Bio


Ken Goodson is the Robert Bosch Chairman of the Stanford Mechanical Engineering Department. He is a heat transfer specialist with interests ranging from electronics cooling to vehicle waste heat recovery.

Goodson brings fundamental science to applications in heat management and energy conversion. His lab pioneered phonon free path measurements using silicon nanolayers and has highly-cited papers on diamond, carbon nanotubes, phase change memory, and two-phase microfluidics. He co-founded Cooligy, which developed heat sinks for the Apple G5 and was acquired by Emerson in 2006.

Goodson's 38 PhD alumni include 14 professors at Stanford, MIT, UC Berkeley, and other schools. He is a Fellow with ASME, IEEE, and AAAS. He received the Kraus Medal and the Thermi Award and delivered plenary lectures at ITHERM, InterPack, Therminic, SemiTherm and PHONONS. Goodson studied at MIT and worked with the materials group at DaimlerBenz.

Goodson sometimes appears as a baritone soloist with the Stanford Symphonic Chorus. His wife, Laura Dahl, is a member of the Stanford piano faculty.

Academic Appointments


Administrative Appointments


  • Robert Bosch Department Chair, Mechanical Engineering (2013 - Present)
  • Vice Chair, Mechanical Engineering (2008 - 2013)
  • Graduate Chair, Mechanical Engineering (2007 - 2008)
  • Admissions Chair, Mechanical Engineering (2005 - 2006)

Honors & Awards


  • Kraus Medal, ASME (2011)
  • Davies Family Provostial Chair, Stanford University (2014)
  • Fellow, ASME, IEEE, AAAS (2010, 2011, 2013)
  • THERMI Award, IEEE (2013)
  • Plenary Lectures, ITHERM, PHONONS, InterPack, Therminic, SemiTherm (2006-2013)
  • Best/Outstanding Paper, ITHERM, SemiTherm, IEDM (2012, 2001, 1992)
  • Dusinberre Lectureship, Penn State University (2010)
  • Golden/Outstanding Reviewer, IEEE, ASME (2010, 1999)
  • JSPS Visiting Professorship, Tokyo Institute of Technology (1996)
  • Young Investigator Award, Office of Naval Research (1996)
  • CAREER Award, National Science Foundation (1996)
  • Fellow in Voice, Tanglewood Music Festival (1990, 1991)
  • Graduate Fellowship, Office of Naval Research (1989-1992)
  • Luis Sudler Prize, MIT (1989)
  • Tau Beta Pi, Phi Beta Kappa, Burchard Scholar, MIT (1988, 1989)

Boards, Advisory Committees, Professional Organizations


  • Fellow, ASME, IEEE, AAAS (1990 - Present)
  • Chief Editor, Nanoscale & Microscale Thermophysical Engineering (2007 - 2012)
  • Associate Editor, Journal of Heat Transfer (2008 - 2012)
  • Member, Tau Beta Pi, Phi Beta Kappa, Sigma Xi (1989 - Present)

Professional Education


  • PhD, MIT, Mechanical Engineering (1993)
  • MS, MIT, Mechanical Engineering (1991)
  • BS, MIT, Humanities (Music) (1989)
  • BS, MIT, Mechanical Engineering (1989)

Patents


  • 34 ISSUED US PATENTS. "."
  • Hu, Jiang, Goodson. " Patent 7,504,453 Composite Thermal Interface Material Including Particles and Nanofibers", Jan 1, 2009
  • Goodson, Kenny, Santiago, et al. " Patent 6,942,018 Electroosmotic Microchannel Cooling System", Jan 1, 2005
  • Zachai, Gutheit, Goodson. " Patent 5,843,224 Composite Structure comprising a Semiconductor Layer arranged on a Diamond...", Jan 1, 1998

Current Research and Scholarly Interests


We study heat transfer in electronic nanostructures & packaging, microfluidic heat sinks, and thermoelectric & photonic energy conversion devices. Our focus is on fundamental transport phenomena including heat conduction physics and two phase convection. We interact extensively with semiconductor and energy companies.

Current projects include thermoelectric waste heat recovery for vehicles, self-powered sensor networks, and smart buildings. We also study electron and phonon conduction and energy conversion mechanisms in nanostructures including nanolayers and composites. We develop advanced thermal management strategies for the latest computers, tablets, and smart phones. Finally, we have several research initiatives that take high performance heat exchangers to their limits (beyond 50kW/cm2!) through novel phase separation strategies and 3D fluid routing.

Projects


  • Phonon Scattering and Confinement in Nanostructures (NSF)

    Location

    Stanford CA

    For More Information:

  • Phase Separation Microfluidic Cooling (DARPA, IBM)

    Location

    Stanford CA

    For More Information:

  • Thermoelectric Waste Heat Recovery for Vehicles (NSF, DOE, Bosch)

    Location

    Stanford CA

    For More Information:

  • Nanostructured Smart Phone Materials (SRC, Intel)

    Location

    Stanford CA

    For More Information:

  • Electron & Phonon Transport at Interfaces (AFOSR, Raytheon)

    Location

    Stanford CA

    For More Information:

  • Heat Exchangers Technologies for Steam Power Conversion (EPRI)

    Location

    Stanford CA

  • Microfluidic Cooling for Satellites beyond 30kW/cm2 (Boeing)

    Location

    Stanford, CA

    For More Information:

  • Thermoelectric Powered Smart Sensors (Analog Devices)

    Location

    Stanford, CA

    For More Information:

  • Nanostructured Vapor Chambers for Vehicle Technologies (Toyota)

    Location

    Stanford, CA

    For More Information:

2013-14 Courses


Journal Articles


  • Publication Overview: 180 Journal Articles, 275 Conference Papers, 32 Patents, 9 Book Chapters, 2 Books. 13700 Citations, H = 59 (Google Scholar). 7600 Citations, H = 45 (Web of Science) Goodson, K. E. 2015
  • Phonon Scattering in Strained Transition Layers for GaN Heteroepitaxy Physical Review B Cho, j., Li, Y., Hoke, W., Altman, D., Asheghi, M., Goodson, K. E. 2014; 89: 11
  • Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA Won, Y., Gao, Y., Panzer, M. A., Xiang, R., Maruyama, S., Kenny, T. W., Cai, W., Goodson, K. E. 2013; 110 (51): 20426-20430

    Abstract

    Reliably routing heat to and from conversion materials is a daunting challenge for a variety of innovative energy technologies--from thermal solar to automotive waste heat recovery systems--whose efficiencies degrade due to massive thermomechanical stresses at interfaces. This problem may soon be addressed by adhesives based on vertically aligned carbon nanotubes, which promise the revolutionary combination of high through-plane thermal conductivity and vanishing in-plane mechanical stiffness. Here, we report the data for the in-plane modulus of aligned single-walled carbon nanotube films using a microfabricated resonator method. Molecular simulations and electron microscopy identify the nanoscale mechanisms responsible for this property. The zipping and unzipping of adjacent nanotubes and the degree of alignment and entanglement are shown to govern the spatially varying local modulus, thereby providing the route to engineered materials with outstanding combinations of mechanical and thermal properties.

    View details for DOI 10.1073/pnas.1312253110

    View details for Web of Science ID 000328548600031

    View details for PubMedID 24309375

  • Thermal conduction phenomena in carbon nanotubes and related nanostructured materials REVIEWS OF MODERN PHYSICS Marconnet, A. M., Panzer, M. A., Goodson, K. E. 2013; 85 (3): 1295-1326
  • From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 135 (6)

    View details for DOI 10.1115/1.4023577

    View details for Web of Science ID 000326165000012

  • Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm NANO LETTERS Li, Z., Tan, S., Bozorg-Grayeli, E., Kodama, T., Asheghi, M., Delgado, G., Panzer, M., Pokrovsky, A., Wack, D., Goodson, K. E. 2012; 12 (6): 3121-3126

    Abstract

    Thermal conduction in periodic multilayer composites can be strongly influenced by nonequilibrium electron-phonon scattering for periods shorter than the relevant free paths. Here we argue that two additional mechanisms-quasiballistic phonon transport normal to the metal film and inelastic electron-interface scattering-can also impact conduction in metal/dielectric multilayers with a period below 10 nm. Measurements use the 3? method with six different bridge widths down to 50 nm to extract the in- and cross-plane effective conductivities of Mo/Si (2.8 nm/4.1 nm) multilayers, yielding 15.4 and 1.2 W/mK, respectively. The cross-plane thermal resistance is lower than can be predicted considering volume and interface scattering but is consistent with a new model built around a film-normal length scale for phonon-electron energy conversion in the metal. We introduce a criterion for the transition from electron to phonon dominated heat conduction in metal films bounded by dielectrics.

    View details for DOI 10.1021/nl300996r

    View details for Web of Science ID 000305106400078

    View details for PubMedID 22563928

  • Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness NANO LETTERS Yoneoka, S., Lee, J., Liger, M., Yama, G., Kodama, T., Gunji, M., Provine, J., Howe, R. T., Goodson, K. E., Kennyt, T. W. 2012; 12 (2): 683-686

    Abstract

    While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.

    View details for DOI 10.1021/nl203548w

    View details for Web of Science ID 000299967800026

    View details for PubMedID 22224582

  • Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER David, M. P., Miler, J., Steinbrenner, J. E., Yang, Y., Touzelbaev, M., Goodson, K. E. 2011; 54 (25-26): 5504-5516
  • Adiabatic and diabatic two-phase venting flow in a microchannel INTERNATIONAL JOURNAL OF MULTIPHASE FLOW David, M. P., Steinbrenner, J. E., Miler, J., Goodson, K. E. 2011; 37 (9): 1135-1146
  • Impact of channel geometry on two-phase flow in fuel cell microchannels JOURNAL OF POWER SOURCES Steinbrenner, J. E., Lee, E. S., Hidrovo, C. H., Eaton, J. K., Goodson, K. E. 2011; 196 (11): 5012-5020
  • Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density ACS NANO Marconnett, A. M., Yamamoto, N., Panzer, M. A., Wardle, B. L., Goodson, K. E. 2011; 5 (6): 4818-4825

    View details for DOI 10.1021/nn200847u

    View details for Web of Science ID 000292055200065

  • Phase Change Memory PROCEEDINGS OF THE IEEE Wong, H. P., Raoux, S., Kim, S., Liang, J., Reifenberg, J. P., Rajendran, B., Asheghi, M., Goodson, K. E. 2010; 98 (12): 2201-2227
  • Characterization of the wettability of thin nanostructured films in the presence of evaporation JOURNAL OF COLLOID AND INTERFACE SCIENCE Rogacs, A., Steinbrenner, J. E., Rowlette, J. A., Weisse, J. M., Zheng, X. L., Goodson, K. E. 2010; 349 (1): 354-360

    Abstract

    Vapor chambers using conventional porous membrane wicks offer limited heat transfer rates for a given thickness. This limitation can be addressed through wick nanostructuring, which promises high capillary pressures and precise control of the local porosity. This work develops a measurement technique for the wettability of nanostructured wicks based on optical imaging. Feasibility is demonstrated on a hydrophilic silicon nanowire array (SiNW) synthesized using the Vapor-Liquid-Solid (VLS) growth mechanism followed by surface plasma treatment. The wettability is determined by comparing the time-dependent liquid interface rise with a model that accounts for capillary, viscous, and gravitational forces and for evaporation. This model is demonstrated to be useful in extracting internal contact angle from thin ( approximately 10microm) porous films.

    View details for DOI 10.1016/j.jcis.2010.05.063

    View details for Web of Science ID 000279966700045

    View details for PubMedID 20579656

  • Nanofluid Convection in Microtubes JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Lee, J., Gharagozloo, P. E., Kolade, B., Eaton, J. K., Goodson, K. E. 2010; 132 (9)

    View details for DOI 10.1115/1.4001637

    View details for Web of Science ID 000279992300016

  • Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films PHYSICAL REVIEW B Rowlette, J. A., Kekatpure, R. D., Panzer, M. A., Brongersma, M. L., Goodson, K. E. 2009; 80 (4)
  • Heat Conduction through a DNA-Gold Composite NANO LETTERS Kodama, T., Jain, A., Goodson, K. E. 2009; 9 (5): 2005-2009

    Abstract

    This paper reports results from electrical and thermal conduction measurements carried out on the DNA-gold composite for which the overall conduction is shown to be dominated by the DNA rather than the discontinuous gold coatings. The electrical and thermal conductivities of the composite were about 14 S/cm and 150 W/(m K) at room temperature, respectively. The resulting value of 3.6 x 10(-4) W ohms/K(2) for the Lorentz number indicates that thermal transport in the DNA is phonon-dominated and that the molecular vibrations play a key role in both electrical and thermal conduction processes of DNA molecules.

    View details for DOI 10.1021/nl900272m

    View details for Web of Science ID 000266157100049

    View details for PubMedID 19435380

  • Ordering up the Minimum Thermal Conductivity of Solids SCIENCE Goodson, K. E. 2007; 315: 342-343
  • Heat generation and transport in nanometer-scale transistors PROCEEDINGS OF THE IEEE Pop, E., Sinha, S., Goodson, K. E. 2006; 94 (8): 1587-1601
  • Nanoscale Thermal Transport Applied Physics Reviews Cahill, D., G., Braun, P., V., Chen, G., Clarke, D., R., Goodson, K., E., Keblinski, P. 2014; 1: 011305
  • $ per W metrics for thermoelectric power generation: beyond ZT ENERGY & ENVIRONMENTAL SCIENCE Yee, S. K., LeBlanc, S., Goodson, K. E., Dames, C. 2013; 6 (9): 2561-2571

    View details for DOI 10.1039/c3ee41504j

    View details for Web of Science ID 000323198100001

  • High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices JOURNAL OF ELECTRONIC PACKAGING Touzelbaev, M. N., Miler, J., Yang, Y., Refai-Ahmed, G., Goodson, K. E. 2013; 135 (3)

    View details for DOI 10.1115/1.4024747

    View details for Web of Science ID 000326095800010

  • Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Gao, Y., Marconnet, A. M., Xiang, R., Maruyama, S., Goodson, K. E. 2013; 3 (9): 1524-1532
  • Phonon and electron transport through Ge2Sb2Te5 films and interfaces bounded by metals APPLIED PHYSICS LETTERS Lee, J., Bozorg-Grayeli, E., Kim, S., Asheghi, M., Wong, H. P., Goodson, K. E. 2013; 102 (19)

    View details for DOI 10.1063/1.4807141

    View details for Web of Science ID 000320440800035

  • Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T. I., Pate, B. B., Hobart, K., Goodson, K. E. 2013; 102 (11)

    View details for DOI 10.1063/1.4796168

    View details for Web of Science ID 000316544900032

  • Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module JOURNAL OF ELECTRONIC MATERIALS Barako, M. T., Park, W., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 42 (3): 372-381
  • Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E. 2013; 3 (1): 79-85
  • Electrothermal Modeling and Design Strategies for Multibit Phase-Change Memory IEEE TRANSACTIONS ON ELECTRON DEVICES Li, Z., Jeyasingh, R. G., Lee, J., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 59 (12): 3561-3567
  • Phonon Conduction in Periodically Porous Silicon Nanobridges NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Marconnet, A. M., Kodama, T., Asheghi, M., Goodson, K. E. 2012; 16 (4): 199-219
  • Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics JOURNAL OF APPLIED PHYSICS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2012; 112 (8)

    View details for DOI 10.1063/1.4759450

    View details for Web of Science ID 000310597500020

  • Thermal conductivity in porous silicon nanowire arrays NANOSCALE RESEARCH LETTERS Weisse, J. M., Marconnet, A. M., Kim, D. R., Rao, P. M., Panzer, M. A., Goodson, K. E., Zheng, X. 2012; 7

    Abstract

    The nanoscale features in silicon nanowires (SiNWs) can suppress phonon propagation and strongly reduce their thermal conductivities compared to the bulk value. This work measures the thermal conductivity along the axial direction of SiNW arrays with varying nanowire diameters, doping concentrations, surface roughness, and internal porosities using nanosecond transient thermoreflectance. For SiNWs with diameters larger than the phonon mean free path, porosity substantially reduces the thermal conductivity, yielding thermal conductivities as low as 1 W/m/K in highly porous SiNWs. However, when the SiNW diameter is below the phonon mean free path, both the internal porosity and the diameter significantly contribute to phonon scattering and lead to reduced thermal conductivity of the SiNWs.

    View details for DOI 10.1186/1556-276X-7-554

    View details for Web of Science ID 000311320400001

    View details for PubMedID 23039084

  • Nanoscale Manipulation, Heating, and Welding of Nanowires JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME LeBlanc, S., Swartzentruber, B., Martinez, J., Christoforo, G., Kodama, T., Goodson, K. E. 2012; 134 (8)
  • Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films CARBON Gao, Y., Kodama, T., Won, Y., Dogbe, S., Pan, L., Goodson, K. E. 2012; 50 (10): 3789-3798
  • Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness JOURNAL OF APPLIED PHYSICS Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E. 2012; 112 (1)

    View details for DOI 10.1063/1.4731252

    View details for Web of Science ID 000306513400151

  • Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling NANOTECHNOLOGY Lee, J., Asheghi, M., Goodson, K. E. 2012; 23 (20)

    Abstract

    The coupled transport of heat and electrical current, or thermoelectric phenomena, can strongly influence the temperature distribution and figures of merit for phase-change memory (PCM). This paper simulates PCM devices with careful attention to thermoelectric transport and the resulting impact on programming current during the reset operation. The electrothermal simulations consider Thomson heating within the phase-change material and Peltier heating at the electrode interface. Using representative values for the Thomson and Seebeck coefficients extracted from our past measurements of these properties, we predict a cell temperature increase of 44% and a decrease in the programming current of 16%. Scaling arguments indicate that the impact of thermoelectric phenomena becomes greater with smaller dimensions due to enhanced thermal confinement. This work estimates the scaling of this reduction in programming current as electrode contact areas are reduced down to 10 nm × 10 nm. Precise understanding of thermoelectric phenomena and their impact on device performance is a critical part of PCM design strategies.

    View details for DOI 10.1088/0957-4484/23/20/205201

    View details for Web of Science ID 000303531400004

    View details for PubMedID 22543873

  • Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness APPLIED PHYSICS LETTERS Won, Y., Lee, J., Asheghi, M., Kenny, T. W., Goodson, K. E. 2012; 100 (16)

    View details for DOI 10.1063/1.3699227

    View details for Web of Science ID 000303128500018

  • Electrothermal phenomena in zinc oxide nanowires and contacts APPLIED PHYSICS LETTERS LeBlanc, S., Phadke, S., Kodama, T., Salleo, A., Goodson, K. E. 2012; 100 (16)

    View details for DOI 10.1063/1.4703935

    View details for Web of Science ID 000303128500048

  • Low Thermal Resistances at GaN-SiC Interfaces for HEMT Technology IEEE ELECTRON DEVICE LETTERS Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., Goodson, K. E. 2012; 33 (3): 378-380
  • Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory JAPANESE JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, F., Goodson, K. E., Wong, H. P. 2012; 51 (2)
  • Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Lee, J., Kim, S., Marconnet, A., in't Zandt, M. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 21 (1): 4-6
  • Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators CARBON Won, Y., Gao, Y., Panzer, M. A., Dogbe, S., Pan, L., Kenny, T. W., Goodson, K. E. 2012; 50 (2): 347-355
  • Thermal conductivity and photoluminescence of light-emitting silicon nitride films APPLIED PHYSICS LETTERS Marconnet, A., Panzer, M., Yerci, S., Minissale, S., Wang, X., Zhang, X., Dal Negro, L., Goodson, K. E. 2012; 100 (5)

    View details for DOI 10.1063/1.3682508

    View details for Web of Science ID 000300065300023

  • Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness Journal of Applied Physics Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K., E. 2012; 112: 014902
  • High temperature thermal properties of thin tantalum nitride films APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2011; 99 (26)

    View details for DOI 10.1063/1.3672098

    View details for Web of Science ID 000298638500022

  • Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, G. A., Goodson, K. E., Wong, H. P. 2011; 110 (11)

    View details for DOI 10.1063/1.3667295

    View details for Web of Science ID 000298254800159

  • Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials IEEE ELECTRON DEVICE LETTERS Bozorg-Grayeli, E., Reifenberg, J. P., Panzer, M. A., Rowlette, J. A., Goodson, K. E. 2011; 32 (9): 1281-1283
  • Microthermal Stage for Electrothermal Characterization of Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H. P., Goodson, K. E. 2011; 32 (7): 952-954
  • Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Li, Z., Lee, J., Reifenberg, J. P., Asheghi, M., Jeyasingh, R. G., Wong, H. P., Goodson, K. E. 2011; 32 (7): 961-963
  • Thermal microdevices for biological and biomedical applications JOURNAL OF THERMAL BIOLOGY Jain, A., Goodson, K. E. 2011; 36 (4): 209-218
  • Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films JOURNAL OF APPLIED PHYSICS Lee, J., Li, Z., Reifenberg, J. P., Lee, S., Sinclair, R., Asheghi, M., Goodson, K. E. 2011; 109 (8)

    View details for DOI 10.1063/1.3573505

    View details for Web of Science ID 000290047000229

  • Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage IEEE TRANSACTIONS ON ELECTRON DEVICES Kim, S., Lee, B., Asheghi, M., Hurkx, F., Reifenberg, J. P., Goodson, K. E., Wong, H. P. 2011; 58 (3): 584-592
  • 3-D visualization of flow in microscale jet impingement systems INTERNATIONAL JOURNAL OF THERMAL SCIENCES Won, Y., Wang, E. N., Goodson, K. E., Kenny, T. W. 2011; 50 (3): 325-331
  • Thermal resistance between low-dimensional nanostructures and semi-infinite media (vol 103, 094301, 2008) JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2011; 109 (5)

    View details for DOI 10.1063/1.3558984

    View details for Web of Science ID 000288387900131

  • Temperature-dependent aggregation and diffusion in nanofluids INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Gharagozloo, P. E., Goodson, K. E. 2011; 54 (4): 797-806
  • Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory IEEE Electron Device Letters Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H.S., P., Goodson, K., E. 2011; 32: 952-954
  • Aggregate fractal dimensions and thermal conduction in nanofluids JOURNAL OF APPLIED PHYSICS Gharagozloo, P. E., Goodson, K. E. 2010; 108 (7)

    View details for DOI 10.1063/1.3481423

    View details for Web of Science ID 000283222200125

  • Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., David, M., Wang, F., Goodson, K. E. 2010; 36 (8): 608-619
  • Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films NANO LETTERS Panzer, M. A., Duong, H. M., Okawa, J., Shiomi, J., Wardle, B. L., Maruyama, S., Goodson, K. E. 2010; 10 (7): 2395-2400

    Abstract

    Interfaces dominate the thermal resistances in aligned carbon nanotube arrays. This work uses nanosecond thermoreflectance thermometry to separate interface and volume resistances for 10 microm thick aligned SWNT films coated with Al, Ti, Pd, Pt, and Ni. We interpret the data by defining the nanotube-metal engagement factor, which governs the interface resistance and is extracted using the measured film heat capacity. The metal-SWNT and SWNT-substrate resistances range between 3.8 and 9.2 mm(2)K/W and 33-46 mm(2)K/W, respectively. The temperature dependency of the heat capacity data, measured between 125 and 300 K, is in good agreement with theoretical predictions. The temperature dependence demonstrated by the metal-SWNT interface resistance data suggests inelastic phonon transmission.

    View details for DOI 10.1021/nl100443x

    View details for Web of Science ID 000280416200017

    View details for PubMedID 20503983

  • Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels JOURNAL OF MICROMECHANICS AND MICROENGINEERING Fang, C., Steinbrenner, J. E., Wang, F., Goodson, K. E. 2010; 20 (4)
  • Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel Frontiers of Heat and Mass Transfer Fang, C., David, M., Rogacs, A., Goodson, K., E. 2010; 1: 013002
  • Thermal Boundary Resistance Measurements for Phase-Change Memory Devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Chang, K., Panzer, M. A., Kim, S., Rowlette, J. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2010; 31 (1): 56-58
  • Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform SENSORS AND ACTUATORS B-CHEMICAL Jain, A., Ness, K., Goodson, K. E. 2009; 143 (1): 286-294
  • Bubble-Induced Water Hammer and Cavitation in Microchannel Flow Boiling JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Fogg, D. W., Goodson, K. E. 2009; 131 (12)

    View details for DOI 10.1115/1.3216381

    View details for Web of Science ID 000271905600007

  • Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films IEEE ELECTRON DEVICE LETTERS Panzer, M. A., Shandalov, M., Rowlette, J. A., Oshima, Y., Chen, Y. W., McIntyre, P. C., Goodson, K. E. 2009; 30 (12): 1269-1271
  • A benchmark study on the thermal conductivity of nanofluids JOURNAL OF APPLIED PHYSICS Buongiorno, J., Venerus, D. C., Prabhat, N., McKrell, T., Townsend, J., Christianson, R., Tolmachev, Y. V., Keblinski, P., Hu, L., Alvarado, J. L., Bang, I. C., Bishnoi, S. W., Bonetti, M., Botz, F., Cecere, A., Chang, Y., Chen, G., Chen, H., Chung, S. J., Chyu, M. K., Das, S. K., Di Paola, R., Ding, Y., Dubois, F., Dzido, G., Eapen, J., Escher, W., Funfschilling, D., Galand, Q., Gao, J., Gharagozloo, P. E., Goodson, K. E., Gutierrez, J. G., Hong, H., Horton, M., Hwang, K. S., Iorio, C. S., Jang, S. P., Jarzebski, A. B., Jiang, Y., Jin, L., Kabelac, S., Kamath, A., Kedzierski, M. A., Kieng, L. G., Kim, C., Kim, J., Kim, S., Lee, S. H., Leong, K. C., Manna, I., Michel, B., Ni, R., Patel, H. E., Philip, J., Poulikakos, D., Reynaud, C., Savino, R., Singh, P. K., Song, P., Sundararajan, T., Timofeeva, E., Tritcak, T., Turanov, A. N., Van Vaerenbergh, S., Wen, D., Witharana, S., Yang, C., Yeh, W., Zhao, X., Zhou, S. 2009; 106 (9)

    View details for DOI 10.1063/1.3245330

    View details for Web of Science ID 000272555700090

  • Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance IEEE TRANSACTIONS ON ADVANCED PACKAGING Pettes, A. M., Hodes, M. S., Goodson, K. E. 2009; 32 (2): 423-430
  • Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Kolade, B., Goodson, K. E., Eaton, J. K. 2009; 131 (5)

    View details for DOI 10.1115/1.3013831

    View details for Web of Science ID 000264374400011

  • Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling EXPERIMENTS IN FLUIDS Fogg, D., David, M., Goodson, K. E. 2009; 46 (4): 725-736
  • Multimode thermoelastic dissipation JOURNAL OF APPLIED PHYSICS Chandorkar, S. A., Candler, R. N., Duwel, A., Melamud, R., Agarwal, M., Goodson, K. E., Kenny, T. W. 2009; 105 (4)

    View details for DOI 10.1063/1.3072682

    View details for Web of Science ID 000263803300018

  • FLOW REGIME EVOLUTION IN LONG, SERPENTINE MICROCHANNELS WITH A POROUS CARBON PAPER WALL IMECE 2008: HEAT TRANSFER, FLUID FLOWS, AND THERMAL SYSTEMS, VOL 10, PTS A-C Steinbrenner, J. E., Lee, E. S., Wang, F., Fang, C., Hidrovo, C. H., Goodson, K. E. 2009: 773-781
  • THERMOELECTRIC HEAT RECOVERY FROM A TANKLESS WATER HEATING SYSTEM IMECE 2008: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2008, VOL 8 LeBlanc, S. A., Gao, Y., Goodson, K. E. 2009: 131-137
  • Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films NVMTS: 2009 10TH ANNUAL NON-VOLATILE MEMORY TECHNOLOGY SYMPOSIUM Lee, J., Reifenberg, J. P., Li, Z., Hom, L., Asheghi, M., Kim, S., Wong, H. P., Goodson, K. E. 2009: 52-57
  • Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3 omega method INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW Oh, D., Jain, A., Eaton, J. K., Goodson, K. E., Lee, J. S. 2008; 29 (5): 1456-1461
  • Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3 omega method JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Jain, A., Goodson, K. E. 2008; 130 (10)

    View details for DOI 10.1115/1.2945904

    View details for Web of Science ID 000259854000011

  • The impact of thermal boundary resistance in phase-change memory devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Kencke, D. L., Goodson, K. E. 2008; 29 (10): 1112-1114
  • Diffusion, aggregation, and the thermal conductivity of nanofluids APPLIED PHYSICS LETTERS Gharagozloo, P. E., Eaton, J. K., Goodson, K. E. 2008; 93 (10)

    View details for DOI 10.1063/1.2977868

    View details for Web of Science ID 000259797000084

  • Investigation of the natural convection boundary condition in microfabricated structures INTERNATIONAL JOURNAL OF THERMAL SCIENCES Hu, X. J., Jain, A., Goodson, K. E. 2008; 47 (7): 820-824
  • 3-D numerical simulation of contact angle hysteresis for microscale two phase flow INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., Hidrovo, C., Wang, F., Eaton, J., Goodson, K. E. 2008; 34 (7): 690-705
  • Thermal resistance between low-dimensional nanostructures and semi-infinite media JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2008; 103 (9)

    View details for DOI 10.1063/1.2903519

    View details for Web of Science ID 000255983200119

  • Thermal properties of metal-coated vertically aligned single-wall nanotube arrays JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Panzer, M. A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., Goodson, K. E. 2008; 130 (5)

    View details for DOI 10.1115/1.2885159

    View details for Web of Science ID 000255880300006

  • Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs IEEE TRANSACTIONS ON ELECTRON DEVICES Rowlette, J. A., Goodson, K. E. 2008; 55 (1): 220-232
  • Thermomechanical formation of nanoscale polymer indents with a heated silicon tip JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME King, W. P., Goodson, K. E. 2007; 129 (11): 1600-1604

    View details for DOI 10.1115/1.2764088

    View details for Web of Science ID 000251725700015

  • Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films APPLIED PHYSICS LETTERS Reifenberg, J. P., Panzer, M. A., Kim, S., Gibby, A. M., Zhang, Y., Wong, S., Wong, H. P., Pop, E., Goodson, K. E. 2007; 91 (11)

    View details for DOI 10.1063/1.2784169

    View details for Web of Science ID 000249474000022

  • Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates JOURNAL OF APPLIED PHYSICS Pop, E., Mann, D. A., Goodson, K. E., Dai, H. 2007; 101 (9)

    View details for DOI 10.1063/1.2717855

    View details for Web of Science ID 000246567900049

  • Materials science. Ordering up the minimum thermal conductivity of solids. Science Goodson, K. E. 2007; 315 (5810): 342-343

    View details for PubMedID 17234938

  • Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays ASME Journal of Heat Transfer Hu, X., Panzer, M., A., Goodson, K., E. 2007; 129: 91-93
  • Non-equilibrium phonon distributions in sub-100 nm silicon transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sinha, S., Pop, E., DUTTON, R. W., Goodson, K. E. 2006; 128 (7): 638-647

    View details for DOI 10.1115/1.2194041

    View details for Web of Science ID 000239047600003

  • A hybrid method for bubble geometry reconstruction in two-phase microchannels EXPERIMENTS IN FLUIDS Wang, E. N., Devasenathipathy, S., Lin, H., Hidrovo, C. H., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2006; 40 (6): 847-858
  • Two-phase microfluidics for semiconductor circuits and fuel cells HEAT TRANSFER ENGINEERING Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, E., Steinbrenner, J. E., Koo, J. M., Wang, F. M., Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C. H., Kenny, T. W., Eaton, J. K., Goodson, K. E. 2006; 27 (4): 53-63
  • 3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon ASME Journal of Heat Transfer Hu, X., Padilla, A., A., Xu, J., Fisher, T., A., Goodson, K., E. 2006; 128: 1109-1113
  • Thermal conductance of an individual single-wall carbon nanotube above room temperature NANO LETTERS Pop, E., Mann, D., Wang, Q., Goodson, K. E., Dai, H. J. 2006; 6 (1): 96-100

    Abstract

    The thermal properties of a suspended metallic single-wall carbon nanotube (SWNT) are extracted from its high-bias (I-V) electrical characteristics over the 300-800 K temperature range, achieved by Joule self-heating. The thermal conductance is approximately 2.4 nW/K, and the thermal conductivity is nearly 3500 Wm(-1)K(-1) at room temperature for a SWNT of length 2.6 mum and diameter 1.7 nm. A subtle decrease in thermal conductivity steeper than 1/T is observed at the upper end of the temperature range, which is attributed to second-order three-phonon scattering between two acoustic modes and one optical mode. We discuss sources of uncertainty and propose a simple analytical model for the SWNT thermal conductivity including length and temperature dependence.

    View details for DOI 10.1021/nl052145f

    View details for Web of Science ID 000235532400018

    View details for PubMedID 16402794

  • Electro-thermal transport in silicon and carbon nanotube devices NONEQUILIBRIUM CARRIER DYNAMICS IN SEMICONDUCTORS PROCEEDINGS Pop, E., Mann, D., ROWLETTE, J., Goodson, K., Dai, H. 2006; 110: 195-199
  • Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes Journal of Physical Chemistry B Mann, D., Pop, E., Cao, J., Wang, Q., Goodson, K., E., Dai, H. 2006; 110: 1502-1505
  • Scaling analysis of multilevel interconnect temperatures for high-performance ICs IEEE TRANSACTIONS ON ELECTRON DEVICES Im, S., Srivastava, N., Banerjee, K., Goodson, K. E. 2005; 52 (12): 2710-2719
  • Negative differential conductance and hot phonons in suspended nanotube molecular wires PHYSICAL REVIEW LETTERS Pop, E., Mann, D., Cao, J., Wang, Q., Goodson, K. E., Dai, H. J. 2005; 95 (15)

    Abstract

    Freely suspended metallic single-walled carbon nanotubes (SWNTs) exhibit reduced current carrying ability compared to those lying on substrates, and striking negative differential conductance at low electric fields. Theoretical analysis reveals significant self-heating effects including electron scattering by hot nonequilibrium optical phonons. Electron transport characteristics under strong self-heating are exploited for the first time to probe the thermal conductivity of individual SWNTs (approximately 3600 W m-1 K-1 at T=300 K) up to approximately 700 K, and reveal a 1/T dependence expected for umklapp phonon scattering at high temperatures.

    View details for DOI 10.1103/PhysRevLett.95.155505

    View details for Web of Science ID 000232443400039

    View details for PubMedID 16241738

  • Phase change phenomena in silicon microchannels INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Zhang, L. A., Wang, E. N., Goodson, K. E., Kenny, T. W. 2005; 48 (8): 1572-1582
  • Monte Carlo simulation of Joule heating in bulk and strained silicon APPLIED PHYSICS LETTERS Pop, E., DUTTON, R. W., Goodson, K. E. 2005; 86 (8)

    View details for DOI 10.1063/1.1870106

    View details for Web of Science ID 000227609000032

  • Scattering of g-process longitudinal optical phonons at hotspots in silicon JOURNAL OF APPLIED PHYSICS Sinha, S., Schelling, P. K., Phillpot, S. R., Goodson, K. E. 2005; 97 (2)

    View details for DOI 10.1063/1.1831549

    View details for Web of Science ID 000226700500049

  • Bond line thickness of thermal interface materials with carbon nanotubes ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C Singaravelu, S. A., Hu, X., Goodson, K. E. 2005: 379-383
  • Review: Multiscale thermal modeling in nanoelectronics INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING Sinha, S., Goodson, K. E. 2005; 3 (1): 107-133
  • Thermal Conduction in Silicon Micro and Nanostructures Annual Review of Heat Transfer McConnell, A., D., Goodson, K., E. 2005; 14: 129-168
  • Managing Heat for Electronics Materials Today Shelling, P., Li, S., Goodson, K., E. 2005; 6: 30-35
  • Measurement of thermophysical properties of thin film shape memory alloys using the 3-omega method MICRO-ELECTRO-MECHANICAL SYSTEMS - 2005 Jain, A., Goodson, K. E. 2005; 7: 537-541
  • Micromachined jets for liquid impingement cooling of VLSI chips (vol 13, pg 833, 2004) JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (6): 1072-1072
  • Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion JOURNAL OF APPLIED PHYSICS Pop, E., DUTTON, R. W., Goodson, K. E. 2004; 96 (9): 4998-5005

    View details for DOI 10.1063/1.1788838

    View details for Web of Science ID 000224799300042

  • Micromachined jets for liquid impingement cooling of VLSI chips JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (5): 833-842
  • Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E. 2004; 85 (11): 2086-2088

    View details for DOI 10.1063/1.1787160

    View details for Web of Science ID 000223923300073

  • Nucleation and growth of vapor bubbles in a heated silicon microchannel JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Wang, E. N., Devasenathipathy, S., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2004; 126 (4): 497-497
  • Convectively driven polymerase chain reaction thermal cycler ANALYTICAL CHEMISTRY Wheeler, E. K., Benett, W., Stratton, P., Richards, J., Chen, A., Christian, A., Ness, K. D., Ortega, J., Li, L. G., Weisgraber, T. H., Goodson, K. E., Milanovich, F. 2004; 76 (14): 4011-4016

    Abstract

    We have fabricated a low-cost disposable polymerase chain reaction thermal chamber that uses buoyancy forces to move the sample solution between the different temperatures necessary for amplification. Three-dimensional, unsteady finite element modeling and a simpler 1-D steady-state model are used together with digital particle image velocimetry data to characterize the flow within the device. Biological samples have been amplified using this novel thermal chamber. Time for amplification is less than 30 min. More importantly, an analysis of the energy consumption shows significant improvements over current technology.

    View details for DOI 10.1021/ac034941g

    View details for Web of Science ID 000222706400018

    View details for PubMedID 15253636

  • Thermal microscopy with a microfabricated solid immersion lens MICROSCALE THERMOPHYSICAL ENGINEERING Fletcher, D. A., Kino, G. S., Goodson, K. E. 2003; 7 (4): 267-273
  • Special Issue on emerging technologies - Foreword IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Amon, C. H., Goodson, K. E., Luo, G. Q. 2003; 26 (2): 307-308
  • Nanoscale thermal transport JOURNAL OF APPLIED PHYSICS Cahill, D. G., FORD, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., Phillpot, S. R. 2003; 93 (2): 793-818

    View details for DOI 10.1063/1.1524305

    View details for Web of Science ID 000180134200001

  • Detailed heat generation simulations via the Monte Carlo method 2003 IEEE INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES Pop, E., Dutton, R., Goodson, K. 2003: 121-124
  • Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) - 2003 Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K. 2003: 251-257
  • Thermal conductivity model for nearly pure and doped thin silicon layers at high temperatures ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003 Asheghi, M., Goodson, K. E. 2003: 847-853
  • Closed-loop cooling technologies for microprocessors 2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST Upadhya, G., Zhou, P., Goodson, K., Munch, M., Kenny, T. 2003: 775-778
  • Thermal analysis of ultra-thin body device scaling 2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST Pop, E., Dutton, R., Goodson, K. 2003: 883-886
  • Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation JOURNAL OF MICROELECTROMECHANICAL SYSTEMS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G. L., Despont, M., Durig, U. T., Rothuizen, H., Binnig, G., Vettiger, P. 2002; 11 (6): 765-774
  • Thermal conduction in doped single-crystal silicon films JOURNAL OF APPLIED PHYSICS Asheghi, M., Kurabayashi, K., Kasnavi, R., Goodson, K. E. 2002; 91 (8): 5079-5088

    View details for DOI 10.1063/1.1458057

    View details for Web of Science ID 000174666600047

  • Thermometry and thermal transport in micro/nanoscale solid-state devices and structures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cahill, D. G., Goodson, K. E., Majumdar, A. 2002; 124 (2): 223-241

    View details for DOI 10.1115/1.1454111

    View details for Web of Science ID 000175917200002

  • Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Zhang, L., Koo, J. M., Jiang, L., Asheghi, M., Goodson, K. E., Santiago, J. G., Kenny, T. W. 2002; 11 (1): 12-19
  • Modeling resist heating in mask fabrication using a multilayer Green's function approach. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVI, PTS 1 & 2 CHU, D. C., Pease, R. F., Goodson, K. E. 2002; 4689: 206-212
  • Electroosmotic Microchannel Cooling System for Microprocessors Electronics Cooling Goodson, K., E., Santiago, J., G., Kenny, T., Jiang, L., Zeng, S., Koo, J., M. 2002; 8: 46-47
  • Transient and sub-atmospheric performance of a closed-loop electroosmotic microchannel cooling system THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS Jiang, L., Mikkelsen, J., Koo, J. M., Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., Kenny, T., Goodson, K. E., Maveety, J., Prasher, R., Benning, S. 2002: 133-139
  • Microfabricated silicon solid immersion lens JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Fletcher, D. A., Crozier, K. B., Guarini, K. W., Minne, S. C., Kino, G. S., Quate, C. F., Goodson, K. E. 2001; 10 (3): 450-459
  • Thermal conductivity of doped polysilicon layers JOURNAL OF MICROELECTROMECHANICAL SYSTEMS McConnell, A. D., Uma, S., Goodson, K. E. 2001; 10 (3): 360-369
  • Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC) OPTICAL ENGINEERING Zhou, P., Goodson, K. E. 2001; 40 (8): 1613-1620
  • Thermal characterization of Bi2Te3/Sb2Te3 superlattices JOURNAL OF APPLIED PHYSICS Touzelbaev, M. N., Zhou, P., Venkatasubramanian, R., Goodson, K. E. 2001; 90 (2): 763-767
  • Refraction contrast imaging with a scanning microlens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2001; 78 (23): 3589-3591
  • Measurement of ballistic phonon conduction near hotspots in silicon APPLIED PHYSICS LETTERS Sverdrup, P. G., Sinha, S., Asheghi, M., Uma, S., Goodson, K. E. 2001; 78 (21): 3331-3333
  • A deterministic methodology for prediction of fracture distribution in basaltic multiflows JOURNAL OF GEOPHYSICAL RESEARCH-SOLID EARTH Lore, J., Aydin, A., Goodson, K. E. 2001; 106 (B4): 6447-6459
  • Focusing in microlenses close to a wavelength in diameter OPTICS LETTERS Fletcher, D. A., Goodson, K. E., Kino, G. S. 2001; 26 (7): 399-401

    Abstract

    Light focused from air into a spherical microlens is affected by diffraction at the lens surface as its diameter approaches the wavelength of light. Through an extension of Mie theory, we show that a converging wave that is incident upon a Si microlens with a diameter less than approximately 4lambda creates a spot as much as 25% smaller than predicted with vector diffraction theory. Si microlenses only a wavelength in diameter are shown to be virtually insensitive to variations in the maximum illumination angle, and changes in index of refraction are not found to cause the proportional changes in spot size that would be expected from vector diffraction theory.

    View details for Web of Science ID 000167774200001

    View details for PubMedID 18040333

  • Atomic force microscope cantilevers for combined thermomechanical data writing and reading APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G. K., Vettiger, P. 2001; 78 (9): 1300-1302
  • Sub-continuum simulations of heat conduction in silicon-on-insulator transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sverdrup, P. G., Ju, Y. S., Goodson, K. E. 2001; 123 (1): 130-137
  • Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers International Journal of Thermophysics Uma, S., McConnell, A., D., Asheghi, M., Kurabayashi, K., Goodson, K., E. 2001; 22: 605-616
  • Near-field infrared imaging with a microfabricated solid immersion lens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2000; 77 (14): 2109-2111
  • Millipede - An AFM Data Storage System at the Frontier of Nanotribology Tribology Letters Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M., I., Goodson, K. E. 2000; 9: 25-32
  • "Millipede" - an AFM data storage system at the frontier of nanotribology TRIBOLOGY LETTERS Durig, U., Cross, G., Despont, M., Drechsler, U., Haberle, W., Lutwyche, M. I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G. K., King, W. P., Goodson, K. E. 2000; 9 (1-2): 25-32
  • Impact of molecular orientation on thermal conduction in spin-coated polyimide films JOURNAL OF APPLIED PHYSICS Kurabayashi, K., Goodson, K. E. 1999; 86 (4): 1925-1931
  • Intrinsic-carrier thermal runaway in silicon microcantilevers MICROSCALE THERMOPHYSICAL ENGINEERING Chui, B. W., Asheghi, M., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J. 1999; 3 (3): 217-228
  • Measurement of the thermal conductivity anisotropy in polyimide films JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Kurabayashi, K., Asheghi, M., Touzelbaev, M., Goodson, K. E. 1999; 8 (2): 180-191
  • Process-dependent thermal transport properties of silicon-dioxide films deposited using low-pressure chemical vapor deposition JOURNAL OF APPLIED PHYSICS Ju, Y. S., Goodson, K. E. 1999; 85 (10): 7130-7134
  • Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating THIN SOLID FILMS Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1999; 339 (1-2): 160-164
  • Heat conduction in novel electronic films ANNUAL REVIEW OF MATERIALS SCIENCE Goodson, K. E., Ju, Y. S. 1999; 29: 261-293
  • Phonon Scattering in Silicon Films of Thickness Below 100 nm Applied Physics Letters Ju, Y., S., Goodson, K., E. 1999; 74: 3005-3007
  • Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films Journal of Applied Physics Kurabayashi, K., Goodson, K., E. 1999; 86: 1925-1931
  • Transient liquid crystal thermometry of microfabricated PCR vessel arrays JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chaudhari, A. M., Woudenberg, T. M., Albin, M., Goodson, K. E. 1998; 7 (4): 345-355
  • Precision measurement and mapping of die-attach thermal resistance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A Kurabayashi, K., Goodson, K. E. 1998; 21 (3): 506-514
  • Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Ju, Y. S., Goodson, K. E. 1998; 120 (2): 306-313
  • Thermal characterization of IC passivation layers using Joule heating and optical thermometry MICROSCALE THERMOPHYSICAL ENGINEERING Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1998; 2 (2): 101-110
  • Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chui, B. W., Stowe, T. D., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J., Terris, B. D., Ried, R. P., Rugar, D. 1998; 7 (1): 69-78
  • Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries DIAMOND AND RELATED MATERIALS Touzelbaev, M. N., Goodson, K. E. 1998; 7 (1): 1-14
  • Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique ASME Journal of Heat Transfer Ju, Y., S., Goodson, K., E. 1998; 120: 306-313
  • Precision Measurement and Mapping of Die-Attach Thermal Resistance IEEE Transactions on Components, Packaging, and Manufacturing Technology Kurabayashi, K., Goodson, K., E. 1998; A21: 506-514
  • Thermal mapping of interconnects subjected to brief electrical stresses IEEE ELECTRON DEVICE LETTERS Ju, Y. S., Goodson, K. E. 1997; 18 (11): 512-514
  • Impact of nucleation density on thermal resistance near diamond-substrate boundaries JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER Touzelbaev, M. N., Goodson, K. E. 1997; 11 (4): 506-512
  • Phonon-boundary scattering in thin silicon layers APPLIED PHYSICS LETTERS Asheghi, M., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 71 (13): 1798-1800
  • Heating mechanisms of LDMOS and LIGBT in ultrathin SOI IEEE ELECTRON DEVICE LETTERS Leung, Y. K., Paul, A. K., Goodson, K. E., Plummer, J. D., Wong, S. S. 1997; 18 (9): 414-416
  • Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS Ju, Y. S., Goodson, K. E. 1997; 36 (6B): L798-L800
  • Short-timescale thermal mapping of semiconductor devices IEEE ELECTRON DEVICE LETTERS Ju, Y. S., KADING, O. W., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 18 (5): 169-171
  • Improved heat sinking for laser-diode arrays using microchannels in CVD diamond IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING Goodson, K. E., Kurabayashi, K., Pease, R. F. 1997; 20 (1): 104-109
  • Thermal conduction in nonhomogeneous CVD diamond layers in electronic microstructures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E. 1996; 118 (2): 279-286
  • PREDICTION AND MEASUREMENT OF TEMPERATURE-FIELDS IN SILICON-ON-INSULATOR ELECTRONIC-CIRCUITS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1995; 117 (3): 574-581
  • THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES APPLIED PHYSICS LETTERS Goodson, K. E., KADING, O. W., Rosner, M., Zachai, R. 1995; 66 (23): 3134-3136
  • EXPERIMENTAL INVESTIGATION OF THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES JOURNAL OF APPLIED PHYSICS Goodson, K. E., KADING, O. W., Rosler, M., Zachai, R. 1995; 77 (4): 1385-1392
  • THERMAL CONDUCTION IN METALLIZED SILICON-DIOXIDE LAYERS ON SILICON APPLIED PHYSICS LETTERS KADING, O. W., SKURK, H., Goodson, K. E. 1994; 65 (13): 1629-1631
  • PREDICTION AND MEASUREMENT OF THE THERMAL-CONDUCTIVITY OF AMORPHOUS DIELECTRIC LAYERS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1994; 116 (2): 317-324
  • Measurement and Modeling of Self-Heating in SOI nMOSFETS IEEE Transactions on Electron Devices Su, L., T., Chung, J., E., Antoniadis, D., A., Goodson, K., E., Flik, M., I. 1994; 41: 69-75
  • MEASUREMENT AND MODELING OF SELF-HEATING IN SOI NMOSFETS IEEE TRANSACTIONS ON ELECTRON DEVICES Su, L. T., Chung, J. E., Antoniadis, D. A., Goodson, K. E., Flik, M. I. 1994; 41 (1): 69-75
  • Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits Thermal Science and Engineering Goodson, K., E., Flik, M., I. 1994; 2: 191-201
  • Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1994; 116: 317-324
  • Solid-Layer Thermal-Conductivity Measurement Techniques Applied Mechanics Reviews Goodson, K., E., Flik, M., I. 1994; 47: 101-112
  • Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon Applied Physics Letters Kading, O., W., Skurk, H., Goodson, K., E. 1994; 65: 1629-1631
  • INTRINSIC SUPERCONDUCTING RADIATION DETECTOR APPLIED PHYSICS LETTERS Flik, M. I., Zhang, Z. M., Goodson, K. E. 1993; 62 (22): 2862-2864
  • ELECTRON AND PHONON THERMAL CONDUCTION IN EPITAXIAL HIGH-TC SUPERCONDUCTING FILMS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I. 1993; 115 (1): 17-25
  • Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers IEEE Electron Device Letters Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1993; 14: 490-492
  • Intrinsic Superconducting Radiation Detector Applied Physics Letters Flik, M., I., Zhang, Z., Z., Goodson, K., E. 1993; 62: 2862-2864
  • Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I. 1993; 115: 17-25
  • EFFECT OF MICROSCALE THERMAL CONDUCTION ON THE PACKING LIMIT OF SILICON-ON-INSULATOR ELECTRONIC DEVICES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY Goodson, K. E., Flik, M. I. 1992; 15 (5): 715-722
  • HEAT-TRANSFER REGIMES IN MICROSTRUCTURES JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Flik, M. I., Choi, B. I., Goodson, K. E. 1992; 114 (3): 666-674
  • THERMAL-ANALYSIS OF ELECTRON-BEAM ABSORPTION IN LOW-TEMPERATURE SUPERCONDUCTING FILMS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Flik, M. I., Goodson, K. E. 1992; 114 (1): 264-270
  • The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films Physical Review B Flik, M., I., Zhang, Z., M., Goodson, K., E., Siegal, M., P., Phillips, J., M. 1992; 46: 5606-5614
  • Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films ASME Journal of Heat Transfer Flik, M., I., Goodson, K., E. 1992; 114: 264-270

Presentations


  • Thermal Management at the Extremes (Plenary at SEMITHERM 2013)

    Plenary Talk at SEMITHERM 2013

    Time Period

    March 21, 2013

    Location

    San Jose CA

    For More Information:

  • Phonons in Nanoelectronics (Opening Plenary at PHONONS 2012)

    Opening Plenary at Phonons 2012

    Time Period

    July 8, 2012

    Presented To

    International Conference on Phonon Scattering in Condensed Matter (Phonons)

    Location

    Ann Arbor, Michigan

    For More Information:

  • Thermal, Mechanical, and Photonic Property Relationships in Nanostructured Materials (Keynote at IMECE 2012)

    Keynote Address for the Symposium on Multiphysics Simulations and Experiments for Solids, ASME Annual Meeting (IMECE), November, 2012

    Time Period

    November 15, 2012

    Presented To

    Symposium Keynote at ASME IMECE 2012

    Location

    Houston, Texas

    For More Information: