  View details for Web of Science ID 000284410800016

• Aggregate fractal dimensions and thermal conduction in nanofluids JOURNAL OF APPLIED PHYSICS Gharagozloo, P. E., Goodson, K. E. 2010; 108 (7)

  View details for DOI 10.1063/1.3481423

  View details for Web of Science ID 000283222200125

• Characterization of the wettability of thin nanostructured films in the presence of evaporation JOURNAL OF COLLOID AND INTERFACE SCIENCE Rogacs, A., Steinbrenner, J. E., Rowlette, J. A., Weisse, J. M., Zheng, X. L., Goodson, K. E. 2010; 349 (1): 354-360

  Abstract

  Vapor chambers using conventional porous membrane wicks offer limited heat transfer rates for a given thickness. This limitation can be addressed through wick nanostructuring, which promises high capillary pressures and precise control of the local porosity. This work develops a measurement technique for the wettability of nanostructured wicks based on optical imaging. Feasibility is demonstrated on a hydrophilic silicon nanowire array (SiNW) synthesized using the Vapor-Liquid-Solid (VLS) growth mechanism followed by surface plasma treatment. The wettability is determined by comparing the time-dependent liquid interface rise with a model that accounts for capillary, viscous, and gravitational forces and for evaporation. This model is demonstrated to be useful in extracting internal contact angle from thin ( approximately 10microm) porous films.

  View details for DOI 10.1016/j.jcis.2010.05.063

  View details for Web of Science ID 000279966700045

  View details for PubMedID 20579656

• Nanofluid Convection in Microtubes JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Lee, J., Gharagozloo, P. E., Kolade, B., Eaton, J. K., Goodson, K. E. 2010; 132 (9)

  View details for DOI 10.1115/1.4001637

  View details for Web of Science ID 000279992300016

• Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., David, M., Wang, F., Goodson, K. E. 2010; 36 (8): 608-619

  View details for DOI 10.1016/j.ijmultiphaseflow.2010.04.005

  View details for Web of Science ID 000279954300002

• Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films NANO LETTERS Panzer, M. A., Duong, H. M., Okawa, J., Shiomi, J., Wardle, B. L., Maruyama, S., Goodson, K. E. 2010; 10 (7): 2395-2400

  Abstract

  Interfaces dominate the thermal resistances in aligned carbon nanotube arrays. This work uses nanosecond thermoreflectance thermometry to separate interface and volume resistances for 10 microm thick aligned SWNT films coated with Al, Ti, Pd, Pt, and Ni. We interpret the data by defining the nanotube-metal engagement factor, which governs the interface resistance and is extracted using the measured film heat capacity. The metal-SWNT and SWNT-substrate resistances range between 3.8 and 9.2 mm(2)K/W and 33-46 mm(2)K/W, respectively. The temperature dependency of the heat capacity data, measured between 125 and 300 K, is in good agreement with theoretical predictions. The temperature dependence demonstrated by the metal-SWNT interface resistance data suggests inelastic phonon transmission.

  View details for DOI 10.1021/nl100443x

  View details for Web of Science ID 000280416200017

  View details for PubMedID 20503983

• Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels JOURNAL OF MICROMECHANICS AND MICROENGINEERING Fang, C., Steinbrenner, J. E., Wang, F., Goodson, K. E. 2010; 20 (4)

  View details for DOI 10.1088/0960-1317/20/4/045018

  View details for Web of Science ID 000275841800019

• Thermal Boundary Resistance Measurements for Phase-Change Memory Devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Chang, K., Panzer, M. A., Kim, S., Rowlette, J. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2010; 31 (1): 56-58

  View details for DOI 10.1109/LED.2009.2035139

  View details for Web of Science ID 000273090800020

• VOLUME OF FLUID SIMULATION OF BOILING TWO-PHASE FLOW IN A VAPOR-VENTING MICROCHANNEL FRONTIERS IN HEAT AND MASS TRANSFER Fang, C., David, M., Rogacs, A., Goodson, K. 2010; 1 (1)

  View details for DOI 10.5098/hmt.v1.1.3002

  View details for Web of Science ID 000219000400002

• SUPERIOR THERMAL INTERFACES MADE BY METALLICALLY ANCHORED CARBON NANOTUBE ARRAYS ASME InterPack Conference Hu, X., Pan, L. S., Gu, G., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2010: 597–603

  View details for Web of Science ID 000282288900073

• Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel Frontiers of Heat and Mass Transfer Fang, C., David, M., Rogacs, A., Goodson, K., E. 2010; 1: 013002
• Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform SENSORS AND ACTUATORS B-CHEMICAL Jain, A., Ness, K., Goodson, K. E. 2009; 143 (1): 286-294

  View details for DOI 10.1016/j.snb.2009.08.035

  View details for Web of Science ID 000272376800043

• Bubble-Induced Water Hammer and Cavitation in Microchannel Flow Boiling JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Fogg, D. W., Goodson, K. E. 2009; 131 (12)

  View details for DOI 10.1115/1.3216381

  View details for Web of Science ID 000271905600007

• Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films IEEE ELECTRON DEVICE LETTERS Panzer, M. A., Shandalov, M., Rowlette, J. A., Oshima, Y., Chen, Y. W., McIntyre, P. C., Goodson, K. E. 2009; 30 (12): 1269-1271

  View details for DOI 10.1109/LED.2009.2032937

  View details for Web of Science ID 000272044500007

• A benchmark study on the thermal conductivity of nanofluids JOURNAL OF APPLIED PHYSICS Buongiorno, J., Venerus, D. C., Prabhat, N., McKrell, T., Townsend, J., Christianson, R., Tolmachev, Y. V., Keblinski, P., Hu, L., Alvarado, J. L., Bang, I. C., Bishnoi, S. W., Bonetti, M., Botz, F., Cecere, A., Chang, Y., Chen, G., Chen, H., Chung, S. J., Chyu, M. K., Das, S. K., Di Paola, R., Ding, Y., Dubois, F., Dzido, G., Eapen, J., Escher, W., Funfschilling, D., Galand, Q., Gao, J., Gharagozloo, P. E., Goodson, K. E., Gutierrez, J. G., Hong, H., Horton, M., Hwang, K. S., Iorio, C. S., Jang, S. P., Jarzebski, A. B., Jiang, Y., Jin, L., Kabelac, S., Kamath, A., Kedzierski, M. A., Kieng, L. G., Kim, C., Kim, J., Kim, S., Lee, S. H., Leong, K. C., Manna, I., Michel, B., Ni, R., Patel, H. E., Philip, J., Poulikakos, D., Reynaud, C., Savino, R., Singh, P. K., Song, P., Sundararajan, T., Timofeeva, E., Tritcak, T., Turanov, A. N., Van Vaerenbergh, S., Wen, D., Witharana, S., Yang, C., Yeh, W., Zhao, X., Zhou, S. 2009; 106 (9)

  View details for DOI 10.1063/1.3245330

  View details for Web of Science ID 000272555700090

• Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films PHYSICAL REVIEW B Rowlette, J. A., Kekatpure, R. D., Panzer, M. A., Brongersma, M. L., Goodson, K. E. 2009; 80 (4)

  View details for DOI 10.1103/PhysRevB.80.045314

  View details for Web of Science ID 000268618100073

• Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance IEEE TRANSACTIONS ON ADVANCED PACKAGING Pettes, A. M., Hodes, M. S., Goodson, K. E. 2009; 32 (2): 423-430

  View details for DOI 10.1109/TADVP.2008.924221

  View details for Web of Science ID 000266778000021

• Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Kolade, B., Goodson, K. E., Eaton, J. K. 2009; 131 (5)

  View details for DOI 10.1115/1.3013831

  View details for Web of Science ID 000264374400011

• Heat Conduction through a DNA-Gold Composite NANO LETTERS Kodama, T., Jain, A., Goodson, K. E. 2009; 9 (5): 2005-2009

  Abstract

  This paper reports results from electrical and thermal conduction measurements carried out on the DNA-gold composite for which the overall conduction is shown to be dominated by the DNA rather than the discontinuous gold coatings. The electrical and thermal conductivities of the composite were about 14 S/cm and 150 W/(m K) at room temperature, respectively. The resulting value of 3.6 x 10(-4) W ohms/K(2) for the Lorentz number indicates that thermal transport in the DNA is phonon-dominated and that the molecular vibrations play a key role in both electrical and thermal conduction processes of DNA molecules.

  View details for DOI 10.1021/nl900272m

  View details for Web of Science ID 000266157100049

  View details for PubMedID 19435380

• Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling EXPERIMENTS IN FLUIDS Fogg, D., David, M., Goodson, K. E. 2009; 46 (4): 725-736

  View details for DOI 10.1007/s00348-008-0604-3

  View details for Web of Science ID 000265081300013

• Multimode thermoelastic dissipation JOURNAL OF APPLIED PHYSICS Chandorkar, S. A., Candler, R. N., Duwel, A., Melamud, R., Agarwal, M., Goodson, K. E., Kenny, T. W. 2009; 105 (4)

  View details for DOI 10.1063/1.3072682

  View details for Web of Science ID 000263803300018

• FLOW REGIME EVOLUTION IN LONG, SERPENTINE MICROCHANNELS WITH A POROUS CARBON PAPER WALL ASME International Mechanical Engineering Congress and Exposition Steinbrenner, J. E., Lee, E. S., Wang, F., Fang, C., Hidrovo, C. H., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2009: 773–781

  View details for Web of Science ID 000265085300094

• Active Microfluidic Cooling of Integrated Circuits INTEGRATED INTERCONNECT TECHNOLOGIES FOR 3D NANOELECTRONIC SYSTEMS Hidrovo, C. H., Goodson, K. E., Bakir, M. S., Meindl, J. D. 2009: 293–330

  View details for Web of Science ID 000268011300010

• THERMOELECTRIC HEAT RECOVERY FROM A TANKLESS WATER HEATING SYSTEM ASME International Mechanical Engineering Congress and Exposition LeBlanc, S. A., Gao, Y., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2009: 131–137

  View details for Web of Science ID 000265684200014

• Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films 10th Annual Non-Volatile Memory Technology Symposium Lee, J., Reifenberg, J. P., Li, Z., Hom, L., Asheghi, M., Kim, S., Wong, H. P., Goodson, K. E. IEEE. 2009: 52–57

  View details for Web of Science ID 000278758600008

• Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3 omega method INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW Oh, D., Jain, A., Eaton, J. K., Goodson, K. E., Lee, J. S. 2008; 29 (5): 1456-1461

  View details for DOI 10.1016/j.ijheatfluidflow.2008.04.007

  View details for Web of Science ID 000260645600021

• Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3 omega method JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Jain, A., Goodson, K. E. 2008; 130 (10)

  View details for DOI 10.1115/1.2945904

  View details for Web of Science ID 000259854000011

• The impact of thermal boundary resistance in phase-change memory devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Kencke, D. L., Goodson, K. E. 2008; 29 (10): 1112-1114

  View details for DOI 10.1109/LED.2008.2003012

  View details for Web of Science ID 000259812900009

• Diffusion, aggregation, and the thermal conductivity of nanofluids APPLIED PHYSICS LETTERS Gharagozloo, P. E., Eaton, J. K., Goodson, K. E. 2008; 93 (10)

  View details for DOI 10.1063/1.2977868

  View details for Web of Science ID 000259797000084

• Investigation of the natural convection boundary condition in microfabricated structures INTERNATIONAL JOURNAL OF THERMAL SCIENCES Hu, X. J., Jain, A., Goodson, K. E. 2008; 47 (7): 820-824

  View details for DOI 10.1016/j.ijthermalsci.2007.07.011

  View details for Web of Science ID 000256576500002

• 3-D numerical simulation of contact angle hysteresis for microscale two phase flow INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., Hidrovo, C., Wang, F., Eaton, J., Goodson, K. E. 2008; 34 (7): 690-705

  View details for DOI 10.1016/j.ijmultiphaseflow.2007.08.008

  View details for Web of Science ID 000258250300008

• Thermal resistance between low-dimensional nanostructures and semi-infinite media JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2008; 103 (9)

  View details for DOI 10.1063/1.2903519

  View details for Web of Science ID 000255983200119

• Thermal properties of metal-coated vertically aligned single-wall nanotube arrays JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Panzer, M. A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., Goodson, K. E. 2008; 130 (5)

  View details for DOI 10.1115/1.2885159

  View details for Web of Science ID 000255880300006

• Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs IEEE TRANSACTIONS ON ELECTRON DEVICES Rowlette, J. A., Goodson, K. E. 2008; 55 (1): 220-232

  View details for DOI 10.1109/TED.2007.911043

  View details for Web of Science ID 000252059000019

• Thermomechanical formation of nanoscale polymer indents with a heated silicon tip JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME King, W. P., Goodson, K. E. 2007; 129 (11): 1600-1604

  View details for DOI 10.1115/1.2764088

  View details for Web of Science ID 000251725700015

• Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films APPLIED PHYSICS LETTERS Reifenberg, J. P., Panzer, M. A., Kim, S., Gibby, A. M., Zhang, Y., Wong, S., Wong, H. P., Pop, E., Goodson, K. E. 2007; 91 (11)

  View details for DOI 10.1063/1.2784169

  View details for Web of Science ID 000249474000022

• Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates JOURNAL OF APPLIED PHYSICS Pop, E., Mann, D. A., Goodson, K. E., Dai, H. 2007; 101 (9)

  View details for DOI 10.1063/1.2717855

  View details for Web of Science ID 000246567900049

• Materials science. Ordering up the minimum thermal conductivity of solids. Science Goodson, K. E. 2007; 315 (5810): 342-343

  View details for PubMedID 17234938

• Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays ASME Journal of Heat Transfer Hu, X., Panzer, M., A., Goodson, K., E. 2007; 129: 91-93
• Non-equilibrium phonon distributions in sub-100 nm silicon transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sinha, S., Pop, E., DUTTON, R. W., Goodson, K. E. 2006; 128 (7): 638-647

  View details for DOI 10.1115/1.2194041

  View details for Web of Science ID 000239047600003

• A hybrid method for bubble geometry reconstruction in two-phase microchannels EXPERIMENTS IN FLUIDS Wang, E. N., Devasenathipathy, S., Lin, H., Hidrovo, C. H., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2006; 40 (6): 847-858

  View details for DOI 10.1007/s00348-006-0123-z

  View details for Web of Science ID 000239549100003

• Two-phase microfluidics for semiconductor circuits and fuel cells HEAT TRANSFER ENGINEERING Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, E., Steinbrenner, J. E., Koo, J. M., Wang, F. M., Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C. H., Kenny, T. W., Eaton, J. K., Goodson, K. E. 2006; 27 (4): 53-63

  View details for DOI 10.1080/01457630500523816

  View details for Web of Science ID 000236239500006

• Thermal conductance of an individual single-wall carbon nanotube above room temperature NANO LETTERS Pop, E., Mann, D., Wang, Q., Goodson, K. E., Dai, H. J. 2006; 6 (1): 96-100

  Abstract

  The thermal properties of a suspended metallic single-wall carbon nanotube (SWNT) are extracted from its high-bias (I-V) electrical characteristics over the 300-800 K temperature range, achieved by Joule self-heating. The thermal conductance is approximately 2.4 nW/K, and the thermal conductivity is nearly 3500 Wm(-1)K(-1) at room temperature for a SWNT of length 2.6 mum and diameter 1.7 nm. A subtle decrease in thermal conductivity steeper than 1/T is observed at the upper end of the temperature range, which is attributed to second-order three-phonon scattering between two acoustic modes and one optical mode. We discuss sources of uncertainty and propose a simple analytical model for the SWNT thermal conductivity including length and temperature dependence.

  View details for DOI 10.1021/nl052145f

  View details for Web of Science ID 000235532400018

  View details for PubMedID 16402794

• Electro-thermal transport in silicon and carbon nanotube devices 14th International Conference on Nonequilibrium Carrier Dynamics in Semiconductors Pop, E., Mann, D., ROWLETTE, J., Goodson, K., Dai, H. SPRINGER-VERLAG BERLIN. 2006: 195–199

  View details for Web of Science ID 000242486900044

• Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes Journal of Physical Chemistry B Mann, D., Pop, E., Cao, J., Wang, Q., Goodson, K., E., Dai, H. 2006; 110: 1502-1505
• 3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon ASME Journal of Heat Transfer Hu, X., Padilla, A., A., Xu, J., Fisher, T., A., Goodson, K., E. 2006; 128: 1109-1113
• Scaling analysis of multilevel interconnect temperatures for high-performance ICs IEEE TRANSACTIONS ON ELECTRON DEVICES Im, S., Srivastava, N., Banerjee, K., Goodson, K. E. 2005; 52 (12): 2710-2719

  View details for DOI 10.1109/TED.2005.859612

  View details for Web of Science ID 000233682200025

• Negative differential conductance and hot phonons in suspended nanotube molecular wires PHYSICAL REVIEW LETTERS Pop, E., Mann, D., Cao, J., Wang, Q., Goodson, K. E., Dai, H. J. 2005; 95 (15)

  Abstract

  Freely suspended metallic single-walled carbon nanotubes (SWNTs) exhibit reduced current carrying ability compared to those lying on substrates, and striking negative differential conductance at low electric fields. Theoretical analysis reveals significant self-heating effects including electron scattering by hot nonequilibrium optical phonons. Electron transport characteristics under strong self-heating are exploited for the first time to probe the thermal conductivity of individual SWNTs (approximately 3600 W m-1 K-1 at T=300 K) up to approximately 700 K, and reveal a 1/T dependence expected for umklapp phonon scattering at high temperatures.

  View details for DOI 10.1103/PhysRevLett.95.155505

  View details for Web of Science ID 000232443400039

  View details for PubMedID 16241738

• Managing heat for electronics MATERIALS TODAY Schelling, P. K., Shi, L., Goodson, K. E. 2005; 8 (6): 30-35

  View details for Web of Science ID 000208785200022

• Phase change phenomena in silicon microchannels INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Zhang, L. A., Wang, E. N., Goodson, K. E., Kenny, T. W. 2005; 48 (8): 1572-1582

  View details for DOI 10.1016/j.ijheatmasstransfer.2004.09.048

  View details for Web of Science ID 000228228400015

• Monte Carlo simulation of Joule heating in bulk and strained silicon APPLIED PHYSICS LETTERS Pop, E., DUTTON, R. W., Goodson, K. E. 2005; 86 (8)

  View details for DOI 10.1063/1.1870106

  View details for Web of Science ID 000227609000032

• Scattering of g-process longitudinal optical phonons at hotspots in silicon JOURNAL OF APPLIED PHYSICS Sinha, S., Schelling, P. K., Phillpot, S. R., Goodson, K. E. 2005; 97 (2)

  View details for DOI 10.1063/1.1831549

  View details for Web of Science ID 000226700500049

• Bond line thickness of thermal interface materials with carbon nanotubes ASME/Pacific Rim Technical Conference on Integration and Packaging of MEMS, NEMS, and Electronic Systems Singaravelu, S. A., Hu, X., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2005: 379–383

  View details for Web of Science ID 000241978200048

• Thermal Conduction in Silicon Micro and Nanostructures Annual Review of Heat Transfer McConnell, A., D., Goodson, K., E. 2005; 14: 129-168
• Managing Heat for Electronics Materials Today Shelling, P., Li, S., Goodson, K., E. 2005; 6: 30-35
• Measurement of thermophysical properties of thin film shape memory alloys using the 3-omega method ASME International Mechanical Engineering Congress and Exposition Jain, A., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2005: 537–541

  View details for Web of Science ID 000243038100084

• Review: Multiscale thermal modeling in nanoelectronics INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING Sinha, S., Goodson, K. E. 2005; 3 (1): 107-133

  View details for Web of Science ID 000235549800008

• Micromachined jets for liquid impingement cooling of VLSI chips (vol 13, pg 833, 2004) JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (6): 1072-1072

  View details for DOI 10.1109/JMEMS.2004.840851

  View details for Web of Science ID 000225515100022

• Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion JOURNAL OF APPLIED PHYSICS Pop, E., DUTTON, R. W., Goodson, K. E. 2004; 96 (9): 4998-5005

  View details for DOI 10.1063/1.1788838

  View details for Web of Science ID 000224799300042

• Micromachined jets for liquid impingement cooling of VLSI chips JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (5): 833-842

  View details for DOI 10.1109/JMEMS.2004.835768

  View details for Web of Science ID 000224413100014

• Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E. 2004; 85 (11): 2086-2088

  View details for DOI 10.1063/1.1787160

  View details for Web of Science ID 000223923300073

• Nucleation and growth of vapor bubbles in a heated silicon microchannel JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Wang, E. N., Devasenathipathy, S., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2004; 126 (4): 497-497

  View details for Web of Science ID 000223989100004

• Convectively driven polymerase chain reaction thermal cycler ANALYTICAL CHEMISTRY Wheeler, E. K., Benett, W., Stratton, P., Richards, J., Chen, A., Christian, A., Ness, K. D., Ortega, J., Li, L. G., Weisgraber, T. H., Goodson, K. E., Milanovich, F. 2004; 76 (14): 4011-4016

  Abstract

  We have fabricated a low-cost disposable polymerase chain reaction thermal chamber that uses buoyancy forces to move the sample solution between the different temperatures necessary for amplification. Three-dimensional, unsteady finite element modeling and a simpler 1-D steady-state model are used together with digital particle image velocimetry data to characterize the flow within the device. Biological samples have been amplified using this novel thermal chamber. Time for amplification is less than 30 min. More importantly, an analysis of the energy consumption shows significant improvements over current technology.

  View details for DOI 10.1021/ac034941g

  View details for Web of Science ID 000222706400018

  View details for PubMedID 15253636

• Electro-kinetic microchannel cooling system for servers 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Upadhya, G., Zhou, P., Hom, J., Goodson, K., Munch, M. IEEE. 2004: 367–371

  View details for Web of Science ID 000222478500052

• Electro-kinetic microchannel cooling system for desktop computers 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Zhou, P., Hom, J., Upadhya, G., Goodson, K., Munch, M. IEEE. 2004: 26–29

  View details for Web of Science ID 000189455400005

• Thermal microscopy with a microfabricated solid immersion lens MICROSCALE THERMOPHYSICAL ENGINEERING Fletcher, D. A., Kino, G. S., Goodson, K. E. 2003; 7 (4): 267-273

  View details for DOI 10.1080/10893950390245985

  View details for Web of Science ID 000186732300001

• Special Issue on emerging technologies - Foreword IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Amon, C. H., Goodson, K. E., Luo, G. Q. 2003; 26 (2): 307-308

  View details for DOI 10.1109/TCAPT.2003.816231

  View details for Web of Science ID 000186046300001

• Nanoscale thermal transport JOURNAL OF APPLIED PHYSICS Cahill, D. G., FORD, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., Phillpot, S. R. 2003; 93 (2): 793-818

  View details for DOI 10.1063/1.1524305

  View details for Web of Science ID 000180134200001

• Detailed heat generation simulations via the Monte Carlo method IEEE International Conference on Simulation of Semiconductor Processes and Devices Pop, E., Dutton, R., Goodson, K. IEEE. 2003: 121–124

  View details for Web of Science ID 000185660800030

• Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth ASME International Mechanical Engineering Congress Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K. AMER SOC MECHANICAL ENGINEERS. 2003: 251–257

  View details for Web of Science ID 000222633100040

• Thermal conductivity model for nearly pure and doped thin silicon layers at high temperatures ASME International Mechanical Engineering Congress Asheghi, M., Goodson, K. E. PROFESSIONAL ENGINEERING PUBLISHING LTD. 2003: 847–853

  View details for Web of Science ID 000222522400103

• Closed-loop cooling technologies for microprocessors IEEE International Electron Devices Meeting Upadhya, G., Zhou, P., Goodson, K., Munch, M., Kenny, T. IEEE. 2003: 775–778

  View details for Web of Science ID 000189158800177

• Thermal analysis of ultra-thin body device scaling IEEE International Electron Devices Meeting Pop, E., Dutton, R., Goodson, K. IEEE. 2003: 883–886

  View details for Web of Science ID 000189158800202

• Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation JOURNAL OF MICROELECTROMECHANICAL SYSTEMS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G. L., Despont, M., Durig, U. T., Rothuizen, H., Binnig, G., Vettiger, P. 2002; 11 (6): 765-774

  View details for DOI 10.1109/JMEMS.2002.803283

  View details for Web of Science ID 000179740900017

• Thermal conduction in doped single-crystal silicon films JOURNAL OF APPLIED PHYSICS Asheghi, M., Kurabayashi, K., Kasnavi, R., Goodson, K. E. 2002; 91 (8): 5079-5088

  View details for DOI 10.1063/1.1458057

  View details for Web of Science ID 000174666600047

• Thermometry and thermal transport in micro/nanoscale solid-state devices and structures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cahill, D. G., Goodson, K. E., Majumdar, A. 2002; 124 (2): 223-241

  View details for DOI 10.1115/1.1454111

  View details for Web of Science ID 000175917200002

• Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Zhang, L., Koo, J. M., Jiang, L., Asheghi, M., Goodson, K. E., Santiago, J. G., Kenny, T. W. 2002; 11 (1): 12-19

  View details for Web of Science ID 000173751000002

• Modeling resist heating in mask fabrication using a multilayer Green's function approach. Conference on Metrology, Inspection, and Process Control for Microlithography XVI CHU, D. C., Pease, R. F., Goodson, K. E. SPIE-INT SOC OPTICAL ENGINEERING. 2002: 206–212

  View details for Web of Science ID 000178071700021

• Electroosmotic Microchannel Cooling System for Microprocessors Electronics Cooling Goodson, K., E., Santiago, J., G., Kenny, T., Jiang, L., Zeng, S., Koo, J., M. 2002; 8: 46-47
• Transient and sub-atmospheric performance of a closed-loop electroosmotic microchannel cooling system THERMES 2002 International Conference Jiang, L., Mikkelsen, J., Koo, J. M., Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., Kenny, T., Goodson, K. E., Maveety, J., Prasher, R., Benning, S. MILLPRESS SCIENCE PUBLISHERS. 2002: 133–139

  View details for Web of Science ID 000181956000016

• Microfabricated silicon solid immersion lens JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Fletcher, D. A., Crozier, K. B., Guarini, K. W., Minne, S. C., Kino, G. S., Quate, C. F., Goodson, K. E. 2001; 10 (3): 450-459

  View details for Web of Science ID 000170875900015

• Thermal conductivity of doped polysilicon layers JOURNAL OF MICROELECTROMECHANICAL SYSTEMS McConnell, A. D., Uma, S., Goodson, K. E. 2001; 10 (3): 360-369

  View details for Web of Science ID 000170875900005

• Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC) OPTICAL ENGINEERING Zhou, P., Goodson, K. E. 2001; 40 (8): 1613-1620

  View details for Web of Science ID 000170933100029

• Thermal characterization of Bi2Te3/Sb2Te3 superlattices JOURNAL OF APPLIED PHYSICS Touzelbaev, M. N., Zhou, P., Venkatasubramanian, R., Goodson, K. E. 2001; 90 (2): 763-767

  View details for Web of Science ID 000169660000033

• Refraction contrast imaging with a scanning microlens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2001; 78 (23): 3589-3591

  View details for Web of Science ID 000168996900007

• Measurement of ballistic phonon conduction near hotspots in silicon APPLIED PHYSICS LETTERS Sverdrup, P. G., Sinha, S., Asheghi, M., Uma, S., Goodson, K. E. 2001; 78 (21): 3331-3333

  View details for Web of Science ID 000168721200057

• A deterministic methodology for prediction of fracture distribution in basaltic multiflows JOURNAL OF GEOPHYSICAL RESEARCH-SOLID EARTH Lore, J., Aydin, A., Goodson, K. E. 2001; 106 (B4): 6447-6459

  View details for Web of Science ID 000167920500008

• Focusing in microlenses close to a wavelength in diameter OPTICS LETTERS Fletcher, D. A., Goodson, K. E., Kino, G. S. 2001; 26 (7): 399-401

  Abstract

  Light focused from air into a spherical microlens is affected by diffraction at the lens surface as its diameter approaches the wavelength of light. Through an extension of Mie theory, we show that a converging wave that is incident upon a Si microlens with a diameter less than approximately 4lambda creates a spot as much as 25% smaller than predicted with vector diffraction theory. Si microlenses only a wavelength in diameter are shown to be virtually insensitive to variations in the maximum illumination angle, and changes in index of refraction are not found to cause the proportional changes in spot size that would be expected from vector diffraction theory.

  View details for Web of Science ID 000167774200001

  View details for PubMedID 18040333

• Atomic force microscope cantilevers for combined thermomechanical data writing and reading APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G. K., Vettiger, P. 2001; 78 (9): 1300-1302

  View details for Web of Science ID 000167151000044

• Sub-continuum simulations of heat conduction in silicon-on-insulator transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sverdrup, P. G., Ju, Y. S., Goodson, K. E. 2001; 123 (1): 130-137

  View details for Web of Science ID 000167368600016

• Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers International Journal of Thermophysics Uma, S., McConnell, A., D., Asheghi, M., Kurabayashi, K., Goodson, K., E. 2001; 22: 605-616
• Study of boiling regimes and transient signal measurements in microchannels 11th International Conference on Solid-State Sensors and Actuators Zhang, L., Koo, J. M., Jiang, L. SPRINGER-VERLAG BERLIN. 2001: 1514–1517

  View details for Web of Science ID 000172547800351

• Near-field infrared imaging with a microfabricated solid immersion lens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2000; 77 (14): 2109-2111

  View details for Web of Science ID 000089524900010

• Millipede - An AFM Data Storage System at the Frontier of Nanotribology Tribology Letters Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M., I., Goodson, K. E. 2000; 9: 25-32
• Microfabricated solid immersion lens with metal aperture IEEE/LEOS International Conference on Optical MEMS Fletcher, D. A., Simanovskii, D., Palanker, D., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, F. E. IEEE. 2000: 133–134

  View details for Web of Science ID 000165310300063

• Thermomechanical diagnostics of BGA packages using digital image/speckle correlation 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Zhou, P., Goodson, K. IEEE. 2000: 240–245

  View details for Web of Science ID 000089141400036

• "Millipede" - an AFM data storage system at the frontier of nanotribology International Conference on Nanotribology Durig, U., Cross, G., Despont, M., Drechsler, U., Haberle, W., Lutwyche, M. I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G. K., King, W. P., Goodson, K. E. SPRINGER/PLENUM PUBLISHERS. 2000: 25–32

  View details for Web of Science ID 000167678500004

• Impact of molecular orientation on thermal conduction in spin-coated polyimide films JOURNAL OF APPLIED PHYSICS Kurabayashi, K., Goodson, K. E. 1999; 86 (4): 1925-1931

  View details for Web of Science ID 000081720600022

• Intrinsic-carrier thermal runaway in silicon microcantilevers MICROSCALE THERMOPHYSICAL ENGINEERING Chui, B. W., Asheghi, M., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J. 1999; 3 (3): 217-228

  View details for Web of Science ID 000082536200006

• Measurement of the thermal conductivity anisotropy in polyimide films JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Kurabayashi, K., Asheghi, M., Touzelbaev, M., Goodson, K. E. 1999; 8 (2): 180-191

  View details for Web of Science ID 000080737300007

• Phonon scattering in silicon films with thickness of order 100 nm APPLIED PHYSICS LETTERS Ju, Y. S., Goodson, K. E. 1999; 74 (20): 3005-3007

  View details for Web of Science ID 000080352700033

• Process-dependent thermal transport properties of silicon-dioxide films deposited using low-pressure chemical vapor deposition JOURNAL OF APPLIED PHYSICS Ju, Y. S., Goodson, K. E. 1999; 85 (10): 7130-7134

  View details for Web of Science ID 000080136000019

• Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating THIN SOLID FILMS Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1999; 339 (1-2): 160-164

  View details for Web of Science ID 000079008300027

• Heat conduction in novel electronic films ANNUAL REVIEW OF MATERIALS SCIENCE Goodson, K. E., Ju, Y. S. 1999; 29: 261-293

  View details for Web of Science ID 000082534400009

• Phonon Scattering in Silicon Films of Thickness Below 100 nm Applied Physics Letters Ju, Y., S., Goodson, K., E. 1999; 74: 3005-3007
• Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films Journal of Applied Physics Kurabayashi, K., Goodson, K., E. 1999; 86: 1925-1931
• Transient liquid crystal thermometry of microfabricated PCR vessel arrays JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chaudhari, A. M., Woudenberg, T. M., Albin, M., Goodson, K. E. 1998; 7 (4): 345-355

  View details for Web of Science ID 000077401800001

• Precision measurement and mapping of die-attach thermal resistance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A Kurabayashi, K., Goodson, K. E. 1998; 21 (3): 506-514

  View details for Web of Science ID 000076416500015

• Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique 31st National Heat Transfer Conference Ju, Y. S., Goodson, K. E. ASME-AMER SOC MECHANICAL ENG. 1998: 306–13

  View details for Web of Science ID 000074007000002

• Thermal characterization of IC passivation layers using Joule heating and optical thermometry MICROSCALE THERMOPHYSICAL ENGINEERING Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1998; 2 (2): 101-110

  View details for Web of Science ID 000074152500004

• Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chui, B. W., Stowe, T. D., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J., Terris, B. D., Ried, R. P., Rugar, D. 1998; 7 (1): 69-78

  View details for Web of Science ID 000073005900009

• Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries DIAMOND AND RELATED MATERIALS Touzelbaev, M. N., Goodson, K. E. 1998; 7 (1): 1-14

  View details for Web of Science ID 000072061900001

• Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique ASME Journal of Heat Transfer Ju, Y., S., Goodson, K., E. 1998; 120: 306-313
• Precision Measurement and Mapping of Die-Attach Thermal Resistance IEEE Transactions on Components, Packaging, and Manufacturing Technology Kurabayashi, K., Goodson, K., E. 1998; A21: 506-514
• Thermal mapping of interconnects subjected to brief electrical stresses IEEE ELECTRON DEVICE LETTERS Ju, Y. S., Goodson, K. E. 1997; 18 (11): 512-514

  View details for Web of Science ID A1997YD00300002

• Impact of nucleation density on thermal resistance near diamond-substrate boundaries JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER Touzelbaev, M. N., Goodson, K. E. 1997; 11 (4): 506-512

  View details for Web of Science ID A1997YA62200003

• Phonon-boundary scattering in thin silicon layers APPLIED PHYSICS LETTERS Asheghi, M., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 71 (13): 1798-1800

  View details for Web of Science ID A1997XY99300018

• Heating mechanisms of LDMOS and LIGBT in ultrathin SOI IEEE ELECTRON DEVICE LETTERS Leung, Y. K., Paul, A. K., Goodson, K. E., Plummer, J. D., Wong, S. S. 1997; 18 (9): 414-416

  View details for Web of Science ID A1997XR89300004

• Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS Ju, Y. S., Goodson, K. E. 1997; 36 (6B): L798-L800

  View details for Web of Science ID A1997XG03200021

• Short-timescale thermal mapping of semiconductor devices IEEE ELECTRON DEVICE LETTERS Ju, Y. S., KADING, O. W., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 18 (5): 169-171

  View details for Web of Science ID A1997WU99600001

• Improved heat sinking for laser-diode arrays using microchannels in CVD diamond IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING Goodson, K. E., Kurabayashi, K., Pease, R. F. 1997; 20 (1): 104-109

  View details for Web of Science ID A1997WH03400014

• Thermal conductivity measurements of interlevel dielectrics Symposium on Materials Reliability in Microelectronics, at the 1997 MRS Spring Meeting VARNER, E. B., Marieb, T., Mack, A. S., Lee, J., MEYER, W. K., Goodson, K. E. MATERIALS RESEARCH SOCIETY. 1997: 279–284

  View details for Web of Science ID A1997BJ82V00038

• Thermal conduction in nonhomogeneous CVD diamond layers in electronic microstructures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E. 1996; 118 (2): 279-286

  View details for Web of Science ID A1996UQ31000001

• PREDICTION AND MEASUREMENT OF TEMPERATURE-FIELDS IN SILICON-ON-INSULATOR ELECTRONIC-CIRCUITS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1995; 117 (3): 574-581

  View details for Web of Science ID A1995RX54700003

• THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES APPLIED PHYSICS LETTERS Goodson, K. E., KADING, O. W., Rosner, M., Zachai, R. 1995; 66 (23): 3134-3136

  View details for Web of Science ID A1995RB34700017

• EXPERIMENTAL INVESTIGATION OF THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES JOURNAL OF APPLIED PHYSICS Goodson, K. E., KADING, O. W., Rosler, M., Zachai, R. 1995; 77 (4): 1385-1392

  View details for Web of Science ID A1995QG50000004

• THERMAL CONDUCTION IN METALLIZED SILICON-DIOXIDE LAYERS ON SILICON APPLIED PHYSICS LETTERS KADING, O. W., SKURK, H., Goodson, K. E. 1994; 65 (13): 1629-1631

  View details for Web of Science ID A1994PH33200009

• PREDICTION AND MEASUREMENT OF THE THERMAL-CONDUCTIVITY OF AMORPHOUS DIELECTRIC LAYERS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1994; 116 (2): 317-324

  View details for Web of Science ID A1994NP56200005

• Measurement and Modeling of Self-Heating in SOI nMOSFETS IEEE Transactions on Electron Devices Su, L., T., Chung, J., E., Antoniadis, D., A., Goodson, K., E., Flik, M., I. 1994; 41: 69-75
• MEASUREMENT AND MODELING OF SELF-HEATING IN SOI NMOSFETS IEEE TRANSACTIONS ON ELECTRON DEVICES Su, L. T., Chung, J. E., Antoniadis, D. A., Goodson, K. E., Flik, M. I. 1994; 41 (1): 69-75

  View details for Web of Science ID A1994MU75400011

• Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits Thermal Science and Engineering Goodson, K., E., Flik, M., I. 1994; 2: 191-201
• Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1994; 116: 317-324
• Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon Applied Physics Letters Kading, O., W., Skurk, H., Goodson, K., E. 1994; 65: 1629-1631
• Solid-Layer Thermal-Conductivity Measurement Techniques Applied Mechanics Reviews Goodson, K., E., Flik, M., I. 1994; 47: 101-112
• INTRINSIC SUPERCONDUCTING RADIATION DETECTOR APPLIED PHYSICS LETTERS Flik, M. I., Zhang, Z. M., Goodson, K. E. 1993; 62 (22): 2862-2864

  View details for Web of Science ID A1993LE35300041

• ELECTRON AND PHONON THERMAL CONDUCTION IN EPITAXIAL HIGH-TC SUPERCONDUCTING FILMS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I. 1993; 115 (1): 17-25

  View details for Web of Science ID A1993KP91000003

• Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers IEEE Electron Device Letters Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1993; 14: 490-492
• Intrinsic Superconducting Radiation Detector Applied Physics Letters Flik, M., I., Zhang, Z., Z., Goodson, K., E. 1993; 62: 2862-2864
• Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I. 1993; 115: 17-25
• EFFECT OF MICROSCALE THERMAL CONDUCTION ON THE PACKING LIMIT OF SILICON-ON-INSULATOR ELECTRONIC DEVICES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY Goodson, K. E., Flik, M. I. 1992; 15 (5): 715-722

  View details for Web of Science ID A1992KD69800014

• ELECTRON-SCATTERING RATE IN EPITAXIAL YBA2CU3O7 SUPERCONDUCTING FILMS PHYSICAL REVIEW B Flik, M. I., Zhang, Z. M., Goodson, K. E., Siegal, M. P., Phillips, J. M. 1992; 46 (9): 5606-5614

  View details for Web of Science ID A1992JM06400073

• HEAT-TRANSFER REGIMES IN MICROSTRUCTURES JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Flik, M. I., Choi, B. I., Goodson, K. E. 1992; 114 (3): 666-674

  View details for Web of Science ID A1992JL49100017

• THERMAL-ANALYSIS OF ELECTRON-BEAM ABSORPTION IN LOW-TEMPERATURE SUPERCONDUCTING FILMS 3RD THERMAL ENGINEERING JOINT CONF OF THE AMERICAN SOC MECHANICAL ENGINEERS / JAPAN SOC MECHANICAL ENGINEERS : CONDUCTION, CRYOGENICS, MEASUREMENT TECHNIQUES Flik, M. I., Goodson, K. E. ASME-AMER SOC MECHANICAL ENG. 1992: 264–70

  View details for Web of Science ID A1992HP76200035

• The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films Physical Review B Flik, M., I., Zhang, Z., M., Goodson, K., E., Siegal, M., P., Phillips, J., M. 1992; 46: 5606-5614
• Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films ASME Journal of Heat Transfer Flik, M., I., Goodson, K., E. 1992; 114: 264-270