Bio


As Mechanical Engineering Chair & Vice Chair (2008-2019), Ken Goodson led two strategic plans and recruited 15 faculty who transformed the department's scholarship and diversity.

Goodson specializes in heat transfer and electronics cooling, with an emphasis on nanoscale conduction, microfluidic heat sinks, and transport physics. His lab pioneered phonon free path measurements using silicon nanolayers and helped IC companies launch SOI, PCRAM, and other technologies. Current projects address power devices, vehicles, and data centers with ARPA-E, Google, Toyota, Intel, Bosch, SRC/ASCENT, and NSF/POETS. Goodson has 35 patents and co-founded Cooligy, which built heat sinks for Apple products and was acquired by Emerson.

Goodson is a member of the National Academy of Engineering and a Fellow with ASME, IEEE, APS, AAAS, and the National Academy of Inventors. He received the ASME Kraus Medal, the inaugural IEEE Richard Chu Award, the AIChE Kern Award, SRC Technical Excellence Award, the SIA University Researcher Award and the Heat Transfer Memorial Award for Science. His PhD alums include dozens at IC firms and 20+ Professors at MIT, UC Berkeley, and other schools.

Goodson moonlights as a baritone oratorio soloist. Appearances include Davies Symphony Hall with the SF Choral Society and, in May 2020, the title role in Mendelssohn’s Elijah with Schola Cantorum. His wife, Laura Dahl, is a concert pianist with the Stanford music faculty.

Academic Appointments


Administrative Appointments


  • Senior Associate Dean for Faculty & Academic Affairs, School of Engineering (2019 - Present)
  • Department Chair, Mechanical Engineering (2013 - 2019)
  • Vice Department Chair, Mechanical Engineering (2008 - 2013)
  • Presidential Search Committee, Stanford University (2015 - 2016)

Honors & Awards


  • University Researcher Award, Semiconductor International Association (2020)
  • Member, National Academy of Engineering (2020)
  • Fellow, National Academy of Inventors (2019)
  • Elected Fellow: AAAS, ASME, IEEE, APS (2010-2016)
  • Inaugural Richard Chu Achievement Award, IEEE (2018)
  • InterPACK Achievement Award, ASME (2017)
  • Charles Russ Richards Memorial Award, Pi Tau Sigma & ASME (2016)
  • Donald Q. Kern Heat Transfer Award, AIChE (2015)
  • Rohsenow Lectureship, MIT (2015)
  • Aisinjioro-Soo Distinguished Lectureship, University of Illinois Urbana-Champaign (2015)
  • Hawkins Lectureship, Purdue University (2015)
  • Heat Transfer Memorial Award for Science, ASME (2014)
  • Technical Excellence Award, Semiconductor Research Corporation (2014)
  • THERMI Award, IEEE (2013)
  • Kraus Thermal Management Medal, ASME (2010)
  • Plenary Lectures, ITHERM, PHONONS, InterPACK, ISSCC, Therminic, SemiTherm (2002-present)
  • Dusinberre Lectureship, Penn State University (2010)
  • Golden/Outstanding Reviewer, IEEE, ASME (2010, 1999)
  • Young Investigator Award, Office of Naval Research (1996)
  • CAREER Award, National Science Foundation (1996)
  • JSPS Visiting Professorship, Tokyo Institute of Technology (1996)
  • Best/Outstanding Paper, ITHERM, SemiTherm, IEDM (2012, 2001, 1992)
  • Voice Fellow, Tanglewood Music Festival (1990, 1991)
  • Luis Sudler Prize for Arts Achievement, MIT (1989)
  • Graduate Fellowship, Office of Naval Research (1989-1992)
  • Tau Beta Pi, Phi Beta Kappa, Burchard Scholar, MIT (1988, 1989)

Boards, Advisory Committees, Professional Organizations


  • ASME (Fellow), IEEE (Fellow), APS (Fellow), AAAS (Fellow), NAI (Fellow) (2010 - Present)
  • Chief Editor, Nanoscale & Microscale Thermophysical Engineering (2007 - 2012)
  • Associate Editor, Journal of Heat Transfer (2008 - 2012)
  • Member, Tau Beta Pi, Phi Beta Kappa, Sigma Xi (1989 - Present)

Program Affiliations


  • Stanford SystemX Alliance

Professional Education


  • PhD ME, MIT (1993)
  • MSME, MIT. ONR Graduate Fellow (1991)
  • BSME, MIT. Tau Beta Pi, Pi Tau Sigma (1989)
  • BS Humanities, MIT. Phi Beta Kappa. Sudler Prize (1989)

Patents


  • "SELECTED PATENTS FROM 35 TOTAL"
  • US Patent 9601452 (2017): Barako, Goodson, et al. "High-Conductivity Bonding of Metal Nanowire Arrays", assigned to Northrop Grumman & Stanford
  • US Patent 7104312 (2006): Goodson, Upadhya, Zhou, et al. "Method and Apparatus for Achieving Temperature Uniformity and Hot Spot Cooling in a Heat Producing Device", assigned to Cooligy (acquired by Emerson)
  • US Patent 5843224 (1998): Zachai, Gutheit, Goodson. "Composite structure comprising a semiconductor layer arranged on a diamond or diamond-like layer and process for its production", assigned to DaimlerBenz
  • US Patent 6942018 (2005): Goodson, Santiago, Kenny, et al. "Electroosmotic Microchannel Cooling System", assigned to Stanford, licensed to Cooligy (acquired by Emerson)

Current Research and Scholarly Interests


The Nanoheat Lab studies heat transfer in electronic nanostructures, microfluidic heat sinks, and packaging, with an emphasis on basic transport physics and industrial impact. We work closely with companies on novel cooling strategies for power devices, portables, ASICs, & data centers.

Current projects (see list below) include microfluidic heat sinks and vapor chambers for power electronics and 3D logic chips, also electron and phonon conduction and energy conversion in nanostructures. We collaborate with EE and MatSci experts, and current sponsors include ARPA-E, the NSF POETS Center, SRC ASCENT, Google, Toyota, Ford, Bosch, and Intel.

Historically, the lab pioneered phonon free path measurements using silicon nanolayers and helped IC companies commercialize SOI transistors, PCRAM, low-k dielectric passivation, and other thermally-hard technologies. Professor Goodson has 35 patents including several that launched Cooligy, a startup that built heat sinks for Apple products and was acquired by Emerson.

More recently, the Nanoheat Lab developed a record-breaking heat sink with Raytheon as part of DARPA ICECOOL, achieving low superheat using diamond channels, porous copper inverse opals, and 3D manifolding. We leveraged this progress to help UIUC launch an NSF Center for power electronics (POETS), which is an ongoing, major research catalyst for the lab.

Over the decades, lab sponsorship has been split between government grants and customized corporate contracts and gifts. We tailor our research for the benefit of both companies and our PhD students. Dozens of Goodson's PhD graduates now work at IC and energy companies, and 20+ are Professors at MIT, UC Berkeley, Stanford, UIUC, Purdue, UCLA, and other schools.

Projects


2019-20 Courses


Stanford Advisees


  • Doctoral Dissertation Reader (AC)
    Shang Zhai
  • Doctoral Dissertation Advisor (AC)
    Sougata Hazra, Heungdong Kwon, Sri Lingamneni, Tanya Liu, Chris Perez, Alisha Piazza, Qianying Wu
  • Doctoral Dissertation Co-Advisor (AC)
    ZHENGLIANG BIAN
  • Master's Program Advisor
    Karsu Kilic, Joel Martis
  • Doctoral (Program)
    Farid Soroush

All Publications


  • Publication Overview: 230 Journal Articles, 300 Conference Papers, 32 Patents, 9 Book Chapters, 2 Books. 32000+ Citations, H = 84 (Google Scholar). 17,000+ Citations, H = 59 (Web of Science) Goodson, K. E. 2020
  • An electrochemical thermal transistor NATURE COMMUNICATIONS Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C. J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K. E. 2018; 9
  • Enhanced Capillary-Fed Boiling in Copper Inverse Opals via Template Sintering ADVANCED FUNCTIONAL MATERIALS Zhang, C., Palko, J. W., Barako, M. T., Asheghi, M., Santiago, J. G., Goodson, K. E. 2018; 28 (41)
  • Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper ADVANCED FUNCTIONAL MATERIALS Palko, J. W., Lee, H., Zhang, C., Dusseault, T. J., Maitra, T., Won, Y., Agonafer, D. D., Moss, J., Houshmand, F., Rong, G., Wilbur, J. D., Rockosi, D., Mykyta, I., Resler, D., Altman, D., Asheghi, M., Santiago, J. G., Goodson, K. E. 2017; 27 (45)
  • Modulation of thermal and thermoelectric transport in individual carbon nanotubes by fullerene encapsulation NATURE MATERIALS Kodama, T., Ohnishi, M., Park, W., Shiga, T., Park, J., Shimada, T., Shinohara, H., Shiomi, J., Goodson, K. E. 2017; 16 (9): 892-+

    Abstract

    The potential impact of encapsulated molecules on the thermal properties of individual carbon nanotubes (CNTs) has been an important open question since the first reports of the strong modulation of electrical properties in 2002. However, thermal property modulation has not been demonstrated experimentally because of the difficulty of realizing CNT-encapsulated molecules as part of thermal transport microstructures. Here we develop a nanofabrication strategy that enables measurement of the impact of encapsulation on the thermal conductivity (κ) and thermopower (S) of single CNT bundles that encapsulate C 60, Gd@C 82 and Er 2@C 82. Encapsulation causes 35-55% suppression in κ and approximately 40% enhancement in S compared with the properties of hollow CNTs at room temperature. Measurements of temperature dependence from 40 to 320 K demonstrate a shift of the peak in the κ to lower temperature. The data are consistent with simulations accounting for the interaction between CNTs and encapsulated fullerenes.

    View details for PubMedID 28759031

  • Thermal transport: Cool electronics. Nature materials Cho, J., Goodson, K. E. 2015; 14 (2): 136-137

    View details for DOI 10.1038/nmat4194

    View details for PubMedID 25613710

  • Ordering up the Minimum Thermal Conductivity of Solids SCIENCE Goodson, K. E. 2007; 315: 342-343
  • Heat generation and transport in nanometer-scale transistors PROCEEDINGS OF THE IEEE Pop, E., Sinha, S., Goodson, K. E. 2006; 94 (8): 1587-1601
  • Tunable, passive thermal regulation through liquid to vapor phase change APPLIED PHYSICS LETTERS Liu, T., Palko, J. W., Katz, J. S., Dede, E., Zhou, F., Asheghi, M., Goodson, K. E. 2019; 115 (25)

    View details for DOI 10.1063/1.5133795

    View details for Web of Science ID 000505535900013

  • Thermal conductivity of crystalline AlN and the influence of atomic-scale defects JOURNAL OF APPLIED PHYSICS Xu, R., Rojo, M., Islam, S. M., Sood, A., Vareskic, B., Katre, A., Mingo, N., Goodson, K. E., Xing, H., Jena, D., Pop, E. 2019; 126 (18)

    View details for DOI 10.1063/1.5097172

    View details for Web of Science ID 000504002600023

  • Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Kong, D., Jung, K., Jung, S., Jung, D., Schaadt, J., Lyengar, M., Malone, C., Kharangate, C. R., Asheghi, M., Goodson, K. E., Lee, H. 2019; 141: 145–55
  • Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Flader, I. B., Chen, Y., Yang, Y., Ng, E. J., Shin, D. D., Heinz, D. B., Ortiz, L., Alter, A. L., Park, W., Goodson, K. E., Kenny, T. W. 2019; 28 (3): 372–81
  • Understanding the switching mechanism of interfacial phase change memory JOURNAL OF APPLIED PHYSICS Okabe, K. L., Sood, A., Yalon, E., Neumann, C. M., Asheghi, M., Pop, E., Goodson, K. E., Wong, H. 2019; 125 (18)

    View details for DOI 10.1063/1.5093907

    View details for Web of Science ID 000470151800040

  • Quasi-Ballistic Thermal Transport Across MoS2 Thin Films NANO LETTERS Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K. E., Pop, E. 2019; 19 (4): 2434–42
  • Strongly tunable anisotropic thermal transport in MoS2 by strain and lithium intercalation: first-principles calculations 2D MATERIALS Chen, S., Sood, A., Pop, E., Goodson, K. E., Donadio, D. 2019; 6 (2)
  • Quasi-Ballistic Thermal Transport Across MoS2 Thin Films. Nano letters Sood, A., Xiong, F., Chen, S., Cheaito, R., Lian, F., Asheghi, M., Cui, Y., Donadio, D., Goodson, K. E., Pop, E. 2019

    Abstract

    Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. Conventionally, it is thought that cross-plane thermal conductivities (kappa z) are low, and therefore c-axis phonon mean free paths (MFPs) are small. Here, we measure kappa z across MoS2 films of varying thickness (20-240 nm) and uncover evidence of very long c-axis phonon MFPs at room temperature in these layered semiconductors. Experimental data obtained using time-domain thermoreflectance (TDTR) are in good agreement with first-principles density functional theory (DFT). These calculations suggest that 50% of the heat is carried by phonons with MFP > 200 nm, exceeding kinetic theory estimates by nearly 2 orders of magnitude. Because of quasi-ballistic effects, the kappa z of nanometer-thin films of MoS2 scales with theirthickness and the volumetric thermal resistance asymptotes to a nonzero value, 10 m2 K GW-1. This contributes as much as 30% to the total thermal resistance of a 20 nm thick film, the rest being limited by thermal interface resistance with the SiO2 substrate and top-side aluminum transducer. These findings are essential for understanding heat flow across nanometer-thin films of MoS2 for optoelectronic and thermoelectric applications.

    View details for PubMedID 30808167

  • Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Jung, K., Kharangate, C. R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E. 2019; 130: 1108–19
  • Publisher Correction: An electrochemical thermal transistor. Nature communications Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C. J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K. E. 2019; 10 (1): 4465

    Abstract

    An amendment to this paper has been published and can be accessed via a link at the top of the paper.

    View details for DOI 10.1038/s41467-019-12471-4

    View details for PubMedID 31562331

  • A Compact 50-kW Traction Inverter Design Using Off-the-Shelf Components Alizadeh, R., Adamson, T., Balda, J., Zhao, Y., Asheghi, M., Goodson, K. E., IEEE IEEE. 2019: 2614–19
  • Optical and electrical properties of phase change materials for high-speed optoelectronics Burrow, J. A., Guo, P., Sevison, G. A., Kwon, H., Perez, C., Asheghi, M., Hendrickson, J. R., Sarangan, A., Goodson, K. E., Agha, I., IEEE IEEE. 2019
  • A method for quantifying in plane permeability of porous thin films JOURNAL OF COLLOID AND INTERFACE SCIENCE Rong, G., Palko, J. W., Oyarzun, D. I., Zhang, C., Hammerle, J., Asheghi, M., Goodson, K. E., Santiago, J. G. 2018; 530: 667–74
  • An electrochemical thermal transistor. Nature communications Sood, A., Xiong, F., Chen, S., Wang, H., Selli, D., Zhang, J., McClellan, C. J., Sun, J., Donadio, D., Cui, Y., Pop, E., Goodson, K. E. 2018; 9 (1): 4510

    Abstract

    The ability to actively regulate heat flow at the nanoscale could be a game changer for applications in thermal management and energy harvesting. Such a breakthrough could also enable the control of heat flow using thermal circuits, in a manner analogous to electronic circuits. Here we demonstrate switchable thermal transistors with an order of magnitude thermal on/off ratio, based on reversible electrochemical lithium intercalation in MoS2 thin films. We use spatially-resolved time-domain thermoreflectance to map the lithium ion distribution during device operation, and atomic force microscopy to show that the lithiated state correlates with increased thickness and surface roughness. First principles calculations reveal that the thermal conductance modulation is due to phonon scattering by lithium rattler modes, c-axis strain, and stacking disorder. This study lays the foundation for electrochemically-driven nanoscale thermal regulators, and establishes thermal metrology as a useful probe of spatio-temporal intercalant dynamics in nanomaterials.

    View details for PubMedID 30375375

  • Improving the performance of Ge2Sb2Te5 materials via nickel doping: Towards RF-compatible phase-change devices APPLIED PHYSICS LETTERS Guo, P., Burrow, J. A., Sevison, G. A., Sood, A., Asheghi, M., Hendrickson, J. R., Goodson, K. E., Agha, I., Sarangan, A. 2018; 113 (17)

    View details for DOI 10.1063/1.5053713

    View details for Web of Science ID 000449145700019

  • Optimizing the design of composite phase change materials for high thermal power density JOURNAL OF APPLIED PHYSICS Barako, M. T., Lingamneni, S., Katz, J. S., Liu, T., Goodson, K. E., Tice, J. 2018; 124 (14)

    View details for DOI 10.1063/1.5031914

    View details for Web of Science ID 000447148100020

  • Tailoring Permeability of Microporous Copper Structures through Template Sintering ACS APPLIED MATERIALS & INTERFACES Zhang, C., Palko, J. W., Rong, G., Pringle, K. S., Barako, M. T., Dusseault, T. J., Asheghi, M., Santiago, J. G., Goodson, K. E. 2018; 10 (36): 30487–94
  • Phonon Scattering in Silicon by Multiple Morphological Defects: A Multiscale Analysis JOURNAL OF ELECTRONIC MATERIALS Lorenzi, B., Dettori, R., Dunham, M. T., Melis, C., Tonini, R., Colombo, L., Sood, A., Goodson, K. E., Narducci, D. 2018; 47 (9): 5148–57
  • Tailoring Permeability of Microporous Copper Structures through Template Sintering. ACS applied materials & interfaces Zhang, C., Palko, J. W., Rong, G., Pringle, K. S., Barako, M. T., Dusseault, T. J., Asheghi, M., Santiago, J. G., Goodson, K. E. 2018

    Abstract

    Microporous metals are used extensively for applications that combine convective and conductive transport and benefit from low resistance to both modes of transport. Conventional fabrication methods, such as direct sintering of metallic particles, however, often produce structures with limited fluid transport properties due to the lack of control over pore morphologies such as the pore size and porosity. Here, we demonstrate control and improvement of hydraulic permeability of microporous copper structures fabricated using template-assisted electrodeposition. Template sintering is shown to modify the fluid transport network in a manner that increases permeability by nearly an order of magnitude with a less significant decrease (38%) in thermal conductivity. The measured permeabilities range from 4.8 * 10-14 to 1.3 * 10-12 m2 with 5 mum pores, with the peak value being roughly 5 times larger than the published values for sintered copper particles of comparable feature sizes. Analysis indicates that the enhancement of permeability is limited by constrictions, i.e., bottlenecks between connecting pores, whose dimensions are highly sensitive to the sintering conditions. We further show contrasting trends in permeability versus conductivity of the electrodeposited microporous copper and conventional sintered copper particles and suggest these differing trends to be the result of their inverse structural relationship.

    View details for PubMedID 30096232

  • Impact of thermally dead volume on phonon conduction along silicon nanoladders NANOSCALE Park, W., Sohn, J., Romano, G., Kodama, T., Sood, A., Katz, J. S., Kim, B. Y., So, H., Ahn, E. C., Asheghi, M., Kolpak, A. M., Goodson, K. E. 2018; 10 (23): 11117–22

    View details for DOI 10.1039/c8nr01788c

    View details for Web of Science ID 000435358600035

  • Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale Park, W., Sohn, J., Romano, G., Kodama, T., Sood, A., Katz, J. S., Kim, B. S., So, H., Ahn, E. C., Asheghi, M., Kolpak, A. M., Goodson, K. E. 2018

    Abstract

    Thermal conduction in complex periodic nanostructures remains a key area of open questions and research, and a particularly provocative and challenging detail is the impact of nanoscale material volumes that do not lie along the optimal line of sight for conduction. Here, we experimentally study thermal transport in silicon nanoladders, which feature two orthogonal heat conduction paths: unobstructed line-of-sight channels in the axial direction and interconnecting bridges between them. The nanoladders feature an array of rectangular holes in a 10 mum long straight beam with a 970 nm wide and 75 nm thick cross-section. We vary the pitch of these holes from 200 nm to 1100 nm to modulate the contribution of bridges to the net transport of heat in the axial direction. The effective thermal conductivity, corresponding to reduced heat flux, decreases from 45 W m-1 K-1 to 31 W m-1 K-1 with decreasing pitch. By solving the Boltzmann transport equation using phonon mean free paths taken from ab initio calculations, we model thermal transport in the nanoladders, and experimental results show excellent agreement with the predictions to within 11%. A combination of experiments and calculations shows that with decreasing pitch, thermal transport in nanoladders approaches the counterpart in a straight beam equivalent to the line-of-sight channels, indicating that the bridges constitute a thermally dead volume. This study suggests that ballistic effects are dictated by the line-of-sight channels, providing key insights into thermal conduction in nanostructured metamaterials.

    View details for PubMedID 29873370

  • Experimental Characterization of Microfabricated Thermoelectric Energy Harvesters for Smart Sensor and Wearable Applications ADVANCED MATERIALS TECHNOLOGIES Dunham, M. T., Barako, M. T., Cornett, J. E., Gao, Y., Haidar, S., Sun, N., Asheghi, M., Chen, B., Goodson, K. E. 2018; 3 (6)
  • Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries NANO LETTERS Sood, A., Cheaito, R., Bai, T., Kwon, H., Wang, Y., Li, C., Yates, L., Bougher, T., Graham, S., Asheghi, M., Goorsky, M., Goodson, K. E. 2018; 18 (6): 3466–72
  • Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop JOURNAL OF ELECTRONIC PACKAGING Kharangate, C. R., Jung, K., Jung, S., Kong, D., Schaadt, J., Iyengar, M., Malone, C., Lee, H., Asheghi, M., Goodson, K. E. 2018; 140 (2)

    View details for DOI 10.1115/1.4039475

    View details for Web of Science ID 000432367100009

  • Enhanced Heat Transfer Using Microporous Copper Inverse Opals Lee, H., Maitra, T., Palko, J., Kong, D., Zhang, C., Barako, M. T., Won, Y., Asheghi, M., Goodson, K. E. ASME. 2018

    View details for DOI 10.1115/1.4040088

    View details for Web of Science ID 000432367100007

  • A method for quantifying in plane permeability of porous thin films. Journal of colloid and interface science Rong, G., Palko, J. W., Oyarzun, D. I., Zhang, C., Hammerle, J., Asheghi, M., Goodson, K. E., Santiago, J. G. 2018; 530: 667–74

    Abstract

    The in-plane permeability of porous thin films is an important fluid mechanical property that determines wicking and pressure-driven flow behavior in such materials. This property has so far been challenging to measure directly due to the small sidewall cross-sectional area of thin films available for flow. In this work, we propose and experimentally demonstrate a novel technique for directly measuring in-plane permeability of porous thin films of arbitrary thicknesses, in situ, using a manifold pressed to the top surface of the film. We both measure and simulate the influence of the two dimensional flow field produced in a film by the manifold and extract the permeability from measurements of pressure drop at fixed flow rates. Permeability values measured using the technique for a periodic array of channels are comparable to theoretical predictions. We also determine in-plane permeability of arrays of pillars and electrodeposited porous copper films. This technique is a robust tool to characterize permeability of thin films of arbitrary thicknesses on a variety of substrates. In Supplementary material, we provide a solid model, which is useful in three-dimensional printer reproductions of our device.

    View details for PubMedID 30007196

  • Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano letters Sood, A., Cheaito, R., Bai, T., Kwon, H., Wang, Y., Li, C., Yates, L., Bougher, T., Graham, S., Asheghi, M., Goorsky, M., Goodson, K. E. 2018

    Abstract

    Understanding the impact of lattice imperfections on nanoscale thermal transport is crucial for diverse applications ranging from thermal management to energy conversion. Grain boundaries (GBs) are ubiquitous defects in polycrystalline materials, which scatter phonons and reduce thermal conductivity (kappa). Historically, their impact on heat conduction has been studied indirectly through spatially averaged measurements, that provide little information about phonon transport near a single GB. Here, using spatially resolved time-domain thermoreflectance (TDTR) measurements in combination with electron backscatter diffraction (EBSD), we make localized measurements of kappa within few mum of individual GBs in boron-doped polycrystalline diamond. We observe strongly suppressed thermal transport near GBs, a reduction in kappa from 1000 W m-1 K-1 at the center of large grains to 400 W m-1 K-1 in the immediate vicinity of GBs. Furthermore, we show that this reduction in kappa is measured up to 10 mum away from a GB. A theoretical model is proposed that captures the local reduction in phonon mean-free-paths due to strongly diffuse phonon scattering at the disordered grain boundaries. Our results provide a new framework for understanding phonon-defect interactions in nanomaterials, with implications for the use of high-kappa polycrystalline materials as heat sinks in electronics thermal management.

    View details for PubMedID 29631399

  • Porous micropillar structures for retaining low surface tension liquids JOURNAL OF COLLOID AND INTERFACE SCIENCE Agonafer, D. D., Lee, H., Vasquez, P. A., Won, Y., Jung, K., Lingamneni, S., Ma, B., Shan, L., Shuai, S., Du, Z., Maitra, T., Palko, J. W., Goodson, K. E. 2018; 514: 316–27

    Abstract

    The ability to manipulate fluid interfaces, e.g., to retain liquid behind or within porous structures, can be beneficial in multiple applications, including microfluidics, biochemical analysis, and the thermal management of electronic systems. While there are a variety of strategies for controlling the disposition of liquid water via capillarity, such as the use of chemically modified porous adhesive structures and capillary stop valves or surface geometric features, methods that work well for low surface tension liquids are far more difficult to implement. This study demonstrates the microfabrication of a silicon membrane that can retain exceptionally low surface tension fluorinated liquids against a significant pressure difference across the membrane via an array of porous micropillar structures. The membrane uses capillary forces along the triple phase contact line to maintain stable liquid menisci that yield positive working Laplace pressures. The micropillars have inner diameters and thicknesses of 1.5-3 μm and ∼1 μm, respectively, sustaining Laplace pressures up to 39 kPa for water and 9 kPa for Fluorinert™ (FC-40). A theoretical model for predicting the change in pressure as the liquid advances along the porous micropillar structure is derived based on a free energy analysis of the liquid meniscus with capped spherical geometry. The theoretical prediction was found to overestimate the burst pressure compared with the experimental measurements. To elucidate this deviation, transient numerical simulations based on the Volume of Fluid (VOF) were performed to explore the liquid pressure and evolution of meniscus shape under different flow rates (i.e., Capillary numbers). The results from VOF simulations reveal strong dynamic effects where the anisotropic expansion of liquid along the outer micropillar edge leads to an irregular meniscus shape before the liquid spills along the micropillar edge. These findings suggest that the analytical prediction of burst Laplace pressure obtained under quasi-static condition (i.e., equilibrium thermodynamic analysis under low capillary number) is not applicable to highly dynamic flow conditions, where the liquid meniscus shape deformation by flow perturbation cannot be restored by surface tension force instantaneously. Therefore, the critical burst pressure is dependent on the liquid velocity and viscosity under dynamic flow conditions. A numerical simulation using Surface Evolver also predicts that surface defects along the outer micropillar edge can yield up to 50% lower Laplace pressures than those predicted with ideal feature geometries. The liquid retention strategy developed here can facilitate the routing and phase management of dielectric working fluids for application in heat exchangers. Further improvements in the retention performance can be realized by optimizing the fabrication process to reduce surface defects.

    View details for PubMedID 29275250

  • Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide THIN SOLID FILMS Barako, M. T., English, T. S., Roy-Panzer, S., Kenny, T. W., Goodson, K. E. 2018; 649: 24–29
  • Anti-Hermitian photodetector facilitating efficient subwavelength photon sorting NATURE COMMUNICATIONS Kim, S., Kang, J., Mutlu, M., Park, J., Park, W., Goodson, K. E., Sinclair, R., Fan, S., Kik, P. G., Brongersma, M. L. 2018; 9: 316

    Abstract

    The ability to split an incident light beam into separate wavelength bands is central to a diverse set of optical applications, including imaging, biosensing, communication, photocatalysis, and photovoltaics. Entirely new opportunities are currently emerging with the recently demonstrated possibility to spectrally split light at a subwavelength scale with optical antennas. Unfortunately, such small structures offer limited spectral control and are hard to exploit in optoelectronic devices. Here, we overcome both challenges and demonstrate how within a single-layer metafilm one can laterally sort photons of different wavelengths below the free-space diffraction limit and extract a useful photocurrent. This chipscale demonstration of anti-Hermitian coupling between resonant photodetector elements also facilitates near-unity photon-sorting efficiencies, near-unity absorption, and a narrow spectral response (∼ 30 nm) for the different wavelength channels. This work opens up entirely new design paradigms for image sensors and energy harvesting systems in which the active elements both sort and detect photons.

    View details for PubMedID 29358626

  • Thermal Management Research - from Power Electronics to Portables Jung, K., Zhang, C., Liu, T., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 17–18
  • Busbar Design for Distributed DC-Link Capacitor Banks for Traction Applications Alizadeh, R., Schupbach, M., Adamson, T., Balda, J., Zhao, Y., Long, S., Jung, K. W., Kharangate, C., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 4810–15
  • Highly Anisotropic Thermal Conductivity in Spin-Cast Polystyrene Nano-Films Katz, J. S., Barako, M. T., Park, W., Sood, A., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 477–81
  • The Heat Conduction Renaissance Sood, A., Pop, E., Asheghi, M., Goodson, K. E., IEEE IEEE. 2018: 1396–1402
  • Modular Heat Sink for Chip-Scale GaN Transistors in Multilevel Converters Pallo, N., Kharangate, C., Modeer, T., Schaadt, J., Asheghi, M., Goodson, K., Pilawa-Podgurski, R., IEEE IEEE. 2018: 2798–2805
  • THERMAL EFFECTS OF OVENIZED CLOCKS ON EPISEAL ENCAPSULATED INERTIAL MEASUREMENT UNITS Ortiz, L., Flader, I. B., Vukasin, G. D., Gerrard, D. D., Chandorkar, S. A., Rodriguez, J., Shin, D. D., Kwon, R., Heinz, D. B., Chen, Y., Park, W., Goodson, K. E., Kenny, T. W., IEEE IEEE. 2018: 980–83
  • HIGH STABILITY THERMAL ACCELEROMETER BASED ON ULTRATHIN PLATINUM ALD NANOSTRUCTURES Everhart, C. M., Kaplan, K. E., Winterkorn, M. M., Kwon, H., Provine, J., Asheghi, M., Goodson, K. E., Prinz, F. B., Kenny, T. W., IEEE IEEE. 2018: 976–79
  • Temperature-Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry ACS APPLIED MATERIALS & INTERFACES Yalon, E., Aslan, O., Smithe, K. H., McClellan, C. J., Suryavanshi, S. V., Xiong, F., Sood, A., Neumann, C. M., Xu, X., Goodson, K. E., Heinz, T. F., Pop, E. 2017; 9 (49): 43013–20
  • Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials ACS APPLIED MATERIALS & INTERFACES Barako, M. T., Isaacson, S. G., Lian, F., Pop, E., Dauskardt, R. H., Goodson, K. E., Tice, J. 2017; 9 (48): 42067–74
  • Thermal Conduction across Metal-Dielectric Sidewall Interfaces ACS APPLIED MATERIALS & INTERFACES Park, W., Kodama, T., Park, J., Cho, J., Sood, A., Barako, M. T., Asheghi, M., Goodson, K. E. 2017; 9 (35): 30100–30106

    Abstract

    The heat flow at the interfaces of complex nanostructures is three-dimensional in part due to the nonplanarity of interfaces. One example common in nanosystems is the situation when a significant fraction of the interfacial area is composed of sidewalls that are perpendicular to the principal plane, for example, in metallization structures for complementary metal-oxide semiconductor transistors. It is often observed that such sidewall interfaces contain significantly higher levels of microstructural disorder, which impedes energy carrier transport and leads to effective increases in interfacial resistance. The impact of these sidewall interfaces needs to be explored in greater depth for practical device engineering, and a related problem is that appropriate characterization techniques are not available. Here, we develop a novel electrothermal method and an intricate microfabricated structure to extract the thermal resistance of a sidewall interface between aluminum and silicon dioxide using suspended nanograting structures. The thermal resistance of the sidewall interface is measured to be ∼16 ± 5 m2 K GW-1, which is twice as large as the equivalent horizontal planar interface comprising the same materials in the experimental sample. The rough sidewall interfaces are observed using transmission electron micrographs, which may be more extensive than at interfaces in the substrate plan in the same nanostructure. A model based on a two-dimensional sinusoidal surface estimates the impact of the roughness on thermal resistance to be ∼2 m2 K GW-1. The large disparity between the model predictions and the experiments is attributed to the incomplete contact at the Al-SiO2 sidewall interfaces, inferred by observation of underetching of the silicon substrate below the sidewall opening. This study suggests that sidewall interfaces must be considered separately from planar interfaces in thermal analysis for nanostructured systems.

    View details for DOI 10.1021/acsami.7b06567

    View details for Web of Science ID 000410597500076

    View details for PubMedID 28786284

  • Phonon conduction in silicon nanobeams APPLIED PHYSICS LETTERS Park, W., Shin, D. D., Kim, S., Katz, J. S., Park, J., Ahn, C., Kodama, T., Asheghi, M., Kenny, T. W., Goodson, K. E. 2017; 110 (21)

    View details for DOI 10.1063/1.4983790

    View details for Web of Science ID 000402320000033

  • Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices JOURNAL OF ELECTRONIC MATERIALS Cornett, J., Chen, B., Haidar, S., Berney, H., McGuinness, P., Lane, B., Gao, Y., He, Y., Sun, N., Dunham, M., Asheghi, M., Goodson, K., Yuan, Y., Najafi, K. 2017; 46 (5): 2844-2846
  • Phonon conduction in GaN-diamond composite substrates JOURNAL OF APPLIED PHYSICS Cho, J., Francis, D., Altman, D. H., Asheghi, M., Goodson, K. E. 2017; 121 (5)

    View details for DOI 10.1063/1.4975468

    View details for Web of Science ID 000394345700039

  • COPPER INVERSE OPAL SURFACES FOR ENHANCED BOILING HEAT TRANSFER Lee, H., Maitra, T., Palko, J., Zhang, C., Barako, M., Won, Y., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2017
  • Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific reports Park, W., Romano, G., Ahn, E. C., Kodama, T., Park, J., Barako, M. T., Sohn, J., Kim, S. J., Cho, J., Marconnet, A. M., Asheghi, M., Kolpak, A. M., Goodson, K. E. 2017; 7 (1): 6233

    Abstract

    Here we study single-crystalline silicon nanobeams having 470 nm width and 80 nm thickness cross section, where we produce tortuous thermal paths (i.e. labyrinths) by introducing slits to control the impact of the unobstructed "line-of-sight" (LOS) between the heat source and heat sink. The labyrinths range from straight nanobeams with a complete LOS along the entire length to nanobeams in which the LOS ranges from partially to entirely blocked by introducing slits, s = 95, 195, 245, 295 and 395 nm. The measured thermal conductivity of the samples decreases monotonically from ~47 W m-1 K-1 for straight beam to ~31 W m-1 K-1 for slit width of 395 nm. A model prediction through a combination of the Boltzmann transport equation and ab initio calculations shows an excellent agreement with the experimental data to within ~8%. The model prediction for the most tortuous path (s = 395 nm) is reduced by ~14% compared to a straight beam of equivalent cross section. This study suggests that LOS is an important metric for characterizing and interpreting phonon propagation in nanostructures.

    View details for PubMedID 28740212

  • Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials. ACS applied materials & interfaces Barako, M. T., Isaacson, S. G., Lian, F., Pop, E., Dauskardt, R. H., Goodson, K. E., Tice, J. 2017; 9 (48): 42067–74

    Abstract

    Thermal interface materials (TIMs) are essential for managing heat in modern electronics, and nanocomposite TIMs can offer critical improvements. Here, we demonstrate thermally conductive, mechanically compliant TIMs based on dense, vertically aligned copper nanowires (CuNWs) embedded into polymer matrices. We evaluate the thermal and mechanical characteristics of 20-25% dense CuNW arrays with and without polydimethylsiloxane infiltration. The thermal resistance achieved is below 5 mm2 K W-1, over an order of magnitude lower than commercial heat sink compounds. Nanoindentation reveals that the nonlinear deformation mechanics of this TIM are influenced by both the CuNW morphology and the polymer matrix. We also implement a flip-chip bonding protocol to directly attach CuNW composites to copper surfaces, as required in many thermal architectures. Thus, we demonstrate a rational design strategy for nanocomposite TIMs that simultaneously retain the high thermal conductivity of aligned CuNWs and the mechanical compliance of a polymer.

    View details for PubMedID 29119783

  • Enhanced Thermal Conduction Through Nanostructured Interfaces NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Park, W., Sood, A., Park, J., Asheghi, M., Sinclair, R., Goodson, K. E. 2017; 21 (3): 134–44
  • MICRO-TETHERING FOR IN-PROCESS STICTION MITIGATION OF HIGHLY COMPLIANT STRUCTURES Flader, I. B., Chen, Y., Shin, D. D., Heinz, D. B., Ortiz, L., Alter, A. L., Park, W., Goodson, K. E., Kenny, T. W., IEEE IEEE. 2017: 675–78
  • Thermal Conductivity Measurements on Suspended Diamond Membranes Using Picosecond and Femtosecond Time-Domain Thermoreflectance Cheaito, R., Sood, A., Yates, L., Bougher, T. L., Cheng, Z., Asheghi, M., Graham, S., Goodson, K., IEEE IEEE. 2017: 706–10
  • INVESTIGATION OF THE HETEROGENEOUS THERMAL CONDUCTIVITY IN BULK CVD DIAMOND FOR USE IN ELECTRONICS THERMAL MANAGEMENT Yates, L., Cheaito, R., Sood, A., Cheng, Z., Bougher, T., Asheghi, M., Goodson, K., Goorsky, M., Faili, F., Twitchen, D., Graham, S., ASME AMER SOC MECHANICAL ENGINEERS. 2017
  • Experimental Considerations of CVD Diamond Film Measurements using Time Domain Thermoreflectance Bougher, T. L., Yates, L., Cheng, Z., Cola, B. A., Graham, S., Chaeito, R., Sood, A., Ashegi, M., Goodson, K. E., IEEE IEEE. 2017: 30–38
  • THERMAL CONDUCTIVITY MEASUREMENT OF IN(0.10)GA(0.90)AS(0.96)N(0.04) THIN FILM Jan, A., Cheaito, R., Goodson, K. E., Clemens, B. M., ASME AMER SOC MECHANICAL ENGINEERS. 2017
  • Thermal Modeling of Single-phase and Two-phase 2D-chip Cooling using Microchannels Kharangate, C. R., Lee, H., Liu, T., Jung, K., Iyengar, M. K., Malone, C., Asheghi, M., Goodson, K. E., IEEE IEEE. 2017: 300–306
  • Microchannel Cooling Strategies for High Heat Flux (1 kW/cm(2)) Power Electronic Applications Jung, K., Kharangate, C. R., Lee, H., Palko, J., Zhou, F., Asheghi, M., Dede, E. M., Goodson, K. E., IEEE IEEE. 2017: 98–104
  • Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films APPLIED PHYSICS LETTERS Dunham, M. T., Lorenzi, B., Andrews, S. C., Sood, A., Asheghi, M., Narducci, D., Goodson, K. E. 2016; 109 (25)

    View details for DOI 10.1063/1.4972483

    View details for Web of Science ID 000391857200028

  • Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction JOURNAL OF APPLIED PHYSICS Fong, S. W., Sood, A., Chen, L., Kumari, N., Asheghi, M., Goodson, K. E., Gibson, G. A., Wong, H. P. 2016; 120 (1)

    View details for DOI 10.1063/1.4955165

    View details for Web of Science ID 000379583900022

  • Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond JOURNAL OF APPLIED PHYSICS Sood, A., Cho, J., Hobart, K. D., Feygelson, T. I., Pate, B. B., Asheghi, M., Cahill, D. G., Goodson, K. E. 2016; 119 (17)

    View details for DOI 10.1063/1.4948335

    View details for Web of Science ID 000377716500028

  • Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance (vol 102, 111907, 2013) APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T. I., Pate, B. B., Hobart, K. D., Goodson, K. E. 2016; 108 (17)

    View details for DOI 10.1063/1.4948382

    View details for Web of Science ID 000375846600056

  • Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano letters Barako, M. T., Sood, A., Zhang, C., Wang, J., Kodama, T., Asheghi, M., Zheng, X., Braun, P. V., Goodson, K. E. 2016; 16 (4): 2754-2761

    Abstract

    Porous metals are used in interfacial transport applications that leverage the combination of electrical and/or thermal conductivity and the large available surface area. As nanomaterials push toward smaller pore sizes to increase the total surface area and reduce diffusion length scales, electron conduction within the metal scaffold becomes suppressed due to increased surface scattering. Here we observe the transition from diffusive to quasi-ballistic thermal conduction using metal inverse opals (IOs), which are metal films that contain a periodic arrangement of interconnected spherical pores. As the material dimensions are reduced from ∼230 nm to ∼23 nm, the thermal conductivity of copper IOs is reduced by more than 57% due to the increase in surface scattering. In contrast, nickel IOs exhibit diffusive-like conduction and have a constant thermal conductivity over this size regime. The quasi-ballistic nature of electron transport at these length scales is modeled considering the inverse opal geometry, surface scattering, and grain boundaries. Understanding the characteristics of electron conduction at the nanoscale is essential to minimizing the total resistance of porous metals for interfacial transport applications, such as the total electrical resistance of battery electrodes and the total thermal resistance of microscale heat exchangers.

    View details for DOI 10.1021/acs.nanolett.6b00468

    View details for PubMedID 26986050

  • Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices JOURNAL OF ELECTRONIC PACKAGING Lee, H., Agonafer, D. D., Won, Y., Houshmand, F., Gorle, C., Asheghi, M., Goodson, K. E. 2016; 138 (1)

    View details for DOI 10.1115/1.4032655

    View details for Web of Science ID 000372735400008

  • A Figure of Merit for Mobile Device Thermal Management Chiriac, V., Molloy, S., Anderson, J., Goodson, K., IEEE IEEE. 2016: 1393–97
  • Characterization of the Capillary Performance of Copper Inverse Opals Zhang, C., Lingamneni, S., Barako, M. T., Palko, J. W., Asheghi, M., Goodson, K. E., IEEE IEEE. 2016: 1035–39
  • Analytical Model of Graphene-Enabled Ultra-Low Power Phase Change Memory Alpert, A., Luo, R., Asheghi, M., Pop, E., Goodson, K., IEEE IEEE. 2016: 670–74
  • Analytical Modeling for Prediction of Chip Package-level Thermal Performance Liu, T., Iyengar, M., Malone, C., Goodson, K. E., IEEE IEEE. 2016: 254–61
  • Optimization of ybrid Wick Structures for Extreme Spreading in High Performance Vapor Chambers Liu, T., Lingamneni, S., Palko, J., Asheghi, M., Goodson, K. E., IEEE IEEE. 2016: 30–36
  • Characterization of the Thermal Conductivity of CVD Diamond for GaN-on-Diamond Devices Yates, L., Sood, A., Cheng, Z., Bougher, T., Malcom, K., Cho, J., Asheghi, M., Goodson, K., Goorsky, M., Faili, F., Twitchen, D. J., Graham, S., IEEE IEEE. 2016: 106–9
  • High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply Palko, J. W., Lee, H., Agonafer, D. D., Zhang, C., Jung, K., Moss, J., Wilbur, J. D., Dusseault, T. J., Barako, M. T., Houshmand, F., Rong, G., Maitra, T., Gorle, C., Won, Y., Rockosi, D., Mykyta, I., Resler, D., Altman, D., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2016: 1511–17
  • Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat APPLIED PHYSICS LETTERS Palko, J. W., Zhang, C., Wilbur, J. D., Dusseault, T. J., Asheghi, M., Goodson, K. E., Santiago, J. G. 2015; 107 (25)

    View details for DOI 10.1063/1.4938202

    View details for Web of Science ID 000368442100048

  • Power density optimization for micro thermoelectric generators ENERGY Dunham, M. T., Barako, M. T., LeBlanc, S., Asheghi, M., Chen, B., Goodson, K. E. 2015; 93: 2006-2017
  • Energy-Efficient Abundant-Data Computing: The N3XT 1,000x COMPUTER Aly, M. M., Gao, M., Hills, G., Lee, C., Pitner, G., Shulaker, M. M., Wu, T. F., Asheghi, M., Bokor, J., Franchetti, F., Goodson, K. E., Kozyrakis, C., Markov, I., Olukotun, K., Pileggi, L., Pop, E., Rabaey, J., Re, C., Wong, H. P., Mitra, S. 2015; 48 (12): 24-33
  • Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films JOURNAL OF MICROMECHANICS AND MICROENGINEERING Won, Y., Gao, Y., Guzman de Villoria, R., Wardle, B. L., Xiang, R., Maruyama, S., Kenny, T. W., Goodson, K. E. 2015; 25 (11)
  • Burst behavior at a capillary tip: Effect of low and high surface tension JOURNAL OF COLLOID AND INTERFACE SCIENCE Agonafer, D. D., Lopez, K., Palko, J. W., Won, Y., Santiago, J. G., Goodson, K. E. 2015; 455: 1-5

    Abstract

    Liquid retention in micron and millimeter scale devices is important for maintaining stable interfaces in various processes including bimolecular separation, phase change heat transfer, and water desalination. There have been several studies of re-entrant geometries, and very few studies on retaining low surface tension liquids such as fluorocarbon-based dielectric liquids. Here, we study retention of a liquid with very low contact angles using borosilicate glass capillary tips. We analyzed capillary tips with outer diameters ranging from 250 to 840μm and measured Laplace pressures up to 2.9kPa. Experimental results agree well with a numerical model that predicts burst pressure (the maximum Laplace pressure for liquid retention), which is a function of the outer diameter (D) and capillary exit edge radius of curvature (r).

    View details for DOI 10.1016/j.jcis.2015.05.033

    View details for Web of Science ID 000357544700001

    View details for PubMedID 26046980

  • Professor Issam Mudawar on his 60th birthday INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Bernardin, J., Chiaramonte, F., Dhir, V., Galloway, J., Goodson, K., Incropera, F., Kabov, O., Kaviany, M., Kazimi, M., Khusid, B., Kim, J., Kim, S., Lee, J., Minkowycz, W. J., Qu, W., Rose, J., Sammakia, B., Stephan, P., Vafai, K., Wen, C. 2015; 89: A1–A3
  • Energy-Efficient Phase-Change Memory with Graphene as a Thermal Barrier NANO LETTERS Ahn, C., Fong, S. W., Kim, Y., Lee, S., Sood, A., Neumann, C. M., Ashegh, M., Goodson, K. E., Pop, E., Wong, H. P. 2015; 15 (10): 6809-6814
  • Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. ACS applied materials & interfaces Barako, M. T., Roy-Panzer, S., English, T. S., Kodama, T., Asheghi, M., Kenny, T. W., Goodson, K. E. 2015; 7 (34): 19251-19259

    Abstract

    The ability to efficiently and reliably transfer heat between sources and sinks is often a bottleneck in the thermal management of modern energy conversion technologies ranging from microelectronics to thermoelectric power generation. These interfaces contribute parasitic thermal resistances that reduce device performance and are subjected to thermomechanical stresses that degrade device lifetime. Dense arrays of vertically aligned metal nanowires (NWs) offer the unique combination of thermal conductance from the constituent metal and mechanical compliance from the high aspect ratio geometry to increase interfacial heat transfer and device reliability. In the present work, we synthesize copper NW arrays directly onto substrates via templated electrodeposition and extend this technique through the use of a sacrificial overplating layer to achieve improved uniformity. Furthermore, we infiltrate the array with an organic phase change material and demonstrate the preservation of thermal properties. We use the 3ω method to measure the axial thermal conductivity of freestanding copper NW arrays to be as high as 70 W m(-1) K(-1), which is more than an order of magnitude larger than most commercial interface materials and enhanced-conductivity nanocomposites reported in the literature. These arrays are highly anisotropic, and the lateral thermal conductivity is found to be only 1-2 W m(-1) K(-1). We use these measured properties to elucidate the governing array-scale transport mechanisms, which include the effects of morphology and energy carrier scattering from size effects and grain boundaries.

    View details for DOI 10.1021/acsami.5b05147

    View details for PubMedID 26284489

  • Cross-Plane Phonon Conduction in Polycrystalline Silicon Films JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cho, J., Francis, D., Chao, P. C., Asheghi, M., Goodson, K. E. 2015; 137 (7)

    View details for DOI 10.1115/1.4029820

    View details for Web of Science ID 000357585200003

  • Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K. E. 2015; 5 (6): 737-744
  • Evaluating Broader Impacts of Nanoscale Thermal Transport Research NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Shi, L., Dames, C., Lukes, J. R., Reddy, P., Duda, J., Cahill, D. G., Lee, J., Marconnet, A., Goodson, K. E., Bahk, J., Shakouri, A., Prasher, R. S., Felts, J., King, W. P., Han, B., Bischof, J. C. 2015; 19 (2): 127-165
  • Thermal characterization and analysis of microliter liquid volumes using the three-omega method. Review of scientific instruments Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E. 2015; 86 (2): 024901-?

    Abstract

    Thermal phenomena in many biological systems offer an alternative detection opportunity for quantifying relevant sample properties. While there is substantial prior work on thermal characterization methods for fluids, the push in the biology and biomedical research communities towards analysis of reduced sample volumes drives a need to extend and scale these techniques to these volumes of interest, which can be below 100 pl. This work applies the 3ω technique to measure the temperature-dependent thermal conductivity and heat capacity of de-ionized water, silicone oil, and salt buffer solution droplets from 24 to 80 °C. Heater geometries range in length from 200 to 700 μm and in width from 2 to 5 μm to accommodate the size restrictions imposed by small volume droplets. We use these devices to measure droplet volumes of 2 μl and demonstrate the potential to extend this technique down to pl droplet volumes based on an analysis of the thermally probed volume. Sensitivity and uncertainty analyses provide guidance for relevant design variables for characterizing properties of interest by investigating the tradeoffs between measurement frequency regime, device geometry, and substrate material. Experimental results show that we can extract thermal conductivity and heat capacity with these sample volumes to within less than 1% of thermal properties reported in the literature.

    View details for DOI 10.1063/1.4907353

    View details for PubMedID 25725871

  • Thermal characterization and analysis of microliter liquid volumes using the three-omega method. Review of scientific instruments Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E. 2015; 86 (2): 024901-?

    Abstract

    Thermal phenomena in many biological systems offer an alternative detection opportunity for quantifying relevant sample properties. While there is substantial prior work on thermal characterization methods for fluids, the push in the biology and biomedical research communities towards analysis of reduced sample volumes drives a need to extend and scale these techniques to these volumes of interest, which can be below 100 pl. This work applies the 3ω technique to measure the temperature-dependent thermal conductivity and heat capacity of de-ionized water, silicone oil, and salt buffer solution droplets from 24 to 80 °C. Heater geometries range in length from 200 to 700 μm and in width from 2 to 5 μm to accommodate the size restrictions imposed by small volume droplets. We use these devices to measure droplet volumes of 2 μl and demonstrate the potential to extend this technique down to pl droplet volumes based on an analysis of the thermally probed volume. Sensitivity and uncertainty analyses provide guidance for relevant design variables for characterizing properties of interest by investigating the tradeoffs between measurement frequency regime, device geometry, and substrate material. Experimental results show that we can extract thermal conductivity and heat capacity with these sample volumes to within less than 1% of thermal properties reported in the literature.

    View details for DOI 10.1063/1.4907353

    View details for PubMedID 25725871

  • NUMERICAL OPTIMIZATION OF ADVANCED MONOLITHIC MICROCOOLERS FOR HIGH HEAT FLUX MICROELECTRONICS Scholl, S., Gorlet, C., Houshmand, F., Asheghi, M., Goodson, K., Verstraete, T., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • Chip-Scale Thermal Energy Harvester Using Bi2Te3 Cornett, J., Lane, B., Dunham, M., Asheghi, M., Goodson, K., Gao, Y., Sun, N., Chen, B., IEEE IEEE. 2015: 3326–29
  • Tailoring of permeability in copper inverse opal for electronic cooling applications Zhang, C., Rong, G., Palko, J. W., Dusseault, T. J., Asheghi, M., Santiago, J. G., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • FULL SCALE SIMULATION OF AN INTEGRATED MONOLITHIC HEAT SINK FOR THERMAL MANAGEMENT OF A HIGH POWER DENSITY GAN-SIC CHIP Liu, T., Houshmand, F., Gorle, C., Scholl, S., Lee, H., Won, Y., Asheghi, M., Goodson, K., Kazemi, H., Vanhille, K., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • NUMERICAL SIMULATION OF ADVANCED MONOLITHIC MICROCOOLER DESIGNS FOR HIGH HEAT FLUX MICROELECTRONICS Scholl, S., Gorle, C., Houshmand, F., Liu, T., Lee, H., Won, Y., Asheghi, M., Goodson, K., Kazemi, H., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • COMPUTATIONAL MODELING OF EXTREME HEAT FLUX MICROCOOLER FOR GaN-BASED HEMT Lee, H., Won, Y., Houshmand, F., Gorlel, C., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • INDUCTIVE COUPLED PLASMA ETCHING OF HIGH ASPECT RATIO SILICON CARBIDE MICROCHANNELS FOR LOCALIZED COOLING Dowling, K. M., Suria, A. J., Won, Y., Shankar, A., Lee, H., Asheghi, M., Goodson, K. E., Senesky, D. G., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • HIGH HEAT FLUX SUBCOOLED FLOW BOILING OF METHANOL IN MICROTUBES Houshmand, F., Lee, H., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • VALIDATION STUDY FOR VOF SIMULATIONS OF BOILING IN A MICROCHANNEL Gorle, C., Lee, H., Houshmand, F., Asheghi, M., Goodson, K., Parida, P. R., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • ON-CHIP OVENIZATION OF ENCAPSULATED DISK RESONATOR GYROSCOPE (DRG) Ahn, C. H., Hong, V. A., Park, W., Yang, Y., Chen, Y., Ng, E. J., Huynh, J., Challoner, A. D., Goodson, K. E., Kenny, T. W., IEEE IEEE. 2015: 39–42
  • THERMAL DESIGN OF A HIERARCHICAL RADIALLY EXPANDING CAVITY FOR TWO-PHASE COOLING OF INTEGRATED CIRCUITS Sridhar, A., Ong, C., Paredes, S., Michel, B., Brunschwiler, T., Parida, P., Colgan, E., Chainer, T., Gorle, C., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2015
  • Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Barako, M. T., Gao, Y., Won, Y., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2014; 4 (12): 1906-1913
  • Reply to the 'comment on "$ per W metrics for thermoelectric power generation: beyond ZT"' by G. Nunes, Jr, Energy Environ. Sci., 2014, 7, DOI: 10.1039/C3EE43700K ENERGY & ENVIRONMENTAL SCIENCE Yee, S. K., LeBlanc, S., Goodson, K. E., Dames, C. 2014; 7 (10): 3441–42

    View details for DOI 10.1039/c4ee01119h

    View details for Web of Science ID 000342884300029

  • Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs APPLIED PHYSICS LETTERS Sood, A., Rowlette, J. A., Caneau, C. G., Bozorg-Grayeli, E., Asheghi, M., Goodson, K. E. 2014; 105 (5)

    View details for DOI 10.1063/1.4892575

    View details for Web of Science ID 000341153000028

  • Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano letters Jeyasingh, R., Fong, S. W., Lee, J., Li, Z., Chang, K., Mantegazza, D., Asheghi, M., Goodson, K. E., Wong, H. P. 2014; 14 (6): 3419-3426

    Abstract

    Phase change materials are widely considered for application in nonvolatile memories because of their ability to achieve phase transformation in the nanosecond time scale. However, the knowledge of fast crystallization dynamics in these materials is limited because of the lack of fast and accurate temperature control methods. In this work, we have developed an experimental methodology that enables ultrafast characterization of phase-change dynamics on a more technologically relevant melt-quenched amorphous phase using practical device structures. We have extracted the crystallization growth velocity (U) in a functional capped phase change memory (PCM) device over 8 orders of magnitude (10(-10) < U < 10(-1) m/s) spanning a wide temperature range (415 < T < 580 K). We also observed direct evidence of non-Arrhenius crystallization behavior in programmed PCM devices at very high heating rates (>10(8) K/s), which reveals the extreme fragility of Ge2Sb2Te5 in its supercooled liquid phase. Furthermore, these crystallization properties were studied as a function of device programming cycles, and the results show degradation in the cell retention properties due to elemental segregation. The above experiments are enabled by the use of an on-chip fast heater and thermometer called as microthermal stage (MTS) integrated with a vertical phase change memory (PCM) cell. The temperature at the PCM layer can be controlled up to 600 K using MTS and with a thermal time constant of 800 ns, leading to heating rates ∼10(8) K/s that are close to the typical device operating conditions during PCM programming. The MTS allows us to independently control the electrical and thermal aspects of phase transformation (inseparable in a conventional PCM cell) and extract the temperature dependence of key material properties in real PCM devices.

    View details for DOI 10.1021/nl500940z

    View details for PubMedID 24798660

  • Material and manufacturing cost considerations for thermoelectrics RENEWABLE & SUSTAINABLE ENERGY REVIEWS LeBlanc, S., Yee, S. K., Scullin, M. L., Dames, C., Goodson, K. E. 2014; 32: 313-327
  • Analysis of Oxide (Al2O3, CuO, and ZnO) and CNT Nanoparticles Disaggregation Effect on the Thermal Conductivity and the Viscosity of Nanofluids INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING Lee, J., Yoon, Y., Eaton, J. K., Goodson, K. E., Bai, S. J. 2014; 15 (4): 703-710
  • Nanoscale thermal transport. II. 2003-2012 APPLIED PHYSICS REVIEWS Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., Maris, H. J., Phillpot, S. R., Pop, E., Shi, L. 2014; 1 (1)

    View details for DOI 10.1063/1.4832615

    View details for Web of Science ID 000334098500010

  • Nanoscale Thermal Transport Applied Physics Reviews Cahill, D., G., Braun, P., V., Chen, G., Clarke, D., R., Goodson, K., E., Keblinski, P. 2014; 1: 011305
  • Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates Cho, J., Won, Y., Francis, D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014
  • Analysis and Characterization of Thermal Transport in GaN HEMTs on Diamond Substrates Altman, D., Tyhach, M., McClymonds, J., Kim, S., Graham, S., Cho, J., Goodson, K., Francis, D., Faili, F., Ejeckam, F., Bernstein, S., IEEE IEEE. 2014: 1199–1205
  • Characterization of Phase-Change Layer Thermal Properties Using a Micro-Thermal Stage Fong, S. W., Jeyasingh, R., Asheghi, M., Goodson, K. E., Wong, H. P., IEEE IEEE. 2014: 744–49
  • Thermal Characterization of Nanostructured Superlattices of TiN/TaN: Applications as Electrodes in Phase Change Memory Sood, A., Eryilmaz, S., Jeyasingh, R., Cho, J., Asheghi, M., Wong, H., Goodson, K. E., IEEE IEEE. 2014: 765–70
  • Inverse Opals for Fluid Delivery in Electronics Cooling Systems Dusseault, T. J., Gires, J., Barako, M. T., Won, Y., Agonafer, D. D., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2014: 750–55
  • Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-glass Capillaries Agonafer, D. D., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2014: 306–16
  • Progress on Phase Separation Microfluidics Agonafer, D. D., Palko, J., Won, Y., Lopez, K., Dusseault, T., Gires, J., Asheghi, M., Santiago, J. G., Goodson, K. E., IEEE IEEE. 2014
  • Anisotropic and Nonhomogeneous Thermal Conduction in 1 mu m Thick CVD Diamond Sood, A., Cho, J., Hobart, K. D., Feygelson, T., Pate, B., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 1192–98
  • TOWARDS THERMAL CHARACTERIZATION OF PICO-LITER VOLUMES USING THE 3OMEGA METHOD Roy, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2014
  • 3D Packaging Materials based on Graphite Nanoplatelet and Aluminum Nitride Nanocomposites Lingamneni, S., Marconnet, A. M., Goodson, K. E., ASME AMER SOC MECHANICAL ENGINEERS. 2014
  • MODELING AND OPTIMIZATION OF SMALL THERMOELECTRIC GENERATORS FOR LOW-POWER ELECTRONICS Dunham, M. T., Barako, M. T., LeBlanc, S., Asheghi-Roudheni, M., Chen, B., Goodson, K., ASME AMER SOC MECHANICAL ENGINEERS. 2014
  • Mechanical and Thermal Properties of Copper Inverse Opals for Two-Phase Convection Enhancement Won, Y., Barako, M. T., Agonafer, D. D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 326–32
  • Phonon Thermal Conduction in Periodically Porous Silicon Nanobeams Park, W., Marconnet, A. M., Kodama, T., Park, J., Sinclair, R., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 637–40
  • Thermal Conduction in Nanoporous Copper Inverse Opal Films Barako, M. T., Weisse, J. M., Roy, S., Kodama, T., Dusseault, T. J., Motoyama, M., Asheghi, M., Prinz, F. B., Zheng, X., Goodson, K. E., IEEE IEEE. 2014: 736–43
  • A Parametric Study of Microporous Metal Matrix-Phase Change Material Composite Heat Spreaders for Transient Thermal Applications Lingamneni, S., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 870–75
  • Thermal Conduction Normal to Thin Silicon Nitride Films on Diamond and GaN Cho, J., Chu, K. K., Chao, P. C., McGray, C., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 1186–91
  • Next Generation Gallium Nitride HEMTs Enabled by Diamond Substrates Tyhach, M., Altman, D., Bernstein, S., Korenstein, R., Francis, D., Faili, F., Ejeckam, F., Cho, J., Goodson, K. E., Kim, S., Graham, S., IEEE IEEE. 2014
  • Microfluidic Heat Exchangers for High Power Density GaN on SiC Won, Y., Houshmand, F., Agonafer, D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014
  • PHONON CONDUCTION NORMAL TO POLYSILICON FILMS ON DIAMOND 4th ASME International Conference on Micro/Nanoscale Heat and Mass Transfer Cho, J., Chao, P. C., Asheghi, M., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2014
  • Cross Plane Thermal Conductance of Graphene-Metal Interfaces Guzman, P., Sood, A., Mleczko, M. J., Wang, B., Wong, H., Nishi, Y., Asheghi, M., Goodson, K. E., IEEE IEEE. 2014: 1385–89
  • Phonon Scattering in Strained Transition Layers for GaN Heteroepitaxy Physical Review B Cho, j., Li, Y., Hoke, W., Altman, D., Asheghi, M., Goodson, K. E. 2014; 89: 11
  • Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA Won, Y., Gao, Y., Panzer, M. A., Xiang, R., Maruyama, S., Kenny, T. W., Cai, W., Goodson, K. E. 2013; 110 (51): 20426-20430

    Abstract

    Reliably routing heat to and from conversion materials is a daunting challenge for a variety of innovative energy technologies--from thermal solar to automotive waste heat recovery systems--whose efficiencies degrade due to massive thermomechanical stresses at interfaces. This problem may soon be addressed by adhesives based on vertically aligned carbon nanotubes, which promise the revolutionary combination of high through-plane thermal conductivity and vanishing in-plane mechanical stiffness. Here, we report the data for the in-plane modulus of aligned single-walled carbon nanotube films using a microfabricated resonator method. Molecular simulations and electron microscopy identify the nanoscale mechanisms responsible for this property. The zipping and unzipping of adjacent nanotubes and the degree of alignment and entanglement are shown to govern the spatially varying local modulus, thereby providing the route to engineered materials with outstanding combinations of mechanical and thermal properties.

    View details for DOI 10.1073/pnas.1312253110

    View details for Web of Science ID 000328548600031

    View details for PubMedID 24309375

    View details for PubMedCentralID PMC3870663

  • $ per W metrics for thermoelectric power generation: beyond ZT ENERGY & ENVIRONMENTAL SCIENCE Yee, S. K., LeBlanc, S., Goodson, K. E., Dames, C. 2013; 6 (9): 2561-2571

    View details for DOI 10.1039/c3ee41504j

    View details for Web of Science ID 000323198100001

  • High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices JOURNAL OF ELECTRONIC PACKAGING Touzelbaev, M. N., Miler, J., Yang, Y., Refai-Ahmed, G., Goodson, K. E. 2013; 135 (3)

    View details for DOI 10.1115/1.4024747

    View details for Web of Science ID 000326095800010

  • Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Gao, Y., Marconnet, A. M., Xiang, R., Maruyama, S., Goodson, K. E. 2013; 3 (9): 1524-1532
  • Thermal conduction phenomena in carbon nanotubes and related nanostructured materials REVIEWS OF MODERN PHYSICS Marconnet, A. M., Panzer, M. A., Goodson, K. E. 2013; 85 (3): 1295-1326
  • From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 135 (6)

    View details for DOI 10.1115/1.4023577

    View details for Web of Science ID 000326165000012

  • Phonon and electron transport through Ge2Sb2Te5 films and interfaces bounded by metals APPLIED PHYSICS LETTERS Lee, J., Bozorg-Grayeli, E., Kim, S., Asheghi, M., Wong, H. P., Goodson, K. E. 2013; 102 (19)

    View details for DOI 10.1063/1.4807141

    View details for Web of Science ID 000320440800035

  • Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T. I., Pate, B. B., Hobart, K., Goodson, K. E. 2013; 102 (11)

    View details for DOI 10.1063/1.4796168

    View details for Web of Science ID 000316544900032

  • Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module JOURNAL OF ELECTRONIC MATERIALS Barako, M. T., Park, W., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 42 (3): 372-381
  • Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E. 2013; 3 (1): 79-85
  • Cooling Limits for GaN HEMT Technology Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K. E., IEEE IEEE. 2013
  • A S/W Metric for Thermoelectric Power Generation: Beyond ZT Energy & Environmental Science Yee, S., Leblanc, S., Goodson, K., E., Dames, C. 2013; 6: 2561-2571
  • Electrothermal Modeling and Design Strategies for Multibit Phase-Change Memory IEEE TRANSACTIONS ON ELECTRON DEVICES Li, Z., Jeyasingh, R. G., Lee, J., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 59 (12): 3561-3567
  • Phonon Conduction in Periodically Porous Silicon Nanobridges NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Marconnet, A. M., Kodama, T., Asheghi, M., Goodson, K. E. 2012; 16 (4): 199-219
  • Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics JOURNAL OF APPLIED PHYSICS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2012; 112 (8)

    View details for DOI 10.1063/1.4759450

    View details for Web of Science ID 000310597500020

  • Thermal conductivity in porous silicon nanowire arrays NANOSCALE RESEARCH LETTERS Weisse, J. M., Marconnet, A. M., Kim, D. R., Rao, P. M., Panzer, M. A., Goodson, K. E., Zheng, X. 2012; 7

    Abstract

    The nanoscale features in silicon nanowires (SiNWs) can suppress phonon propagation and strongly reduce their thermal conductivities compared to the bulk value. This work measures the thermal conductivity along the axial direction of SiNW arrays with varying nanowire diameters, doping concentrations, surface roughness, and internal porosities using nanosecond transient thermoreflectance. For SiNWs with diameters larger than the phonon mean free path, porosity substantially reduces the thermal conductivity, yielding thermal conductivities as low as 1 W/m/K in highly porous SiNWs. However, when the SiNW diameter is below the phonon mean free path, both the internal porosity and the diameter significantly contribute to phonon scattering and lead to reduced thermal conductivity of the SiNWs.

    View details for DOI 10.1186/1556-276X-7-554

    View details for Web of Science ID 000311320400001

    View details for PubMedID 23039084

    View details for PubMedCentralID PMC3494563

  • Nanoscale Manipulation, Heating, and Welding of Nanowires JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME LeBlanc, S., Swartzentruber, B., Martinez, J., Christoforo, G., Kodama, T., Goodson, K. E. 2012; 134 (8)
  • Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films CARBON Gao, Y., Kodama, T., Won, Y., Dogbe, S., Pan, L., Goodson, K. E. 2012; 50 (10): 3789-3798
  • Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness JOURNAL OF APPLIED PHYSICS Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E. 2012; 112 (1)

    View details for DOI 10.1063/1.4731252

    View details for Web of Science ID 000306513400151

  • Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm NANO LETTERS Li, Z., Tan, S., Bozorg-Grayeli, E., Kodama, T., Asheghi, M., Delgado, G., Panzer, M., Pokrovsky, A., Wack, D., Goodson, K. E. 2012; 12 (6): 3121-3126

    Abstract

    Thermal conduction in periodic multilayer composites can be strongly influenced by nonequilibrium electron-phonon scattering for periods shorter than the relevant free paths. Here we argue that two additional mechanisms-quasiballistic phonon transport normal to the metal film and inelastic electron-interface scattering-can also impact conduction in metal/dielectric multilayers with a period below 10 nm. Measurements use the 3ω method with six different bridge widths down to 50 nm to extract the in- and cross-plane effective conductivities of Mo/Si (2.8 nm/4.1 nm) multilayers, yielding 15.4 and 1.2 W/mK, respectively. The cross-plane thermal resistance is lower than can be predicted considering volume and interface scattering but is consistent with a new model built around a film-normal length scale for phonon-electron energy conversion in the metal. We introduce a criterion for the transition from electron to phonon dominated heat conduction in metal films bounded by dielectrics.

    View details for DOI 10.1021/nl300996r

    View details for Web of Science ID 000305106400078

    View details for PubMedID 22563928

  • Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling NANOTECHNOLOGY Lee, J., Asheghi, M., Goodson, K. E. 2012; 23 (20)

    Abstract

    The coupled transport of heat and electrical current, or thermoelectric phenomena, can strongly influence the temperature distribution and figures of merit for phase-change memory (PCM). This paper simulates PCM devices with careful attention to thermoelectric transport and the resulting impact on programming current during the reset operation. The electrothermal simulations consider Thomson heating within the phase-change material and Peltier heating at the electrode interface. Using representative values for the Thomson and Seebeck coefficients extracted from our past measurements of these properties, we predict a cell temperature increase of 44% and a decrease in the programming current of 16%. Scaling arguments indicate that the impact of thermoelectric phenomena becomes greater with smaller dimensions due to enhanced thermal confinement. This work estimates the scaling of this reduction in programming current as electrode contact areas are reduced down to 10 nm × 10 nm. Precise understanding of thermoelectric phenomena and their impact on device performance is a critical part of PCM design strategies.

    View details for DOI 10.1088/0957-4484/23/20/205201

    View details for PubMedID 22543873

  • Electrothermal phenomena in zinc oxide nanowires and contacts APPLIED PHYSICS LETTERS LeBlanc, S., Phadke, S., Kodama, T., Salleo, A., Goodson, K. E. 2012; 100 (16)

    View details for DOI 10.1063/1.4703935

    View details for Web of Science ID 000303128500048

  • Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness APPLIED PHYSICS LETTERS Won, Y., Lee, J., Asheghi, M., Kenny, T. W., Goodson, K. E. 2012; 100 (16)

    View details for DOI 10.1063/1.3699227

    View details for Web of Science ID 000303128500018

  • Low Thermal Resistances at GaN-SiC Interfaces for HEMT Technology IEEE ELECTRON DEVICE LETTERS Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., Goodson, K. E. 2012; 33 (3): 378-380
  • Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory JAPANESE JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, F., Goodson, K. E., Wong, H. P. 2012; 51 (2)
  • Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Lee, J., Kim, S., Marconnet, A., in't Zandt, M. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 21 (1): 4-6
  • Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators CARBON Won, Y., Gao, Y., Panzer, M. A., Dogbe, S., Pan, L., Kenny, T. W., Goodson, K. E. 2012; 50 (2): 347-355
  • Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness NANO LETTERS Yoneoka, S., Lee, J., Liger, M., Yama, G., Kodama, T., Gunji, M., Provine, J., Howe, R. T., Goodson, K. E., Kennyt, T. W. 2012; 12 (2): 683-686

    Abstract

    While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.

    View details for DOI 10.1021/nl203548w

    View details for PubMedID 22224582

  • Thermal conductivity and photoluminescence of light-emitting silicon nitride films APPLIED PHYSICS LETTERS Marconnet, A., Panzer, M., Yerci, S., Minissale, S., Wang, X., Zhang, X., Dal Negro, L., Goodson, K. E. 2012; 100 (5)

    View details for DOI 10.1063/1.3682508

    View details for Web of Science ID 000300065300023

  • Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness Journal of Applied Physics Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K., E. 2012; 112: 014902
  • High temperature thermal properties of thin tantalum nitride films APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2011; 99 (26)

    View details for DOI 10.1063/1.3672098

    View details for Web of Science ID 000298638500022

  • Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, G. A., Goodson, K. E., Wong, H. P. 2011; 110 (11)

    View details for DOI 10.1063/1.3667295

    View details for Web of Science ID 000298254800159

  • Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER David, M. P., Miler, J., Steinbrenner, J. E., Yang, Y., Touzelbaev, M., Goodson, K. E. 2011; 54 (25-26): 5504-5516
  • Adiabatic and diabatic two-phase venting flow in a microchannel INTERNATIONAL JOURNAL OF MULTIPHASE FLOW David, M. P., Steinbrenner, J. E., Miler, J., Goodson, K. E. 2011; 37 (9): 1135-1146
  • Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials IEEE ELECTRON DEVICE LETTERS Bozorg-Grayeli, E., Reifenberg, J. P., Panzer, M. A., Rowlette, J. A., Goodson, K. E. 2011; 32 (9): 1281-1283
  • Microthermal Stage for Electrothermal Characterization of Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H. P., Goodson, K. E. 2011; 32 (7): 952-954
  • Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Li, Z., Lee, J., Reifenberg, J. P., Asheghi, M., Jeyasingh, R. G., Wong, H. P., Goodson, K. E. 2011; 32 (7): 961-963
  • Impact of channel geometry on two-phase flow in fuel cell microchannels JOURNAL OF POWER SOURCES Steinbrenner, J. E., Lee, E. S., Hidrovo, C. H., Eaton, J. K., Goodson, K. E. 2011; 196 (11): 5012-5020
  • Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density ACS NANO Marconnett, A. M., Yamamoto, N., Panzer, M. A., Wardle, B. L., Goodson, K. E. 2011; 5 (6): 4818-4825

    Abstract

    Nanostructured composites containing aligned carbon nanotubes (CNTs) are very promising as interface materials for electronic systems and thermoelectric power generators. We report the first data for the thermal conductivity of densified, aligned multiwall CNT nanocomposite films for a range of CNT volume fractions. A 1 vol % CNT composite more than doubles the thermal conductivity of the base polymer. Denser arrays (17 vol % CNTs) enhance the thermal conductivity by as much as a factor of 18 and there is a nonlinear trend with CNT volume fraction. This article discusses the impact of CNT density on thermal conduction considering boundary resistances, increased defect concentrations, and the possibility of suppressed phonon modes in the CNTs.

    View details for DOI 10.1021/nn200847u

    View details for Web of Science ID 000292055200065

  • Thermal microdevices for biological and biomedical applications JOURNAL OF THERMAL BIOLOGY Jain, A., Goodson, K. E. 2011; 36 (4): 209-218
  • Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films JOURNAL OF APPLIED PHYSICS Lee, J., Li, Z., Reifenberg, J. P., Lee, S., Sinclair, R., Asheghi, M., Goodson, K. E. 2011; 109 (8)

    View details for DOI 10.1063/1.3573505

    View details for Web of Science ID 000290047000229

  • Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage IEEE TRANSACTIONS ON ELECTRON DEVICES Kim, S., Lee, B., Asheghi, M., Hurkx, F., Reifenberg, J. P., Goodson, K. E., Wong, H. P. 2011; 58 (3): 584-592
  • 3-D visualization of flow in microscale jet impingement systems INTERNATIONAL JOURNAL OF THERMAL SCIENCES Won, Y., Wang, E. N., Goodson, K. E., Kenny, T. W. 2011; 50 (3): 325-331
  • Thermal resistance between low-dimensional nanostructures and semi-infinite media (vol 103, 094301, 2008) JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2011; 109 (5)

    View details for DOI 10.1063/1.3558984

    View details for Web of Science ID 000288387900131

  • Temperature-dependent aggregation and diffusion in nanofluids INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Gharagozloo, P. E., Goodson, K. E. 2011; 54 (4): 797-806
  • Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory IEEE Electron Device Letters Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H.S., P., Goodson, K., E. 2011; 32: 952-954
  • Characterizing Responses to Open-ended Questions In Heat Transfer Based on Everyday Situations Parikh, S. E., Sheppard, S., Goodson, K. E., ASEE AMER SOC ENGINEERING EDUCATION. 2011
  • Phase Change Memory PROCEEDINGS OF THE IEEE Wong, H. P., Raoux, S., Kim, S., Liang, J., Reifenberg, J. P., Rajendran, B., Asheghi, M., Goodson, K. E. 2010; 98 (12): 2201-2227
  • Aggregate fractal dimensions and thermal conduction in nanofluids JOURNAL OF APPLIED PHYSICS Gharagozloo, P. E., Goodson, K. E. 2010; 108 (7)

    View details for DOI 10.1063/1.3481423

    View details for Web of Science ID 000283222200125

  • Characterization of the wettability of thin nanostructured films in the presence of evaporation JOURNAL OF COLLOID AND INTERFACE SCIENCE Rogacs, A., Steinbrenner, J. E., Rowlette, J. A., Weisse, J. M., Zheng, X. L., Goodson, K. E. 2010; 349 (1): 354-360

    Abstract

    Vapor chambers using conventional porous membrane wicks offer limited heat transfer rates for a given thickness. This limitation can be addressed through wick nanostructuring, which promises high capillary pressures and precise control of the local porosity. This work develops a measurement technique for the wettability of nanostructured wicks based on optical imaging. Feasibility is demonstrated on a hydrophilic silicon nanowire array (SiNW) synthesized using the Vapor-Liquid-Solid (VLS) growth mechanism followed by surface plasma treatment. The wettability is determined by comparing the time-dependent liquid interface rise with a model that accounts for capillary, viscous, and gravitational forces and for evaporation. This model is demonstrated to be useful in extracting internal contact angle from thin ( approximately 10microm) porous films.

    View details for DOI 10.1016/j.jcis.2010.05.063

    View details for Web of Science ID 000279966700045

    View details for PubMedID 20579656

  • Nanofluid Convection in Microtubes JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Lee, J., Gharagozloo, P. E., Kolade, B., Eaton, J. K., Goodson, K. E. 2010; 132 (9)

    View details for DOI 10.1115/1.4001637

    View details for Web of Science ID 000279992300016

  • Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., David, M., Wang, F., Goodson, K. E. 2010; 36 (8): 608-619
  • Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films NANO LETTERS Panzer, M. A., Duong, H. M., Okawa, J., Shiomi, J., Wardle, B. L., Maruyama, S., Goodson, K. E. 2010; 10 (7): 2395-2400

    Abstract

    Interfaces dominate the thermal resistances in aligned carbon nanotube arrays. This work uses nanosecond thermoreflectance thermometry to separate interface and volume resistances for 10 microm thick aligned SWNT films coated with Al, Ti, Pd, Pt, and Ni. We interpret the data by defining the nanotube-metal engagement factor, which governs the interface resistance and is extracted using the measured film heat capacity. The metal-SWNT and SWNT-substrate resistances range between 3.8 and 9.2 mm(2)K/W and 33-46 mm(2)K/W, respectively. The temperature dependency of the heat capacity data, measured between 125 and 300 K, is in good agreement with theoretical predictions. The temperature dependence demonstrated by the metal-SWNT interface resistance data suggests inelastic phonon transmission.

    View details for DOI 10.1021/nl100443x

    View details for Web of Science ID 000280416200017

    View details for PubMedID 20503983

  • Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels JOURNAL OF MICROMECHANICS AND MICROENGINEERING Fang, C., Steinbrenner, J. E., Wang, F., Goodson, K. E. 2010; 20 (4)
  • Thermal Boundary Resistance Measurements for Phase-Change Memory Devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Chang, K., Panzer, M. A., Kim, S., Rowlette, J. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2010; 31 (1): 56-58
  • VOLUME OF FLUID SIMULATION OF BOILING TWO-PHASE FLOW IN A VAPOR-VENTING MICROCHANNEL FRONTIERS IN HEAT AND MASS TRANSFER Fang, C., David, M., Rogacs, A., Goodson, K. 2010; 1 (1)
  • SUPERIOR THERMAL INTERFACES MADE BY METALLICALLY ANCHORED CARBON NANOTUBE ARRAYS ASME InterPack Conference Hu, X., Pan, L. S., Gu, G., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2010: 597–603
  • Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel Frontiers of Heat and Mass Transfer Fang, C., David, M., Rogacs, A., Goodson, K., E. 2010; 1: 013002
  • Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform SENSORS AND ACTUATORS B-CHEMICAL Jain, A., Ness, K., Goodson, K. E. 2009; 143 (1): 286-294
  • Bubble-Induced Water Hammer and Cavitation in Microchannel Flow Boiling JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Fogg, D. W., Goodson, K. E. 2009; 131 (12)

    View details for DOI 10.1115/1.3216381

    View details for Web of Science ID 000271905600007

  • Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films IEEE ELECTRON DEVICE LETTERS Panzer, M. A., Shandalov, M., Rowlette, J. A., Oshima, Y., Chen, Y. W., McIntyre, P. C., Goodson, K. E. 2009; 30 (12): 1269-1271
  • A benchmark study on the thermal conductivity of nanofluids JOURNAL OF APPLIED PHYSICS Buongiorno, J., Venerus, D. C., Prabhat, N., McKrell, T., Townsend, J., Christianson, R., Tolmachev, Y. V., Keblinski, P., Hu, L., Alvarado, J. L., Bang, I. C., Bishnoi, S. W., Bonetti, M., Botz, F., Cecere, A., Chang, Y., Chen, G., Chen, H., Chung, S. J., Chyu, M. K., Das, S. K., Di Paola, R., Ding, Y., Dubois, F., Dzido, G., Eapen, J., Escher, W., Funfschilling, D., Galand, Q., Gao, J., Gharagozloo, P. E., Goodson, K. E., Gutierrez, J. G., Hong, H., Horton, M., Hwang, K. S., Iorio, C. S., Jang, S. P., Jarzebski, A. B., Jiang, Y., Jin, L., Kabelac, S., Kamath, A., Kedzierski, M. A., Kieng, L. G., Kim, C., Kim, J., Kim, S., Lee, S. H., Leong, K. C., Manna, I., Michel, B., Ni, R., Patel, H. E., Philip, J., Poulikakos, D., Reynaud, C., Savino, R., Singh, P. K., Song, P., Sundararajan, T., Timofeeva, E., Tritcak, T., Turanov, A. N., Van Vaerenbergh, S., Wen, D., Witharana, S., Yang, C., Yeh, W., Zhao, X., Zhou, S. 2009; 106 (9)

    View details for DOI 10.1063/1.3245330

    View details for Web of Science ID 000272555700090

  • Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films PHYSICAL REVIEW B Rowlette, J. A., Kekatpure, R. D., Panzer, M. A., Brongersma, M. L., Goodson, K. E. 2009; 80 (4)
  • Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance IEEE TRANSACTIONS ON ADVANCED PACKAGING Pettes, A. M., Hodes, M. S., Goodson, K. E. 2009; 32 (2): 423-430
  • Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Kolade, B., Goodson, K. E., Eaton, J. K. 2009; 131 (5)

    View details for DOI 10.1115/1.3013831

    View details for Web of Science ID 000264374400011

  • Heat Conduction through a DNA-Gold Composite NANO LETTERS Kodama, T., Jain, A., Goodson, K. E. 2009; 9 (5): 2005-2009

    Abstract

    This paper reports results from electrical and thermal conduction measurements carried out on the DNA-gold composite for which the overall conduction is shown to be dominated by the DNA rather than the discontinuous gold coatings. The electrical and thermal conductivities of the composite were about 14 S/cm and 150 W/(m K) at room temperature, respectively. The resulting value of 3.6 x 10(-4) W ohms/K(2) for the Lorentz number indicates that thermal transport in the DNA is phonon-dominated and that the molecular vibrations play a key role in both electrical and thermal conduction processes of DNA molecules.

    View details for DOI 10.1021/nl900272m

    View details for Web of Science ID 000266157100049

    View details for PubMedID 19435380

  • Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling EXPERIMENTS IN FLUIDS Fogg, D., David, M., Goodson, K. E. 2009; 46 (4): 725-736
  • Multimode thermoelastic dissipation JOURNAL OF APPLIED PHYSICS Chandorkar, S. A., Candler, R. N., Duwel, A., Melamud, R., Agarwal, M., Goodson, K. E., Kenny, T. W. 2009; 105 (4)

    View details for DOI 10.1063/1.3072682

    View details for Web of Science ID 000263803300018

  • FLOW REGIME EVOLUTION IN LONG, SERPENTINE MICROCHANNELS WITH A POROUS CARBON PAPER WALL ASME International Mechanical Engineering Congress and Exposition Steinbrenner, J. E., Lee, E. S., Wang, F., Fang, C., Hidrovo, C. H., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2009: 773–781
  • Active Microfluidic Cooling of Integrated Circuits INTEGRATED INTERCONNECT TECHNOLOGIES FOR 3D NANOELECTRONIC SYSTEMS Hidrovo, C. H., Goodson, K. E., Bakir, M. S., Meindl, J. D. 2009: 293–330
  • THERMOELECTRIC HEAT RECOVERY FROM A TANKLESS WATER HEATING SYSTEM ASME International Mechanical Engineering Congress and Exposition LeBlanc, S. A., Gao, Y., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2009: 131–137
  • Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films 10th Annual Non-Volatile Memory Technology Symposium Lee, J., Reifenberg, J. P., Li, Z., Hom, L., Asheghi, M., Kim, S., Wong, H. P., Goodson, K. E. IEEE. 2009: 52–57
  • Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3 omega method INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW Oh, D., Jain, A., Eaton, J. K., Goodson, K. E., Lee, J. S. 2008; 29 (5): 1456-1461
  • Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3 omega method JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Jain, A., Goodson, K. E. 2008; 130 (10)

    View details for DOI 10.1115/1.2945904

    View details for Web of Science ID 000259854000011

  • The impact of thermal boundary resistance in phase-change memory devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Kencke, D. L., Goodson, K. E. 2008; 29 (10): 1112-1114
  • Diffusion, aggregation, and the thermal conductivity of nanofluids APPLIED PHYSICS LETTERS Gharagozloo, P. E., Eaton, J. K., Goodson, K. E. 2008; 93 (10)

    View details for DOI 10.1063/1.2977868

    View details for Web of Science ID 000259797000084

  • Investigation of the natural convection boundary condition in microfabricated structures INTERNATIONAL JOURNAL OF THERMAL SCIENCES Hu, X. J., Jain, A., Goodson, K. E. 2008; 47 (7): 820-824
  • 3-D numerical simulation of contact angle hysteresis for microscale two phase flow INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., Hidrovo, C., Wang, F., Eaton, J., Goodson, K. E. 2008; 34 (7): 690-705
  • Thermal resistance between low-dimensional nanostructures and semi-infinite media JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2008; 103 (9)

    View details for DOI 10.1063/1.2903519

    View details for Web of Science ID 000255983200119

  • Thermal properties of metal-coated vertically aligned single-wall nanotube arrays JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Panzer, M. A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., Goodson, K. E. 2008; 130 (5)

    View details for DOI 10.1115/1.2885159

    View details for Web of Science ID 000255880300006

  • Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs IEEE TRANSACTIONS ON ELECTRON DEVICES Rowlette, J. A., Goodson, K. E. 2008; 55 (1): 220-232
  • Thermomechanical formation of nanoscale polymer indents with a heated silicon tip JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME King, W. P., Goodson, K. E. 2007; 129 (11): 1600-1604

    View details for DOI 10.1115/1.2764088

    View details for Web of Science ID 000251725700015

  • Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films APPLIED PHYSICS LETTERS Reifenberg, J. P., Panzer, M. A., Kim, S., Gibby, A. M., Zhang, Y., Wong, S., Wong, H. P., Pop, E., Goodson, K. E. 2007; 91 (11)

    View details for DOI 10.1063/1.2784169

    View details for Web of Science ID 000249474000022

  • Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates JOURNAL OF APPLIED PHYSICS Pop, E., Mann, D. A., Goodson, K. E., Dai, H. 2007; 101 (9)

    View details for DOI 10.1063/1.2717855

    View details for Web of Science ID 000246567900049

  • Materials science. Ordering up the minimum thermal conductivity of solids. Science Goodson, K. E. 2007; 315 (5810): 342-343

    View details for PubMedID 17234938

  • Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays ASME Journal of Heat Transfer Hu, X., Panzer, M., A., Goodson, K., E. 2007; 129: 91-93
  • Non-equilibrium phonon distributions in sub-100 nm silicon transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sinha, S., Pop, E., DUTTON, R. W., Goodson, K. E. 2006; 128 (7): 638-647

    View details for DOI 10.1115/1.2194041

    View details for Web of Science ID 000239047600003

  • A hybrid method for bubble geometry reconstruction in two-phase microchannels EXPERIMENTS IN FLUIDS Wang, E. N., Devasenathipathy, S., Lin, H., Hidrovo, C. H., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2006; 40 (6): 847-858
  • Two-phase microfluidics for semiconductor circuits and fuel cells HEAT TRANSFER ENGINEERING Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, E., Steinbrenner, J. E., Koo, J. M., Wang, F. M., Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C. H., Kenny, T. W., Eaton, J. K., Goodson, K. E. 2006; 27 (4): 53-63
  • Thermal conductance of an individual single-wall carbon nanotube above room temperature NANO LETTERS Pop, E., Mann, D., Wang, Q., Goodson, K. E., Dai, H. J. 2006; 6 (1): 96-100

    Abstract

    The thermal properties of a suspended metallic single-wall carbon nanotube (SWNT) are extracted from its high-bias (I-V) electrical characteristics over the 300-800 K temperature range, achieved by Joule self-heating. The thermal conductance is approximately 2.4 nW/K, and the thermal conductivity is nearly 3500 Wm(-1)K(-1) at room temperature for a SWNT of length 2.6 mum and diameter 1.7 nm. A subtle decrease in thermal conductivity steeper than 1/T is observed at the upper end of the temperature range, which is attributed to second-order three-phonon scattering between two acoustic modes and one optical mode. We discuss sources of uncertainty and propose a simple analytical model for the SWNT thermal conductivity including length and temperature dependence.

    View details for DOI 10.1021/nl052145f

    View details for Web of Science ID 000235532400018

    View details for PubMedID 16402794

  • Electro-thermal transport in silicon and carbon nanotube devices 14th International Conference on Nonequilibrium Carrier Dynamics in Semiconductors Pop, E., Mann, D., ROWLETTE, J., Goodson, K., Dai, H. SPRINGER-VERLAG BERLIN. 2006: 195–199
  • Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes Journal of Physical Chemistry B Mann, D., Pop, E., Cao, J., Wang, Q., Goodson, K., E., Dai, H. 2006; 110: 1502-1505
  • 3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon ASME Journal of Heat Transfer Hu, X., Padilla, A., A., Xu, J., Fisher, T., A., Goodson, K., E. 2006; 128: 1109-1113
  • Scaling analysis of multilevel interconnect temperatures for high-performance ICs IEEE TRANSACTIONS ON ELECTRON DEVICES Im, S., Srivastava, N., Banerjee, K., Goodson, K. E. 2005; 52 (12): 2710-2719
  • Negative differential conductance and hot phonons in suspended nanotube molecular wires PHYSICAL REVIEW LETTERS Pop, E., Mann, D., Cao, J., Wang, Q., Goodson, K. E., Dai, H. J. 2005; 95 (15)

    Abstract

    Freely suspended metallic single-walled carbon nanotubes (SWNTs) exhibit reduced current carrying ability compared to those lying on substrates, and striking negative differential conductance at low electric fields. Theoretical analysis reveals significant self-heating effects including electron scattering by hot nonequilibrium optical phonons. Electron transport characteristics under strong self-heating are exploited for the first time to probe the thermal conductivity of individual SWNTs (approximately 3600 W m-1 K-1 at T=300 K) up to approximately 700 K, and reveal a 1/T dependence expected for umklapp phonon scattering at high temperatures.

    View details for DOI 10.1103/PhysRevLett.95.155505

    View details for Web of Science ID 000232443400039

    View details for PubMedID 16241738

  • Managing heat for electronics MATERIALS TODAY Schelling, P. K., Shi, L., Goodson, K. E. 2005; 8 (6): 30-35
  • Phase change phenomena in silicon microchannels INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Zhang, L. A., Wang, E. N., Goodson, K. E., Kenny, T. W. 2005; 48 (8): 1572-1582
  • Monte Carlo simulation of Joule heating in bulk and strained silicon APPLIED PHYSICS LETTERS Pop, E., DUTTON, R. W., Goodson, K. E. 2005; 86 (8)

    View details for DOI 10.1063/1.1870106

    View details for Web of Science ID 000227609000032

  • Scattering of g-process longitudinal optical phonons at hotspots in silicon JOURNAL OF APPLIED PHYSICS Sinha, S., Schelling, P. K., Phillpot, S. R., Goodson, K. E. 2005; 97 (2)

    View details for DOI 10.1063/1.1831549

    View details for Web of Science ID 000226700500049

  • Bond line thickness of thermal interface materials with carbon nanotubes ASME/Pacific Rim Technical Conference on Integration and Packaging of MEMS, NEMS, and Electronic Systems Singaravelu, S. A., Hu, X., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2005: 379–383
  • Thermal Conduction in Silicon Micro and Nanostructures Annual Review of Heat Transfer McConnell, A., D., Goodson, K., E. 2005; 14: 129-168
  • Managing Heat for Electronics Materials Today Shelling, P., Li, S., Goodson, K., E. 2005; 6: 30-35
  • Measurement of thermophysical properties of thin film shape memory alloys using the 3-omega method ASME International Mechanical Engineering Congress and Exposition Jain, A., Goodson, K. E. AMER SOC MECHANICAL ENGINEERS. 2005: 537–541
  • Review: Multiscale thermal modeling in nanoelectronics INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING Sinha, S., Goodson, K. E. 2005; 3 (1): 107-133
  • Micromachined jets for liquid impingement cooling of VLSI chips (vol 13, pg 833, 2004) JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (6): 1072-1072
  • Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion JOURNAL OF APPLIED PHYSICS Pop, E., DUTTON, R. W., Goodson, K. E. 2004; 96 (9): 4998-5005

    View details for DOI 10.1063/1.1788838

    View details for Web of Science ID 000224799300042

  • Micromachined jets for liquid impingement cooling of VLSI chips JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (5): 833-842
  • Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E. 2004; 85 (11): 2086-2088

    View details for DOI 10.1063/1.1787160

    View details for Web of Science ID 000223923300073

  • Nucleation and growth of vapor bubbles in a heated silicon microchannel JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Wang, E. N., Devasenathipathy, S., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2004; 126 (4): 497-497
  • Convectively driven polymerase chain reaction thermal cycler ANALYTICAL CHEMISTRY Wheeler, E. K., Benett, W., Stratton, P., Richards, J., Chen, A., Christian, A., Ness, K. D., Ortega, J., Li, L. G., Weisgraber, T. H., Goodson, K. E., Milanovich, F. 2004; 76 (14): 4011-4016

    Abstract

    We have fabricated a low-cost disposable polymerase chain reaction thermal chamber that uses buoyancy forces to move the sample solution between the different temperatures necessary for amplification. Three-dimensional, unsteady finite element modeling and a simpler 1-D steady-state model are used together with digital particle image velocimetry data to characterize the flow within the device. Biological samples have been amplified using this novel thermal chamber. Time for amplification is less than 30 min. More importantly, an analysis of the energy consumption shows significant improvements over current technology.

    View details for DOI 10.1021/ac034941g

    View details for Web of Science ID 000222706400018

    View details for PubMedID 15253636

  • Electro-kinetic microchannel cooling system for servers 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Upadhya, G., Zhou, P., Hom, J., Goodson, K., Munch, M. IEEE. 2004: 367–371
  • Electro-kinetic microchannel cooling system for desktop computers 20th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Zhou, P., Hom, J., Upadhya, G., Goodson, K., Munch, M. IEEE. 2004: 26–29
  • Thermal microscopy with a microfabricated solid immersion lens MICROSCALE THERMOPHYSICAL ENGINEERING Fletcher, D. A., Kino, G. S., Goodson, K. E. 2003; 7 (4): 267-273
  • Special Issue on emerging technologies - Foreword IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Amon, C. H., Goodson, K. E., Luo, G. Q. 2003; 26 (2): 307-308
  • Nanoscale thermal transport JOURNAL OF APPLIED PHYSICS Cahill, D. G., FORD, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., Phillpot, S. R. 2003; 93 (2): 793-818

    View details for DOI 10.1063/1.1524305

    View details for Web of Science ID 000180134200001

  • Detailed heat generation simulations via the Monte Carlo method IEEE International Conference on Simulation of Semiconductor Processes and Devices Pop, E., Dutton, R., Goodson, K. IEEE. 2003: 121–124
  • Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth ASME International Mechanical Engineering Congress Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K. AMER SOC MECHANICAL ENGINEERS. 2003: 251–257
  • Thermal conductivity model for nearly pure and doped thin silicon layers at high temperatures ASME International Mechanical Engineering Congress Asheghi, M., Goodson, K. E. PROFESSIONAL ENGINEERING PUBLISHING LTD. 2003: 847–853
  • Closed-loop cooling technologies for microprocessors IEEE International Electron Devices Meeting Upadhya, G., Zhou, P., Goodson, K., Munch, M., Kenny, T. IEEE. 2003: 775–778
  • Thermal analysis of ultra-thin body device scaling IEEE International Electron Devices Meeting Pop, E., Dutton, R., Goodson, K. IEEE. 2003: 883–886
  • Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation JOURNAL OF MICROELECTROMECHANICAL SYSTEMS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G. L., Despont, M., Durig, U. T., Rothuizen, H., Binnig, G., Vettiger, P. 2002; 11 (6): 765-774
  • Thermal conduction in doped single-crystal silicon films JOURNAL OF APPLIED PHYSICS Asheghi, M., Kurabayashi, K., Kasnavi, R., Goodson, K. E. 2002; 91 (8): 5079-5088

    View details for DOI 10.1063/1.1458057

    View details for Web of Science ID 000174666600047

  • Thermometry and thermal transport in micro/nanoscale solid-state devices and structures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cahill, D. G., Goodson, K. E., Majumdar, A. 2002; 124 (2): 223-241

    View details for DOI 10.1115/1.1454111

    View details for Web of Science ID 000175917200002

  • Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Zhang, L., Koo, J. M., Jiang, L., Asheghi, M., Goodson, K. E., Santiago, J. G., Kenny, T. W. 2002; 11 (1): 12-19
  • Modeling resist heating in mask fabrication using a multilayer Green's function approach. Conference on Metrology, Inspection, and Process Control for Microlithography XVI CHU, D. C., Pease, R. F., Goodson, K. E. SPIE-INT SOC OPTICAL ENGINEERING. 2002: 206–212
  • Electroosmotic Microchannel Cooling System for Microprocessors Electronics Cooling Goodson, K., E., Santiago, J., G., Kenny, T., Jiang, L., Zeng, S., Koo, J., M. 2002; 8: 46-47
  • Transient and sub-atmospheric performance of a closed-loop electroosmotic microchannel cooling system THERMES 2002 International Conference Jiang, L., Mikkelsen, J., Koo, J. M., Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., Kenny, T., Goodson, K. E., Maveety, J., Prasher, R., Benning, S. MILLPRESS SCIENCE PUBLISHERS. 2002: 133–139
  • Microfabricated silicon solid immersion lens JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Fletcher, D. A., Crozier, K. B., Guarini, K. W., Minne, S. C., Kino, G. S., Quate, C. F., Goodson, K. E. 2001; 10 (3): 450-459
  • Thermal conductivity of doped polysilicon layers JOURNAL OF MICROELECTROMECHANICAL SYSTEMS McConnell, A. D., Uma, S., Goodson, K. E. 2001; 10 (3): 360-369
  • Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC) OPTICAL ENGINEERING Zhou, P., Goodson, K. E. 2001; 40 (8): 1613-1620
  • Thermal characterization of Bi2Te3/Sb2Te3 superlattices JOURNAL OF APPLIED PHYSICS Touzelbaev, M. N., Zhou, P., Venkatasubramanian, R., Goodson, K. E. 2001; 90 (2): 763-767
  • Refraction contrast imaging with a scanning microlens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2001; 78 (23): 3589-3591
  • Measurement of ballistic phonon conduction near hotspots in silicon APPLIED PHYSICS LETTERS Sverdrup, P. G., Sinha, S., Asheghi, M., Uma, S., Goodson, K. E. 2001; 78 (21): 3331-3333
  • A deterministic methodology for prediction of fracture distribution in basaltic multiflows JOURNAL OF GEOPHYSICAL RESEARCH-SOLID EARTH Lore, J., Aydin, A., Goodson, K. E. 2001; 106 (B4): 6447-6459
  • Focusing in microlenses close to a wavelength in diameter OPTICS LETTERS Fletcher, D. A., Goodson, K. E., Kino, G. S. 2001; 26 (7): 399-401

    Abstract

    Light focused from air into a spherical microlens is affected by diffraction at the lens surface as its diameter approaches the wavelength of light. Through an extension of Mie theory, we show that a converging wave that is incident upon a Si microlens with a diameter less than approximately 4lambda creates a spot as much as 25% smaller than predicted with vector diffraction theory. Si microlenses only a wavelength in diameter are shown to be virtually insensitive to variations in the maximum illumination angle, and changes in index of refraction are not found to cause the proportional changes in spot size that would be expected from vector diffraction theory.

    View details for Web of Science ID 000167774200001

    View details for PubMedID 18040333

  • Atomic force microscope cantilevers for combined thermomechanical data writing and reading APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G. K., Vettiger, P. 2001; 78 (9): 1300-1302
  • Sub-continuum simulations of heat conduction in silicon-on-insulator transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sverdrup, P. G., Ju, Y. S., Goodson, K. E. 2001; 123 (1): 130-137
  • Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers International Journal of Thermophysics Uma, S., McConnell, A., D., Asheghi, M., Kurabayashi, K., Goodson, K., E. 2001; 22: 605-616
  • Study of boiling regimes and transient signal measurements in microchannels 11th International Conference on Solid-State Sensors and Actuators Zhang, L., Koo, J. M., Jiang, L. SPRINGER-VERLAG BERLIN. 2001: 1514–1517
  • Near-field infrared imaging with a microfabricated solid immersion lens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2000; 77 (14): 2109-2111
  • Millipede - An AFM Data Storage System at the Frontier of Nanotribology Tribology Letters Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M., I., Goodson, K. E. 2000; 9: 25-32
  • Microfabricated solid immersion lens with metal aperture IEEE/LEOS International Conference on Optical MEMS Fletcher, D. A., Simanovskii, D., Palanker, D., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, F. E. IEEE. 2000: 133–134
  • Thermomechanical diagnostics of BGA packages using digital image/speckle correlation 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Zhou, P., Goodson, K. IEEE. 2000: 240–245
  • "Millipede" - an AFM data storage system at the frontier of nanotribology International Conference on Nanotribology Durig, U., Cross, G., Despont, M., Drechsler, U., Haberle, W., Lutwyche, M. I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G. K., King, W. P., Goodson, K. E. SPRINGER/PLENUM PUBLISHERS. 2000: 25–32
  • Impact of molecular orientation on thermal conduction in spin-coated polyimide films JOURNAL OF APPLIED PHYSICS Kurabayashi, K., Goodson, K. E. 1999; 86 (4): 1925-1931
  • Intrinsic-carrier thermal runaway in silicon microcantilevers MICROSCALE THERMOPHYSICAL ENGINEERING Chui, B. W., Asheghi, M., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J. 1999; 3 (3): 217-228
  • Measurement of the thermal conductivity anisotropy in polyimide films JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Kurabayashi, K., Asheghi, M., Touzelbaev, M., Goodson, K. E. 1999; 8 (2): 180-191
  • Phonon scattering in silicon films with thickness of order 100 nm APPLIED PHYSICS LETTERS Ju, Y. S., Goodson, K. E. 1999; 74 (20): 3005-3007
  • Process-dependent thermal transport properties of silicon-dioxide films deposited using low-pressure chemical vapor deposition JOURNAL OF APPLIED PHYSICS Ju, Y. S., Goodson, K. E. 1999; 85 (10): 7130-7134
  • Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating THIN SOLID FILMS Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1999; 339 (1-2): 160-164
  • Heat conduction in novel electronic films ANNUAL REVIEW OF MATERIALS SCIENCE Goodson, K. E., Ju, Y. S. 1999; 29: 261-293
  • Phonon Scattering in Silicon Films of Thickness Below 100 nm Applied Physics Letters Ju, Y., S., Goodson, K., E. 1999; 74: 3005-3007
  • Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films Journal of Applied Physics Kurabayashi, K., Goodson, K., E. 1999; 86: 1925-1931
  • Transient liquid crystal thermometry of microfabricated PCR vessel arrays JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chaudhari, A. M., Woudenberg, T. M., Albin, M., Goodson, K. E. 1998; 7 (4): 345-355
  • Precision measurement and mapping of die-attach thermal resistance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A Kurabayashi, K., Goodson, K. E. 1998; 21 (3): 506-514
  • Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique 31st National Heat Transfer Conference Ju, Y. S., Goodson, K. E. ASME-AMER SOC MECHANICAL ENG. 1998: 306–13
  • Thermal characterization of IC passivation layers using Joule heating and optical thermometry MICROSCALE THERMOPHYSICAL ENGINEERING Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1998; 2 (2): 101-110
  • Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chui, B. W., Stowe, T. D., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J., Terris, B. D., Ried, R. P., Rugar, D. 1998; 7 (1): 69-78
  • Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries DIAMOND AND RELATED MATERIALS Touzelbaev, M. N., Goodson, K. E. 1998; 7 (1): 1-14
  • Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique ASME Journal of Heat Transfer Ju, Y., S., Goodson, K., E. 1998; 120: 306-313
  • Precision Measurement and Mapping of Die-Attach Thermal Resistance IEEE Transactions on Components, Packaging, and Manufacturing Technology Kurabayashi, K., Goodson, K., E. 1998; A21: 506-514
  • Thermal mapping of interconnects subjected to brief electrical stresses IEEE ELECTRON DEVICE LETTERS Ju, Y. S., Goodson, K. E. 1997; 18 (11): 512-514
  • Impact of nucleation density on thermal resistance near diamond-substrate boundaries JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER Touzelbaev, M. N., Goodson, K. E. 1997; 11 (4): 506-512
  • Phonon-boundary scattering in thin silicon layers APPLIED PHYSICS LETTERS Asheghi, M., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 71 (13): 1798-1800
  • Heating mechanisms of LDMOS and LIGBT in ultrathin SOI IEEE ELECTRON DEVICE LETTERS Leung, Y. K., Paul, A. K., Goodson, K. E., Plummer, J. D., Wong, S. S. 1997; 18 (9): 414-416
  • Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS Ju, Y. S., Goodson, K. E. 1997; 36 (6B): L798-L800
  • Short-timescale thermal mapping of semiconductor devices IEEE ELECTRON DEVICE LETTERS Ju, Y. S., KADING, O. W., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 18 (5): 169-171
  • Improved heat sinking for laser-diode arrays using microchannels in CVD diamond IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING Goodson, K. E., Kurabayashi, K., Pease, R. F. 1997; 20 (1): 104-109
  • Thermal conductivity measurements of interlevel dielectrics Symposium on Materials Reliability in Microelectronics, at the 1997 MRS Spring Meeting VARNER, E. B., Marieb, T., Mack, A. S., Lee, J., MEYER, W. K., Goodson, K. E. MATERIALS RESEARCH SOCIETY. 1997: 279–284
  • Thermal conduction in nonhomogeneous CVD diamond layers in electronic microstructures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E. 1996; 118 (2): 279-286
  • PREDICTION AND MEASUREMENT OF TEMPERATURE-FIELDS IN SILICON-ON-INSULATOR ELECTRONIC-CIRCUITS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1995; 117 (3): 574-581
  • THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES APPLIED PHYSICS LETTERS Goodson, K. E., KADING, O. W., Rosner, M., Zachai, R. 1995; 66 (23): 3134-3136
  • EXPERIMENTAL INVESTIGATION OF THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES JOURNAL OF APPLIED PHYSICS Goodson, K. E., KADING, O. W., Rosler, M., Zachai, R. 1995; 77 (4): 1385-1392
  • THERMAL CONDUCTION IN METALLIZED SILICON-DIOXIDE LAYERS ON SILICON APPLIED PHYSICS LETTERS KADING, O. W., SKURK, H., Goodson, K. E. 1994; 65 (13): 1629-1631
  • PREDICTION AND MEASUREMENT OF THE THERMAL-CONDUCTIVITY OF AMORPHOUS DIELECTRIC LAYERS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1994; 116 (2): 317-324
  • Measurement and Modeling of Self-Heating in SOI nMOSFETS IEEE Transactions on Electron Devices Su, L., T., Chung, J., E., Antoniadis, D., A., Goodson, K., E., Flik, M., I. 1994; 41: 69-75
  • MEASUREMENT AND MODELING OF SELF-HEATING IN SOI NMOSFETS IEEE TRANSACTIONS ON ELECTRON DEVICES Su, L. T., Chung, J. E., Antoniadis, D. A., Goodson, K. E., Flik, M. I. 1994; 41 (1): 69-75
  • Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits Thermal Science and Engineering Goodson, K., E., Flik, M., I. 1994; 2: 191-201
  • Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1994; 116: 317-324
  • Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon Applied Physics Letters Kading, O., W., Skurk, H., Goodson, K., E. 1994; 65: 1629-1631
  • Solid-Layer Thermal-Conductivity Measurement Techniques Applied Mechanics Reviews Goodson, K., E., Flik, M., I. 1994; 47: 101-112
  • INTRINSIC SUPERCONDUCTING RADIATION DETECTOR APPLIED PHYSICS LETTERS Flik, M. I., Zhang, Z. M., Goodson, K. E. 1993; 62 (22): 2862-2864
  • ELECTRON AND PHONON THERMAL CONDUCTION IN EPITAXIAL HIGH-TC SUPERCONDUCTING FILMS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I. 1993; 115 (1): 17-25
  • Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers IEEE Electron Device Letters Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1993; 14: 490-492
  • Intrinsic Superconducting Radiation Detector Applied Physics Letters Flik, M., I., Zhang, Z., Z., Goodson, K., E. 1993; 62: 2862-2864
  • Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I. 1993; 115: 17-25
  • EFFECT OF MICROSCALE THERMAL CONDUCTION ON THE PACKING LIMIT OF SILICON-ON-INSULATOR ELECTRONIC DEVICES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY Goodson, K. E., Flik, M. I. 1992; 15 (5): 715-722
  • ELECTRON-SCATTERING RATE IN EPITAXIAL YBA2CU3O7 SUPERCONDUCTING FILMS PHYSICAL REVIEW B Flik, M. I., Zhang, Z. M., Goodson, K. E., Siegal, M. P., Phillips, J. M. 1992; 46 (9): 5606-5614
  • HEAT-TRANSFER REGIMES IN MICROSTRUCTURES JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Flik, M. I., Choi, B. I., Goodson, K. E. 1992; 114 (3): 666-674
  • THERMAL-ANALYSIS OF ELECTRON-BEAM ABSORPTION IN LOW-TEMPERATURE SUPERCONDUCTING FILMS 3RD THERMAL ENGINEERING JOINT CONF OF THE AMERICAN SOC MECHANICAL ENGINEERS / JAPAN SOC MECHANICAL ENGINEERS : CONDUCTION, CRYOGENICS, MEASUREMENT TECHNIQUES Flik, M. I., Goodson, K. E. ASME-AMER SOC MECHANICAL ENG. 1992: 264–70
  • The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films Physical Review B Flik, M., I., Zhang, Z., M., Goodson, K., E., Siegal, M., P., Phillips, J., M. 1992; 46: 5606-5614
  • Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films ASME Journal of Heat Transfer Flik, M., I., Goodson, K., E. 1992; 114: 264-270